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1. 发明授权

US06746320B2 Linear reciprocating disposable belt polishing method and apparatus 失效
标题翻译：线性往复式一次性皮带抛光方法和装置
公开(公告)号：US06746320B2
公开(公告)日：2004-06-08
申请号：US10136600
申请日：2002-04-30
申请人： Wilbur Krusell , Glenn Travis , Erik Engdahl , James Bagley
发明人： Wilbur Krusell , Glenn Travis , Erik Engdahl , James Bagley
IPC分类号： B24B2100
CPC分类号： B24B37/245 , B24B21/04 , B24B37/26
摘要： An apparatus for chemically mechanically planarizing a semiconductor wafer is disclosed having a continuous polishing strip with first side having a fixed abrasive surface and a second side opposite the first side. In one embodiment, a first drive roller holds a first end of the polishing strip, a second drive roller holds a second end of the polishing strip, and a pair of support rollers contacts the second side of the polishing strip on either end of a polishing strip support. A drive motor is operably connected to the first and second drive rollers for moving the polishing strip in a linear, bi-directional manner.
摘要翻译：公开了一种用于化学机械平面化半导体晶片的设备，其具有连续的抛光带，第一侧具有固定的研磨表面和与第一侧相对的第二侧。在一个实施例中，第一驱动辊保持抛光条的第一端，第二驱动辊保持抛光条的第二端，并且一对支撑辊在抛光的任一端接触抛光条的第二侧带支撑。驱动马达可操作地连接到第一和第二驱动辊，用于以线性双向的方式移动抛光条。

2. 发明授权

US06261959B1 Method and apparatus for chemically-mechanically polishing semiconductor wafers 失效
标题翻译：用于化学机械抛光半导体晶片的方法和装置
公开(公告)号：US06261959B1
公开(公告)日：2001-07-17
申请号：US09540385
申请日：2000-03-31
申请人： Glenn Travis , Christopher Pena
发明人： Glenn Travis , Christopher Pena
IPC分类号： H01L2100
CPC分类号： B24B37/245 , B24B41/005
摘要： An apparatus for chemically-mechanically polishing a semiconductor wafer comprises a receiving surface attached with a frame; a loading mechanism in contact with the receiving surface, the loading mechanism being configured to load measured portions of a wafer-polishing member containing a fixed abrasive onto the receiving surface; a reciprocation device attached with at least a portion of the receiving surface, the reciprocation device being powered to move the receiving surface in a linear, bi-directional motion; and a wafer holder positioned to releasably hold a wafer adjacent to the receiving surface. Methods of chemically-mechanically polishing semiconductor wafers are also provided.
摘要翻译：一种用于化学机械抛光半导体晶片的设备包括：附接有框架的接收表面; 与接收表面接触的装载机构，所述装载机构构造成将包含固定磨料的晶片抛光构件的测量部分加载到所述接收表面上; 附接有所述接收表面的至少一部分的往复运动装置，所述往复运动装置被驱动以使所述接收表面以线性的双向运动移动; 以及定位成将晶片可靠地保持在与接收表面相邻的晶片保持架。还提供了化学机械研磨半导体晶片的方法。

3. 发明授权

US06500056B1 Linear reciprocating disposable belt polishing method and apparatus 失效
公开(公告)号：US06500056B1
公开(公告)日：2002-12-31
申请号：US09607727
申请日：2000-06-30
申请人： Wilbur Krusell , Glenn Travis , Erik Engdahl , James Bagley
发明人： Wilbur Krusell , Glenn Travis , Erik Engdahl , James Bagley
IPC分类号： B24B2100
CPC分类号： B24B37/245 , B24B21/04 , B24B37/26
摘要： An apparatus for chemically mechanically planarizing a semiconductor wafer is disclosed having a continuous polishing strip with first side having a fixed abrasive surface and a second side opposite the first side. In one embodiment, a first drive roller holds a first end of the polishing strip, a second drive roller holds a second end of the polishing strip, and a pair of support rollers contacts the second side of the polishing strip on either end of a polishing strip support. A drive motor is operably connected to the first and second drive rollers for moving the polishing strip in a linear, bi-directional manner.

4. 发明授权

US06428394B1 Method and apparatus for chemical mechanical planarization and polishing of semiconductor wafers using a continuous polishing member feed 失效
标题翻译：使用连续抛光构件进料的半导体晶片的化学机械平面化和抛光的方法和装置
公开(公告)号：US06428394B1
公开(公告)日：2002-08-06
申请号：US09541144
申请日：2000-03-31
申请人： Ben Mooring , Wilbur Krusell , Glenn Travis , Erik Engdahl
发明人： Ben Mooring , Wilbur Krusell , Glenn Travis , Erik Engdahl
IPC分类号： B24B100
CPC分类号： B24B37/24 , B24B21/04 , B24B37/245
摘要： A method and apparatus are disclosed for chemically-mechanically polishing and planarizing semiconductors. An apparatus includes first and second rollers connected by a tension belt. A polishing member is releasably attached to the first and second rollers. A method includes clamping a first portion of a continuous strip of polishing member to a first roller, clamping a second portion of the continuous strip to a second roller, applying a tension to the continuous strip and rotationally reciprocating the rollers while pressing a semiconductor wafer against the continuous strip.
摘要翻译：公开了用于化学机械抛光和平面化半导体的方法和装置。一种装置包括通过张紧带连接的第一和第二辊。抛光构件可释放地附接到第一和第二辊。一种方法包括：将第一部分的抛光构件的连续条夹持到第一辊上，将连续条带的第二部分夹紧到第二辊上，向连续条施加张力，并在将半导体晶片压在一起的同时旋转地往复运动连续条。

5. 发明授权

US06425812B1 Polishing head for chemical mechanical polishing using linear planarization technology 失效
标题翻译：抛光头采用线性平面化技术进行化学机械抛光
公开(公告)号：US06425812B1
公开(公告)日：2002-07-30
申请号：US09475543
申请日：1999-12-30
申请人： Anil K. Pant , Douglas W. Young , Glenn Travis , Konstantin Volodarsky , Andrew Nagengast
发明人： Anil K. Pant , Douglas W. Young , Glenn Travis , Konstantin Volodarsky , Andrew Nagengast
IPC分类号： B24B722
CPC分类号： B24B37/30
摘要： A polishing head for performing chemical-mechanical polishing on a linear polisher has a flexible diaphragm coupling between a wafer carrier and a support housing which houses the wafer carrier. The diaphragm allows the carrier to move-substantially in the vertical direction within the housing, but a center shaft assembly limits movement in the horizontal direction.
摘要翻译：用于在线性抛光机上进行化学机械抛光的抛光头具有在晶片载体和容纳晶片载体的支撑壳体之间的柔性膜片联接。隔膜允许载体基本上在壳体内沿垂直方向移动，但是中心轴组件限制了在水平方向上的移动。

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