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    • 3. 发明授权
    • Capillary proximity heads for single wafer cleaning and drying
    • 用于单片清洁和干燥的毛细管接近头
    • US06488040B1
    • 2002-12-03
    • US09608244
    • 2000-06-30
    • John Martin de LariosMike RavkinGlen TravisJim KellerWilbur Krusell
    • John Martin de LariosMike RavkinGlen TravisJim KellerWilbur Krusell
    • B08B300
    • H01L21/67051B08B3/04H01L21/67028H01L21/67034Y10S134/902
    • A wafer cleaner and dryer to be used in wafer manufacturing operations is provided. The wafer cleaner and dryer has a proximity head which moves toward a wafer surface to complete either a cleaning or a drying operation. The proximity head includes a plurality of source inlets where the plurality of source inlets generates a first pressure on a fluid film present on the wafer surface when the proximity head is in a first position that is close to the wafer surface. The proximity head also contains a plurality of source outlets which introduces a second pressure on the fluid film present on the wafer surface when the proximity head is in the first position. The first pressure generated by the plurality of source inlets is greater than the second pressure created by the plurality of source outlets so as to create a pressure difference where the pressure difference causes removal of the fluid film from the wafer surface.
    • 提供了用于晶片制造操作的晶片清洁器和干燥器。 晶片清洁器和干燥器具有朝向晶片表面移动以完成清洁或干燥操作的接近头。 邻近头部包括多个源入口,其中当邻近头处于靠近晶片表面的第一位置时,多个源入口在存在于晶片表面上的流体膜上产生第一压力。 邻近头还包含多个源极出口,当邻近头处于第一位置时,该出口在晶片表面上存在的流体膜上引入第二压力。 由多个源入口产生的第一压力大于由多个源出口产生的第二压力,从而产生压力差,其中压力差导致流体膜从晶片表面移除。