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    • 7. 发明授权
    • Simplified graded LDD transistor using controlled polysilicon gate profile
    • 使用受控多晶硅栅极配置的简化分级LDD晶体管
    • US06274443B1
    • 2001-08-14
    • US09162116
    • 1998-09-28
    • Allen S. YuPatrick K. CheungPaul J. Steffan
    • Allen S. YuPatrick K. CheungPaul J. Steffan
    • H01L21336
    • H01L29/66598H01L21/266H01L21/28123H01L21/823814H01L29/665H01L29/6659
    • An ultra-large scale CMOS integrated circuit semiconductor device with LDD structures having gradual doping profiles and reduced process complexity is manufactured by forming a gate oxide layer over the semiconductor substrate; forming a polysilicon layer over the gate oxide layer; forming a first mask layer over the polysilicon layer; patterning and etching the first mask layer to form a first gate mask; anisotropically etching the polysilicon layer to form a first polysilicon gate, wherein the first polysilicon gate has sidewalls with sloped profiles and the sloped profiles are used as masks during the ion implantation of the LDD structures to space the resultant LDD structures away from the edges of second polysilicon gates to be formed subsequently with substantially vertical profiles. Since the LDD structures are spaced away from the edges of the second polysilicon gates, the lateral diffusion of the LDD structures into the channel due to rapid thermal annealing is reduced.
    • 通过在半导体衬底上形成栅氧化层,制造具有逐渐掺杂分布和降低工艺复杂度的LDD结构的超大规模CMOS集成电路半导体器件; 在所述栅极氧化物层上形成多晶硅层; 在所述多晶硅层上形成第一掩模层; 图案化和蚀刻第一掩模层以形成第一栅极掩模; 各向异性地蚀刻所述多晶硅层以形成第一多晶硅栅极,其中所述第一多晶硅栅极具有具有倾斜轮廓的侧壁,并且所述倾斜轮廓在所述LDD结构的离子注入期间用作掩模,以使所得到的LDD结构远离所述第二多晶硅的边缘 随后将形成具有基本垂直轮廓的多晶硅栅极。 由于LDD结构与第二多晶硅栅极的边缘间隔开,所以LDD结构由于快速热退火而向沟道中的横向扩散减小。