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1. 发明申请

US20060139450A1 System, method and apparatus for in-situ substrate inspection 失效
公开(公告)号：US20060139450A1
公开(公告)日：2006-06-29
申请号：US11016022
申请日：2004-12-17
申请人： Aleksander Owczarz , Jaroslaw Winniczek , Luai Nasser , Alan Schoepp , Fred Redeker , Erik Edelberg
发明人： Aleksander Owczarz , Jaroslaw Winniczek , Luai Nasser , Alan Schoepp , Fred Redeker , Erik Edelberg
IPC分类号： H04N7/18 , H04N9/47
CPC分类号： G01N21/9501 , G01N2021/8822
摘要： A system for inspecting a substrate includes a camera and a light source. The camera is oriented toward a field of view. The field of view encompasses at least a first portion of a first surface of the substrate. The light source is oriented toward the field of view at a first angle β relative to the first surface of the substrate. A method for inspecting a substrate is also included.

2. 发明授权

US07542134B2 System, method and apparatus for in-situ substrate inspection 有权
标题翻译：用于原位底物检查的系统，方法和装置
公开(公告)号：US07542134B2
公开(公告)日：2009-06-02
申请号：US12131909
申请日：2008-06-02
申请人： Aleksander Owczarz , Jaroslaw W. Winniczek , Luai Nasser , Alan Schoepp , Fred C. Redeker , Erik Edelberg
发明人： Aleksander Owczarz , Jaroslaw W. Winniczek , Luai Nasser , Alan Schoepp , Fred C. Redeker , Erik Edelberg
IPC分类号： G01N21/00
CPC分类号： G01N21/9501 , G01N2021/8822
摘要： A system for inspecting a substrate includes a camera and a light source. The camera is oriented toward a field of view. The field of view encompasses at least a first portion of a first surface of the substrate. The light source is oriented toward the field of view at a first angle β relative to the first surface of the substrate. A method for inspecting a substrate is also included.
摘要翻译：用于检查基板的系统包括照相机和光源。相机朝向视场。该视场包括该基板的第一表面的至少第一部分。光源相对于衬底的第一表面以第一角度β朝向视场定向。也包括检查基板的方法。

3. 发明申请

US20080273195A1 SYSTEM, METHOD AND APPARATUS FOR IN-SITU SUBSTRATE INSPECTION 有权
标题翻译：用于现场基板检查的系统，方法和装置
公开(公告)号：US20080273195A1
公开(公告)日：2008-11-06
申请号：US12131909
申请日：2008-06-02
申请人： Aleksander Owczarz , Jaroslaw W. Winniczek , Luai Nasser , Alan Schoepp , Fred C. Redeker , Erik Edelberg
发明人： Aleksander Owczarz , Jaroslaw W. Winniczek , Luai Nasser , Alan Schoepp , Fred C. Redeker , Erik Edelberg
IPC分类号： G01N21/00 , H01L21/66
CPC分类号： G01N21/9501 , G01N2021/8822
摘要： A system for inspecting a substrate includes a camera and a light source. The camera is oriented toward a field of view. The field of view encompasses at least a first portion of a first surface of the substrate. The light source is oriented toward the field of view at a first angle β relative to the first surface of the substrate. A method for inspecting a substrate is also included.
摘要翻译：用于检查基板的系统包括照相机和光源。相机朝向视场。该视场包括该基板的第一表面的至少第一部分。光源相对于衬底的第一表面以第一角度β朝向视场定向。也包括检查基板的方法。

4. 发明授权

US07397555B2 System, method and apparatus for in-situ substrate inspection 失效
标题翻译：用于原位底物检查的系统，方法和装置
公开(公告)号：US07397555B2
公开(公告)日：2008-07-08
申请号：US11016022
申请日：2004-12-17
申请人： Aleksander Owczarz , Jaroslaw W. Winniczek , Luai Nasser , Alan Schoepp , Fred C. Redeker , Erik Edelberg
发明人： Aleksander Owczarz , Jaroslaw W. Winniczek , Luai Nasser , Alan Schoepp , Fred C. Redeker , Erik Edelberg
IPC分类号： G01N21/00
CPC分类号： G01N21/9501 , G01N2021/8822
摘要： A system for inspecting a substrate includes a camera and a light source. The camera is oriented toward a field of view. The field of view encompasses at least a first portion of a first surface of the substrate. The light source is oriented toward the field of view at a first angle β relative to the first surface of the substrate. A method for inspecting a substrate is also included.
摘要翻译：用于检查基板的系统包括照相机和光源。相机朝向视场。该视场包括该基板的第一表面的至少第一部分。光源相对于衬底的第一表面以第一角度β朝向视场定向。也包括检查基板的方法。

5. 发明申请

US20060219361A1 High strip rate downstream chamber 有权
公开(公告)号：US20060219361A1
公开(公告)日：2006-10-05
申请号：US11096820
申请日：2005-04-01
申请人： Ing-Yann Wang , Jaroslaw Winniczek , David Cooperberg , Erik Edelberg , Robert Chebi
发明人： Ing-Yann Wang , Jaroslaw Winniczek , David Cooperberg , Erik Edelberg , Robert Chebi
IPC分类号： H01L21/306 , C03C25/68
CPC分类号： H01J37/32449 , H01J37/32357 , H01J37/3244 , Y10T137/0318 , Y10T137/85938
摘要： A gas chamber contains upper and lower chamber bodies forming a cavity, a heating chuck for a wafer, a remote gas source, and an exhaust unit. Gas is injected into the cavity through channels in an injector. Each channel has sections that are bent with respect to each other at a sufficient angle to substantially eliminate entering light rays entering the channel from exiting the channel without reflection. The channels have funnel-shaped nozzles at end points proximate to the chuck. The injector also has thermal expansion relief slots and small gaps between the injector and mating surfaces of the chamber and gas source. The temperature of the injector is controlled by a cooling liquid in cooling channels and electrical heaters in receptacles of the injector. The upper chamber body is funnel-shaped and curves downward at an end of the upper chamber body proximate to the chuck.

6. 发明申请

US20060228889A1 Methods of removing resist from substrates in resist stripping chambers 审中-公开
标题翻译：在抗蚀剂剥离室中从基材去除抗蚀剂的方法
公开(公告)号：US20060228889A1
公开(公告)日：2006-10-12
申请号：US11094689
申请日：2005-03-31
申请人： Erik Edelberg , Gladys Lo , Jack Kuo
发明人： Erik Edelberg , Gladys Lo , Jack Kuo
IPC分类号： C23F1/00 , H01L21/302
CPC分类号： H01L21/31138 , G03F7/427 , H01J37/32192 , H01J2237/3342
摘要： Methods for stripping resist from a semiconductor substrate in a resist stripping chamber are provided. The methods include producing a remote plasma containing reactive species and cooling the reactive species inside the chamber prior to removing the resist with the reactive species. The reactive species can be cooled by being passed through a thermally-conductive gas distribution member. By cooling the reactive species, damage to a low-k dielectric material on the substrate can be avoided.
摘要翻译：提供了在抗蚀剂剥离室中从半导体衬底剥离抗蚀剂的方法。所述方法包括在用反应性物质除去抗蚀剂之前，产生包含反应性物质的远程等离子体并冷却腔室内的反应物质。反应性物质可以通过通过导热气体分配构件而被冷却。通过冷却反应性物质，可以避免对基底上的低k介电材料的损坏。

7. 发明申请

US20060201911A1 Methods of etching photoresist on substrates 审中-公开
公开(公告)号：US20060201911A1
公开(公告)日：2006-09-14
申请号：US11429959
申请日：2006-05-09
申请人： Erik Edelberg , Robert Chebi , Gladys Lo
发明人： Erik Edelberg , Robert Chebi , Gladys Lo
IPC分类号： C23F1/00
CPC分类号： H01L21/31138 , G03F7/427
摘要： Methods of etching a carbon-rich layer on organic photoresist overlying an inorganic layer can utilize a process gas including CxHyFz, where y≧x and z≧0, and one or more optional components to generate a plasma effective to etch the carbon-rich layer with low removal of the inorganic layer. The carbon-rich layer can be removed in the same processing chamber, or alternatively can be removed in a different processing chamber, as used to remove the bulk photoresist.

8. 发明授权

US07204934B1 Method for planarization etch with in-situ monitoring by interferometry prior to recess etch 有权
标题翻译：在凹陷蚀刻之前用干涉测量法进行原位监测的平面蚀刻方法
公开(公告)号：US07204934B1
公开(公告)日：2007-04-17
申请号：US10002676
申请日：2001-10-31
申请人： Linda Braly , Vahid Vahedi , Erik Edelberg , Alan Miller
发明人： Linda Braly , Vahid Vahedi , Erik Edelberg , Alan Miller
IPC分类号： H01L21/66 , G01L21/30
CPC分类号： H01L21/7684 , H01L21/32115 , H01L21/32137 , H01L21/763
摘要： A method for processing recess etch operations in substrates is provided including forming a hard mask over the substrate and etching a trench in the substrate using the hard mask, and forming a dielectric layer over the hard mask and in the trench, where the dielectric layer lines the trench. A conductive material is then applied over the dielectric layer such that a blanket of the conductive material lies over the hard mask and fills the trench, and the conductive material is etched to substantially planarize the conductive material. The etching of the conductive material triggers an endpoint just before all of the conductive material is removed from over the dielectric layer that overlies the bard mask. The conductive material is recess etched to remove the conductive material over the dielectric layer that overlies the hard mask and removes at least part of the conductive material from within the trench.
摘要翻译：提供了一种用于在衬底中处理凹陷蚀刻操作的方法，包括在衬底上形成硬掩模并使用硬掩模蚀刻衬底中的沟槽，以及在硬掩模和沟槽中形成电介质层，其中电介质层线沟渠。然后将导电材料施加在介电层上，使得导电材料的覆盖层位于硬掩模上方并填充沟槽，并且蚀刻导电材料以使导电材料基本上平坦化。导电材料的蚀刻恰好在所有的导电材料从覆盖在吟诵掩模上的电介质层上除去之前触发端点。导电材料被凹入蚀刻以去除覆盖在硬掩模上的电介质层上的导电材料，并从沟槽内去除至少一部分导电材料。

9. 发明申请

US20070026677A1 Method for plasma etching performance enhancement 有权
标题翻译：等离子体蚀刻性能提高的方法
公开(公告)号：US20070026677A1
公开(公告)日：2007-02-01
申请号：US11508725
申请日：2006-08-22
申请人： Bing Ji , Erik Edelberg , Takumi Yanagawa , Zhisong Huang , Lumin Li
发明人： Bing Ji , Erik Edelberg , Takumi Yanagawa , Zhisong Huang , Lumin Li
IPC分类号： H01L21/302
CPC分类号： H01L21/31144 , H01L21/0337
摘要： A method for etching features in a dielectric layer is provided. A mask is formed over the dielectric layer. A protective silicon-containing coating is formed on exposed surfaces of the mask. The features are etched through the mask and protective silicon-containing coating. The features may be partially etched before the protective silicon-containing coating is formed.
摘要翻译：提供了一种用于蚀刻介电层中的特征的方法。在电介质层上形成掩模。在掩模的暴露表面上形成保护性含硅涂层。通过掩模和保护性含硅涂层蚀刻特征。在形成保护性含硅涂层之前，可以部分蚀刻特征。

10. 发明申请

US20060051965A1 Methods of etching photoresist on substrates 审中-公开
标题翻译：在基板上蚀刻光刻胶的方法
公开(公告)号：US20060051965A1
公开(公告)日：2006-03-09
申请号：US10934697
申请日：2004-09-07
申请人： Erik Edelberg , Robert Chebi , Alex Panchula
发明人： Erik Edelberg , Robert Chebi , Alex Panchula
IPC分类号： H01L21/461 , H01L21/302
CPC分类号： G03F7/40 , G03F7/427 , H01L21/31138
摘要： Methods of etching a carbon-rich layer on organic photoresist overlying an inorganic layer can utilize a process gas including a fluorine-containing gas, an oxygen-containing gas, and a hydrocarbon gas, and one or more optional components to generate a plasma effective to etch the carbon-rich layer with low removal of the inorganic layer. The carbon-rich layer can be removed in the same processing chamber, or alternatively can be removed in a different processing chamber, as used to remove the bulk photoresist.
摘要翻译：在覆盖无机层的有机光致抗蚀剂上蚀刻富碳层的方法可以利用包括含氟气体，含氧气体和烃气体的工艺气体以及一种或多种任选的组分来产生有效的等离子体用无机层的低去除蚀刻富碳层。富碳层可以在相同的处理室中除去，或者可以在不同的处理室中除去，以用于去除体光致抗蚀剂。

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