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    • 10. 发明授权
    • Method of polishing a ceramic substrate
    • 抛光陶瓷基板的方法
    • US06500052B2
    • 2002-12-31
    • US09964997
    • 2001-09-26
    • Masuhiro NatsuharaHirohiko NakataMotoyuki TanakaYasuhisa Yushio
    • Masuhiro NatsuharaHirohiko NakataMotoyuki TanakaYasuhisa Yushio
    • B24B100
    • B24B29/00B24B7/22G03G15/2053Y10T428/24355Y10T428/24413Y10T428/2495Y10T428/24967Y10T428/26Y10T428/266Y10T428/268
    • The circumferential edge portion of a ductile rotating body containing abrasive grains is used to polish the surface of a ceramic substrate. The angle &thgr; formed between the polishing direction D0 of the ceramic substrate and the rotating direction D1, of the rotating body is set in the range from 10° to 80° for the polishing step. Alternatively, the polishing process is divided into at least two steps. and the average grain size of abrasive grains is reduced stepwise in the successive steps of the polishing process. According to this method, the surface of a large-area and thin ceramic substrate can be polished without damage, and a smooth polished ceramic surface can be provided. This method is particularly suitable for polishing a ceramic substrate having a thickness of at most 2.0 mm, and the resulting polished ceramic substrate is suitable for a ceramic heater in a thermal fixation device for fixing a toner image.
    • 含有磨粒的韧性旋转体的圆周边缘部分用于抛光陶瓷基体的表面。 在研磨步骤中,将陶瓷基板的研磨方向D0与旋转体的旋转方向D1之间形成的角度θ设定在10°〜80°的范围内。 或者,将抛光处理分为至少两个步骤。 在研磨过程的连续步骤中,磨粒的平均粒径逐步降低。 根据该方法,可以在不损坏的情况下抛光大面积且薄的陶瓷基板的表面,并且可以提供光滑的抛光陶瓷表面。 该方法特别适合于研磨厚度至多为2.0mm的陶瓷基板,所得到的抛光陶瓷基板适用于用于定影调色剂图像的热固定装置中的陶瓷加热器。