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    • 5. 发明申请
    • IMAGE PICKUP MODULE AND CAMERA
    • 图像拾取模块和摄像机
    • US20120044415A1
    • 2012-02-23
    • US13212935
    • 2011-08-18
    • Koji TsudukiShin HasegawaTadashi KosakaYasuhiro MatsukiTakanori SuzukiAkiya Nakayama
    • Koji TsudukiShin HasegawaTadashi KosakaYasuhiro MatsukiTakanori SuzukiAkiya Nakayama
    • H04N5/225H01L27/146
    • H01L27/14618H01L27/14636H01L2224/13H04N5/2253
    • An image pickup module includes a cover member, an image pickup device chip including photodiodes, a fixing member which is arranged around the image pickup device chip and which connects the cover member and the image pickup device chip together, a rewiring substrate arranged on the side opposite to the cover member of the image pickup device chip, connection members for connecting the image pickup device chip with the rewiring substrate, and a space surrounded by the cover member, the image pickup device chip, and the fixing member. The image pickup device chip includes a semiconductor substrate. The semiconductor substrate includes through-hole electrodes penetrating the substrate. When an area corresponding to the fixing member in the orthogonal projection of the image pickup module with respect to the cover module is defined as a fixed area, the through-hole electrodes and the connection members are arranged in the fixed area.
    • 图像拾取模块包括盖构件,包括光电二极管的图像拾取装置芯片,布置在图像拾取装置芯片周围并将盖构件和图像拾取装置芯片连接在一起的固定构件,布置在侧面的重新布线基板 与图像拾取装置芯片的盖构件相对的连接构件,用于将图像拾取装置芯片与重新布线基板连接的连接构件以及由盖构件,图像拾取装置芯片和固定构件包围的空间。 图像拾取器件芯片包括半导体衬底。 半导体衬底包括穿透衬底的通孔电极。 当将图像拾取模块相对于盖模块的正交投影中的固定构件对应的区域定义为固定区域时,通孔电极和连接构件布置在固定区域中。
    • 6. 发明申请
    • SOLID-STATE IMAGE PICKUP DEVICE AND IMAGE PICKUP DEVICE
    • 固态图像拾取器件和图像拾取器件
    • US20110205414A1
    • 2011-08-25
    • US13033376
    • 2011-02-23
    • Katsuhisa MochidukiTakanori SuzukiFujio Ito
    • Katsuhisa MochidukiTakanori SuzukiFujio Ito
    • H04N5/335H01L31/0203
    • H01L27/14618H01L2924/0002H04N5/335H01L2924/00
    • A solid-state image pickup device including: a resin package which includes a recessed section; a solid-state image pickup element disposed in the recessed section; and a cover fixed to the recessed section via a fixing member so as to cover the solid-state image pickup element, wherein: the resin package includes a substrate integrated therewith; the substrate includes a first protruding section, a second protruding section and a branched section, the first and second protruding sections protruding from a first side of the resin package, and the branched section being disposed inside the resin package and disposed between the first and second protruding sections; and an outer peripheral section of the fixing member is disposed inside an end of the branched section when seen from the direction in which light is incident.
    • 一种固态摄像装置,包括:树脂封装,其包括凹部; 设置在所述凹部中的固态图像拾取元件; 以及通过固定构件固定到所述凹部的盖,以覆盖所述固态图像拾取元件,其中:所述树脂封装包括与其一体化的基板; 所述基板包括第一突出部分,第二突出部分和分支部分,所述第一和第二突出部分从所述树脂封装的第一侧突出,并且所述分支部分设置在所述树脂封装内部并且设置在所述第一和第二突出部分之间 突出部分 并且当从光入射的方向观察时,所述固定构件的外周部设置在所述分支部的端部的内侧。
    • 7. 发明申请
    • JOINING METHOD FOR METAL MEMBERS
    • 金属成员接合方法
    • US20100264199A1
    • 2010-10-21
    • US12799066
    • 2010-04-16
    • Taisei WakisakaTakanori SuzukiTokuji Okumura
    • Taisei WakisakaTakanori SuzukiTokuji Okumura
    • B23K1/20
    • B23K1/19B23K35/282B23K2103/20
    • The present invention provides a joining method for metal members, including: preparing an Fe-based metal member of Fe-based material, and an Al-based metal member of Al-based material; providing a Zn-based brazing filler metal between the Fe-based metal member and the Al-based metal member; and joining the Fe-based metal member and the Al-based metal member, wherein the Zn-based brazing filler metal includes: 2.0 mass % or less of Al; and the balance of Zn and inevitable impurities, and in the joining, the Zn-based brazing filler metal is heated such that a liquid phase of the Zn-based brazing filler metal is generated, and in solidification of the Zn-based brazing filler metal in a condition of the liquid phase, Zn primary crystal or eutectic of Zn and Al is crystallized.
    • 本发明提供一种金属构件的接合方法,包括:制备Fe基材料的Fe基金属构件和Al基材料的Al基金属构件; 在Fe基金属构件和Al基金属构件之间提供Zn基钎料; 并且接合Fe基金属构件和Al基金属构件,其中所述Zn基钎料包括:2.0质量%以下的Al; 并且Zn和不可避免的杂质的平衡,并且在接合时,加热Zn基钎料,使得Zn系钎料的液相产生,并且在Zn系钎焊金属 在液相状态下,Zn原子晶或Zn和Al的共晶结晶化。
    • 10. 发明申请
    • Process for Production of Cumene Hydroperoxide
    • 枯烯氢过氧化物生产工艺
    • US20070260093A1
    • 2007-11-08
    • US10591439
    • 2005-03-03
    • Keiji KumaTakanori Suzuki
    • Keiji KumaTakanori Suzuki
    • C07C409/10
    • B01J4/001B01J4/002B01J19/26C07C37/08C07C407/00C07C409/10C07C39/04
    • A process for continuous production of cumene hydroperoxide comprising liquid phase oxidation of cumene in a reactor in the presence of an oxygen-containing gas under such conditions that an oxygen content of the total oxygen-containing gas volume fed into the liquid phase in the reactor is adjusted to not less than 22 mol % and not more than 50 mol %, and (1) the cumene hydroperoxide production per unit volume of the reaction fluid in the reactor is not less than 22 kg/m3/hr, (2) an oxygen content of an exhaust gas of the reactor is not less than 2 mol % and not more than 10 mol % or (3) said oxygen-containing gas is fed into the reactor using a sparger whose aperture pitch is at least twice the aperture diameter. By use of the process, CHP production per unit volume of reaction fluid in the reactor can be enhanced, thus the process is capable of miniaturizing the reactor allowing required CHP production or enhancing CHP production in an existing reactor.
    • 一种连续生产异丙基氢过氧化物的方法,包括在含氧气体存在下,在反应器中反应生成异丙基苯的液相氧化,使得在反应器中进入液相的总含氧气体体积的氧含量为 调整为22摩尔%以上且50摩尔%以下,(1)反应器中的每单位体积的反应液的异丙苯过氧化物的产生量为22kg / m 3以上 /小时,(2)反应器的废气的氧含量为2摩尔%以上且10摩尔%以下,或者,(3)使用孔径节距的喷雾器将所述含氧气体进料到反应器中 是孔直径的至少两倍。 通过使用该方法,可以提高反应器中每单位体积反应流体的CHP生产量,因此该方法能够使反应器小型化,从而使现有反应器中需要的CHP生产或增强CHP生产。