专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08823872B2 Image pickup module with improved flatness of image sensor and via electrodes 有权
标题翻译：图像拾取模块，具有改善图像传感器和通孔电极的平面度
公开(公告)号：US08823872B2
公开(公告)日：2014-09-02
申请号：US13212935
申请日：2011-08-18
申请人： Koji Tsuduki , Shin Hasegawa , Tadashi Kosaka , Yasuhiro Matsuki , Takanori Suzuki , Akiya Nakayama
发明人： Koji Tsuduki , Shin Hasegawa , Tadashi Kosaka , Yasuhiro Matsuki , Takanori Suzuki , Akiya Nakayama
IPC分类号： H04N5/225
CPC分类号： H01L27/14618 , H01L27/14636 , H01L2224/13 , H04N5/2253
摘要： An image pickup module includes a cover member, an image pickup device chip including photodiodes, a fixing member which is arranged around the image pickup device chip and which connects the cover member and the image pickup device chip together, a rewiring substrate arranged on the side opposite to the cover member of the image pickup device chip, connection members for connecting the image pickup device chip with the rewiring substrate, and a space surrounded by the cover member, the image pickup device chip, and the fixing member. The image pickup device chip includes a semiconductor substrate. The semiconductor substrate includes through-hole electrodes penetrating the substrate. When an area corresponding to the fixing member in the orthogonal projection of the image pickup module with respect to the cover module is defined as a fixed area, the through-hole electrodes and the connection members are arranged in the fixed area.
摘要翻译：图像拾取模块包括盖构件，包括光电二极管的图像拾取装置芯片，布置在图像拾取装置芯片周围并将盖构件和图像拾取装置芯片连接在一起的固定构件，布置在侧面的重新布线基板与图像拾取装置芯片的盖构件相对的连接构件，用于将图像拾取装置芯片与重新布线基板连接的连接构件以及由盖构件，图像拾取装置芯片和固定构件包围的空间。图像拾取器件芯片包括半导体衬底。半导体衬底包括穿透衬底的通孔电极。当将图像拾取模块相对于盖模块的正交投影中的固定构件对应的区域定义为固定区域时，通孔电极和连接构件布置在固定区域中。

2. 发明授权

US08309433B2 Method of manufacturing optical sensor 有权
标题翻译：光学传感器的制造方法
公开(公告)号：US08309433B2
公开(公告)日：2012-11-13
申请号：US13211161
申请日：2011-08-16
申请人： Yasuhiro Matsuki , Takanori Suzuki , Koji Tsuduki , Shin Hasegawa , Tadashi Kosaka , Akiya Nakayama
发明人： Yasuhiro Matsuki , Takanori Suzuki , Koji Tsuduki , Shin Hasegawa , Tadashi Kosaka , Akiya Nakayama
IPC分类号： H01L21/30
CPC分类号： H01L27/14618 , H01L27/14685 , H01L2924/0002 , H01L2924/00
摘要： A method of manufacturing an optical sensor includes the steps of providing a semiconductor wafer having a plurality of pixel areas; forming a grid-like rib enclosing each pixel area on the semiconductor wafer, the grid-like rib having a predetermined width and being formed from a fixing member; providing a light-transmissive substrate having a gap portion on a main surface thereof, the gap portion having at least one of a groove having a width smaller than the grid-like rib and a plurality of through-holes; fixing the semiconductor wafer and the light-transmissive substrate such that the grid-like rib and the gap portion face each other; and cutting the fixed semiconductor wafer and light-transmissive substrate into pieces such that each piece includes one pixel area.
摘要翻译：一种制造光学传感器的方法包括以下步骤：提供具有多个像素区域的半导体晶片; 形成包围所述半导体晶片上的每个像素区域的格栅状肋，所述格子状肋具有预定的宽度并由固定构件形成; 提供在其主表面上具有间隙部分的透光基板，所述间隙部分具有宽度小于所述格子状肋条的槽和多个通孔中的至少一个; 固定所述半导体晶片和所述透光性基板，使得所述格子状肋和所述间隙部彼此面对; 并且将固定的半导体晶片和透光基板切割成片，使得每个片包括一个像素区域。

3. 发明申请

US20120044415A1 IMAGE PICKUP MODULE AND CAMERA 有权
标题翻译：图像拾取模块和摄像机
公开(公告)号：US20120044415A1
公开(公告)日：2012-02-23
申请号：US13212935
申请日：2011-08-18
申请人： Koji Tsuduki , Shin Hasegawa , Tadashi Kosaka , Yasuhiro Matsuki , Takanori Suzuki , Akiya Nakayama
发明人： Koji Tsuduki , Shin Hasegawa , Tadashi Kosaka , Yasuhiro Matsuki , Takanori Suzuki , Akiya Nakayama
IPC分类号： H04N5/225 , H01L27/146
CPC分类号： H01L27/14618 , H01L27/14636 , H01L2224/13 , H04N5/2253
摘要： An image pickup module includes a cover member, an image pickup device chip including photodiodes, a fixing member which is arranged around the image pickup device chip and which connects the cover member and the image pickup device chip together, a rewiring substrate arranged on the side opposite to the cover member of the image pickup device chip, connection members for connecting the image pickup device chip with the rewiring substrate, and a space surrounded by the cover member, the image pickup device chip, and the fixing member. The image pickup device chip includes a semiconductor substrate. The semiconductor substrate includes through-hole electrodes penetrating the substrate. When an area corresponding to the fixing member in the orthogonal projection of the image pickup module with respect to the cover module is defined as a fixed area, the through-hole electrodes and the connection members are arranged in the fixed area.
摘要翻译：图像拾取模块包括盖构件，包括光电二极管的图像拾取装置芯片，布置在图像拾取装置芯片周围并将盖构件和图像拾取装置芯片连接在一起的固定构件，布置在侧面的重新布线基板与图像拾取装置芯片的盖构件相对的连接构件，用于将图像拾取装置芯片与重新布线基板连接的连接构件以及由盖构件，图像拾取装置芯片和固定构件包围的空间。图像拾取器件芯片包括半导体衬底。半导体衬底包括穿透衬底的通孔电极。当将图像拾取模块相对于盖模块的正交投影中的固定构件对应的区域定义为固定区域时，通孔电极和连接构件布置在固定区域中。

4. 发明授权

US08790950B2 Method of manufacturing optical sensor, optical sensor, and camera including optical sensor 有权
标题翻译：制造光学传感器，光学传感器和包括光学传感器的照相机的方法
公开(公告)号：US08790950B2
公开(公告)日：2014-07-29
申请号：US13211102
申请日：2011-08-16
申请人： Takanori Suzuki , Tadashi Kosaka , Koji Tsuduki , Yasuhiro Matsuki , Shin Hasegawa , Akiya Nakayama
发明人： Takanori Suzuki , Tadashi Kosaka , Koji Tsuduki , Yasuhiro Matsuki , Shin Hasegawa , Akiya Nakayama
IPC分类号： H01L21/00 , H01L27/146
CPC分类号： H01L27/14618 , H01L27/14683 , H01L2224/13
摘要： A method of manufacturing an optical sensor includes providing a semiconductor wafer including a plurality of pixel areas, providing a light transmissive substrate including a light transmissive wafer with a plurality of light transmissive members attached thereto, the plurality of light transmissive members being arranged on a first main surface of the light transmissive wafer and each of plurality of light transmissive members emitting α rays, an amount of the α rays being smaller than or equal to 0.05 c/cm2·h, fixing the light transmissive substrate onto the semiconductor wafer together by a fixing member, and dividing the semiconductor wafer and the light transmissive substrate that are fixed together into individual pieces.
摘要翻译：一种制造光学传感器的方法，包括提供包括多个像素区域的半导体晶片，提供包括具有附接到其上的多个透光构件的透光晶片的透光基板，所述多个透光构件布置在第一透光晶片的主表面和发射α射线的多个透光部件中的每一个，α射线的量小于或等于0.05c / cm 2·h，将透光基板固定在半导体晶片上一起由固定部件，并且将固定在一起的半导体晶片和透光性基板分割成单独的片。

5. 发明申请

US20120052612A1 METHOD OF MANUFACTURING OPTICAL SENSOR 有权
标题翻译：制造光学传感器的方法
公开(公告)号：US20120052612A1
公开(公告)日：2012-03-01
申请号：US13211161
申请日：2011-08-16
申请人： Yasuhiro Matsuki , Takanori Suzuki , Koji Tsuduki , Shin Hasegawa , Tadashi Kosaka , Akiya Nakayama
发明人： Yasuhiro Matsuki , Takanori Suzuki , Koji Tsuduki , Shin Hasegawa , Tadashi Kosaka , Akiya Nakayama
IPC分类号： H01L31/18
CPC分类号： H01L27/14618 , H01L27/14685 , H01L2924/0002 , H01L2924/00
摘要： A method of manufacturing an optical sensor includes the steps of providing a semiconductor wafer having a plurality of pixel areas; forming a grid-like rib enclosing each pixel area on the semiconductor wafer, the grid-like rib having a predetermined width and being formed from a fixing member; providing a light-transmissive substrate having a gap portion on a main surface thereof, the gap portion having at least one of a groove having a width smaller than the grid-like rib and a plurality of through-holes; fixing the semiconductor wafer and the light-transmissive substrate such that the grid-like rib and the gap portion face each other; and cutting the fixed semiconductor wafer and light-transmissive substrate into pieces such that each piece includes one pixel area.
摘要翻译：一种制造光学传感器的方法包括以下步骤：提供具有多个像素区域的半导体晶片; 形成包围所述半导体晶片上的每个像素区域的格栅状肋，所述格子状肋具有预定的宽度并由固定构件形成; 提供在其主表面上具有间隙部分的透光基板，所述间隙部分具有宽度小于所述格子状肋条的槽和多个通孔中的至少一个; 固定所述半导体晶片和所述透光基板，使得所述格子状肋和所述间隙部彼此面对; 并且将固定的半导体晶片和透光基板切割成片，使得每个片包括一个像素区域。

6. 发明申请

US20120050590A1 METHOD OF MANUFACTURING OPTICAL SENSOR, OPTICAL SENSOR, AND CAMERA INCLUDING OPTICAL SENSOR 有权
标题翻译：制造光学传感器，光学传感器和相机的方法，包括光学传感器
公开(公告)号：US20120050590A1
公开(公告)日：2012-03-01
申请号：US13211102
申请日：2011-08-16
申请人： Takanori Suzuki , Tadashi Kosaka , Koji Tsuduki , Yasuhiro Matsuki , Shin Hasegawa , Akiya Nakayama
发明人： Takanori Suzuki , Tadashi Kosaka , Koji Tsuduki , Yasuhiro Matsuki , Shin Hasegawa , Akiya Nakayama
IPC分类号： H04N5/335 , H01L31/0232 , H01L31/18
CPC分类号： H01L27/14618 , H01L27/14683 , H01L2224/13
摘要： A method of manufacturing an optical sensor includes providing a semiconductor wafer including a plurality of pixel areas, providing a light transmissive substrate including a light transmissive wafer with a plurality of light transmissive members attached thereto, the plurality of light transmissive members being arranged on a first main surface of the light transmissive wafer and each of plurality of light transmissive members emitting α rays, an amount of the α rays being smaller than or equal to 0.05 c/cm2·h, fixing the light transmissive substrate onto the semiconductor wafer together by a fixing member, and dividing the semiconductor wafer and the light transmissive substrate that are fixed together into individual pieces.
摘要翻译：一种制造光学传感器的方法，包括提供包括多个像素区域的半导体晶片，提供包括具有附接到其上的多个透光构件的透光晶片的透光基板，所述多个透光构件布置在第一透光晶片的主表面和发射α射线的多个透光部件中的每一个，α射线的量小于或等于0.05c / cm 2·h，将透光基板固定在半导体晶片上一起由固定部件，并且将固定在一起的半导体晶片和透光性基板分割成单独的片。

7. 发明授权

US06554973B2 Film formation method using sputtering and production method of photovoltaic element using same 失效
公开(公告)号：US06554973B2
公开(公告)日：2003-04-29
申请号：US09867632
申请日：2001-05-31
申请人： Akiya Nakayama
发明人： Akiya Nakayama
IPC分类号： C23C1434
CPC分类号： C23C14/562 , C23C14/54 , H01L31/0392 , H01L31/056 , H01L31/1884 , Y02E10/52
摘要： In a film formation method comprising introducing a sputtering gas into a film forming chamber and forming a film on a substrate therein, the partial pressure of H2O in an atmosphere inside the film forming chamber is controlled so as to satisfy prescribed conditions, thereby forming a reflective layer of a prescribed reflectance on the substrate, thereby providing a film formation method using sputtering and a production method of a photovoltaic element using the film formation method that attain stable good film formation even during long-time sputter film formation, can constantly form a reflective film with a desired reflectance, has excellent workability and durability, and constantly attain high photoelectric conversion efficiency.

8. 发明授权

US08779369B2 Radiation detection apparatus, scintillator panel, method for manufacturing same and radiation detection system 有权
标题翻译：辐射检测装置，闪烁体面板，制造方法及放射线检测系统
公开(公告)号：US08779369B2
公开(公告)日：2014-07-15
申请号：US13366066
申请日：2012-02-03
申请人： Tomoaki Ichimura , Satoshi Okada , Kazumi Nagano , Keiichi Nomura , Yohei Ishida , Yoshito Sasaki , Akiya Nakayama
发明人： Tomoaki Ichimura , Satoshi Okada , Kazumi Nagano , Keiichi Nomura , Yohei Ishida , Yoshito Sasaki , Akiya Nakayama
IPC分类号： G01T1/20 , G21K4/00
CPC分类号： G21K4/00 , G01T1/2002 , H01L27/1462 , H01L27/14658
摘要： A radiation detection apparatus comprising a sensor panel and a scintillator panel is provided. The scintillator panel including a substrate, a scintillator disposed on the substrate, and a scintillator protective film that has a first organic protective layer and an inorganic protective layer, and covers the scintillator. The scintillator protective film is located between the sensor panel and the scintillator. The first organic protective layer is located on a scintillator side from the inorganic protective layer. A surface on a sensor panel side of the scintillator is partially in contact with the inorganic protective layer.
摘要翻译：提供一种包括传感器面板和闪烁体面板的放射线检测装置。闪烁体面板包括基板，设置在基板上的闪烁体和具有第一有机保护层和无机保护层的闪烁体保护膜，并且覆盖闪烁体。闪烁体保护膜位于传感器面板和闪烁体之间。第一有机保护层位于与无机保护层相反的闪烁体一侧。闪烁体的传感器面板侧的表面部分地与无机保护层接触。

9. 发明授权

US07445952B2 Method of forming laminate and method of manufacturing photovoltaic device 失效
标题翻译：形成层压板的方法和制造光伏器件的方法
公开(公告)号：US07445952B2
公开(公告)日：2008-11-04
申请号：US11197512
申请日：2005-08-05
申请人： Takaharu Kondo , Hideo Tamura , Atsushi Yasuno , Noboru Toyama , Yuichi Sonoda , Masumitsu Iwata , Akiya Nakayama , Yusuke Miyamoto
发明人： Takaharu Kondo , Hideo Tamura , Atsushi Yasuno , Noboru Toyama , Yuichi Sonoda , Masumitsu Iwata , Akiya Nakayama , Yusuke Miyamoto
IPC分类号： H01L21/00 , H01L31/18 , B05D5/12
CPC分类号： H01L31/02168 , H01L31/056 , Y02E10/52
摘要： A method of forming a laminate and a method of manufacturing a photovoltaic device using the laminate are provided. The laminate forming method includes a first step of forming an intermediate layer on a base member, and a second step of forming a metal layer on the intermediate layer, the adhesion of the metal layer to the base member being lower than that of the intermediate layer, the reflectance of the metal layer being higher than that of the intermediate layer. The rate of formation of the metal layer is increased at an intermediate stage in the second step. The laminate thereby formed has improved characteristics and is capable of maintaining improved reflection characteristics and adhesion even under high-temperature and high-humidity conditions or during long-term use.
摘要翻译：提供一种形成层压体的方法和使用该层压体制造光伏器件的方法。层压体形成方法包括在基材上形成中间层的第一工序和在中间层上形成金属层的第二工序，金属层与基材的密合性比中间层低，金属层的反射率高于中间层的反射率。在第二步骤的中间阶段，金属层的形成速率增加。由此形成的层压件具有改进的特性，并且即使在高温和高湿度条件下或在长期使用中也能够保持改进的反射特性和粘附性。

10. 发明授权

US5620530A Back reflector layer, method for forming it, and photovoltaic element using it 失效
标题翻译：背反射层，其形成方法和使用它的光电元件
公开(公告)号：US5620530A
公开(公告)日：1997-04-15
申请号：US515296
申请日：1995-08-15
申请人： Akiya Nakayama
发明人： Akiya Nakayama
IPC分类号： H01L31/04 , H01L31/0236 , H01L31/0392 , H01L31/052 , H01L31/18 , H01L31/20 , C23C14/34
CPC分类号： H01L31/0236 , H01L31/03921 , H01L31/056 , H01L31/1884 , H01L31/206 , Y02E10/52 , Y02P70/521
摘要： An object of the present invention is to provide a back reflector layer having a texture structure with a high reflectivity by preventing oxidation of a metal or alloy base layer, and a method for forming it. A further object is to provide a photovoltaic element with excellent characteristics such as a conversion efficiency, and a process for fabricating it. The back reflector layer has a metal or alloy (hereinafter referred to as a first metal) base layer, and a transparent oxide of a second metal, formed on the first metal. A photovoltaic element is formed by forming a semiconductor junction on the back reflector layer. In the back reflector layer and the photovoltaic element, the electron affinity of the second metal is at least 0.46 eV smaller than that of the first metal, and the transparent oxide is formed by a sputtering method in an atmosphere comprising at least H.sub.2 O and an inert gas and with a target having a composition ratio of the second metal of 1.06 to 1.2 times the stoichiometric composition thereof.
摘要翻译：本发明的目的是提供一种通过防止金属或合金基层的氧化而具有具有高反射率的织构结构的背反射层及其形成方法。另一个目的是提供一种具有优异特性的转换效率的光电元件及其制造方法。后反射层在第一金属上形成有金属或合金（以下称为第一金属）基层和第二金属的透明氧化物。通过在后反射层上形成半导体结形成光电元件。在后反射层和光电元件中，第二金属的电子亲和力比第一金属的电子亲和力小至少为0.46eV，透明氧化物通过溅射法在至少包含H 2 O和惰性的气氛中形成气体并且具有第二金属的组成比为其化学计量组成的1.06至1.2倍的靶。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式