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1. 发明申请

US20120212637A1 SOLID-STATE IMAGING APPARATUS, METHOD OF MANUFACTURING SAME, AND CAMERA 有权
标题翻译：固态成像装置，制造方法和相机
公开(公告)号：US20120212637A1
公开(公告)日：2012-08-23
申请号：US13360166
申请日：2012-01-27
申请人： Koji Tsuduki , Takanori Suzuki , Hisatane Komori , Satoru Hamasaki
发明人： Koji Tsuduki , Takanori Suzuki , Hisatane Komori , Satoru Hamasaki
IPC分类号： H04N5/228 , H01L31/18 , H01L31/02
CPC分类号： H01L27/14618 , H01L27/14683 , H01L2224/94
摘要： A solid-state imaging apparatus, comprising: a semiconductor chip having a principal face including a pixel region; a protruding portion disposed on the principal face to surround the pixel region; a cover member disposed over the pixel region; and an adhesive material surrounding the pixel region and bonding the cover member and the protruding portion, is provided. The protruding portion has top and first side faces facing the space, a first edge line being formed by this two faces. The adhesive material bonds the top face of the protruding portion and the cover member. The adhesive material has a first face facing the interior space, and the first face extends from the first edge line toward the cover member. Perimeters of the interior space, in planes parallel to the principal face become shorter in a direction from the top face of the protruding portion toward the cover member.
摘要翻译：一种固态成像装置，包括：具有包括像素区域的主面的半导体芯片; 设置在所述主面上以围绕所述像素区域的突出部分; 设置在所述像素区域上的盖构件; 并且设置围绕像素区域并且接合盖构件和突出部分的粘合材料。突出部分具有面向空间的顶部和第一侧面，由该两个面形成的第一边缘线。粘合剂材料将突出部分的顶面和盖部件结合。粘合剂材料具有面向内部空间的第一面，第一面从第一边缘线朝向盖构件延伸。在与主体面平行的平面内的内部空间的周长在从突出部的顶面向盖部的顶面的方向变短。

2. 发明授权

US07622812B2 Semiconductor module 失效
标题翻译：半导体模块
公开(公告)号：US07622812B2
公开(公告)日：2009-11-24
申请号：US11955504
申请日：2007-12-13
申请人： Koji Tsuduki , Takanori Suzuki
发明人： Koji Tsuduki , Takanori Suzuki
IPC分类号： H01L23/28
CPC分类号： H01L21/56 , H01L23/3121 , H01L2224/45144 , H01L2224/49171 , H01L2924/00
摘要： A semiconductor module includes a semiconductor chip sealed with an encapsulation resin prevented from overflowing from an inside of the outer edge by a wiring pattern extended portion extending from the wiring pattern along an outer edge of a solder resist pattern at an outside of the outer edge of the solder resist pattern.
摘要翻译：半导体模块包括密封的半导体芯片，其封装树脂被防止从外边缘的内侧溢出的布线图案延伸部分沿着沿阻焊图案的外边缘延伸的布线图案延伸部分在外部边缘处阻焊图案。

3. 发明授权

US08823872B2 Image pickup module with improved flatness of image sensor and via electrodes 有权
标题翻译：图像拾取模块，具有改善图像传感器和通孔电极的平面度
公开(公告)号：US08823872B2
公开(公告)日：2014-09-02
申请号：US13212935
申请日：2011-08-18
申请人： Koji Tsuduki , Shin Hasegawa , Tadashi Kosaka , Yasuhiro Matsuki , Takanori Suzuki , Akiya Nakayama
发明人： Koji Tsuduki , Shin Hasegawa , Tadashi Kosaka , Yasuhiro Matsuki , Takanori Suzuki , Akiya Nakayama
IPC分类号： H04N5/225
CPC分类号： H01L27/14618 , H01L27/14636 , H01L2224/13 , H04N5/2253
摘要： An image pickup module includes a cover member, an image pickup device chip including photodiodes, a fixing member which is arranged around the image pickup device chip and which connects the cover member and the image pickup device chip together, a rewiring substrate arranged on the side opposite to the cover member of the image pickup device chip, connection members for connecting the image pickup device chip with the rewiring substrate, and a space surrounded by the cover member, the image pickup device chip, and the fixing member. The image pickup device chip includes a semiconductor substrate. The semiconductor substrate includes through-hole electrodes penetrating the substrate. When an area corresponding to the fixing member in the orthogonal projection of the image pickup module with respect to the cover module is defined as a fixed area, the through-hole electrodes and the connection members are arranged in the fixed area.
摘要翻译：图像拾取模块包括盖构件，包括光电二极管的图像拾取装置芯片，布置在图像拾取装置芯片周围并将盖构件和图像拾取装置芯片连接在一起的固定构件，布置在侧面的重新布线基板与图像拾取装置芯片的盖构件相对的连接构件，用于将图像拾取装置芯片与重新布线基板连接的连接构件以及由盖构件，图像拾取装置芯片和固定构件包围的空间。图像拾取器件芯片包括半导体衬底。半导体衬底包括穿透衬底的通孔电极。当将图像拾取模块相对于盖模块的正交投影中的固定构件对应的区域定义为固定区域时，通孔电极和连接构件布置在固定区域中。

4. 发明授权

US08698938B2 Solid-state imaging apparatus, method of manufacturing same, and camera 有权
标题翻译：固体摄像装置及其制造方法及相机
公开(公告)号：US08698938B2
公开(公告)日：2014-04-15
申请号：US13360166
申请日：2012-01-27
申请人： Koji Tsuduki , Takanori Suzuki , Hisatane Komori , Satoru Hamasaki
发明人： Koji Tsuduki , Takanori Suzuki , Hisatane Komori , Satoru Hamasaki
IPC分类号： H04N5/225 , H04N5/335 , H01L27/146
CPC分类号： H01L27/14618 , H01L27/14683 , H01L2224/94
摘要： A solid-state imaging apparatus, comprising: a semiconductor chip having a principal face including a pixel region; a protruding portion disposed on the principal face to surround the pixel region; a cover member disposed over the pixel region; and an adhesive material surrounding the pixel region and bonding the cover member and the protruding portion, is provided. The protruding portion has top and first side faces facing the space, a first edge line being formed by this two faces. The adhesive material bonds the top face of the protruding portion and the cover member. The adhesive material has a first face facing the interior space, and the first face extends from the first edge line toward the cover member. Perimeters of the interior space, in planes parallel to the principal face become shorter in a direction from the top face of the protruding portion toward the cover member.
摘要翻译：一种固态成像装置，包括：具有包括像素区域的主面的半导体芯片; 设置在所述主面上以围绕所述像素区域的突出部分; 设置在所述像素区域上的盖构件; 并且设置围绕像素区域并且接合盖构件和突出部分的粘合材料。突出部分具有面向空间的顶部和第一侧面，由该两个面形成的第一边缘线。粘合剂材料将突出部分的顶面和盖部件结合。粘合剂材料具有面向内部空间的第一面，第一面从第一边缘线朝向盖构件延伸。在与主体面平行的平面内的内部空间的周长在从突出部的顶面向盖部的顶面的方向变短。

5. 发明授权

US08309433B2 Method of manufacturing optical sensor 有权
标题翻译：光学传感器的制造方法
公开(公告)号：US08309433B2
公开(公告)日：2012-11-13
申请号：US13211161
申请日：2011-08-16
申请人： Yasuhiro Matsuki , Takanori Suzuki , Koji Tsuduki , Shin Hasegawa , Tadashi Kosaka , Akiya Nakayama
发明人： Yasuhiro Matsuki , Takanori Suzuki , Koji Tsuduki , Shin Hasegawa , Tadashi Kosaka , Akiya Nakayama
IPC分类号： H01L21/30
CPC分类号： H01L27/14618 , H01L27/14685 , H01L2924/0002 , H01L2924/00
摘要： A method of manufacturing an optical sensor includes the steps of providing a semiconductor wafer having a plurality of pixel areas; forming a grid-like rib enclosing each pixel area on the semiconductor wafer, the grid-like rib having a predetermined width and being formed from a fixing member; providing a light-transmissive substrate having a gap portion on a main surface thereof, the gap portion having at least one of a groove having a width smaller than the grid-like rib and a plurality of through-holes; fixing the semiconductor wafer and the light-transmissive substrate such that the grid-like rib and the gap portion face each other; and cutting the fixed semiconductor wafer and light-transmissive substrate into pieces such that each piece includes one pixel area.
摘要翻译：一种制造光学传感器的方法包括以下步骤：提供具有多个像素区域的半导体晶片; 形成包围所述半导体晶片上的每个像素区域的格栅状肋，所述格子状肋具有预定的宽度并由固定构件形成; 提供在其主表面上具有间隙部分的透光基板，所述间隙部分具有宽度小于所述格子状肋条的槽和多个通孔中的至少一个; 固定所述半导体晶片和所述透光性基板，使得所述格子状肋和所述间隙部彼此面对; 并且将固定的半导体晶片和透光基板切割成片，使得每个片包括一个像素区域。

6. 发明申请

US20120044415A1 IMAGE PICKUP MODULE AND CAMERA 有权
标题翻译：图像拾取模块和摄像机
公开(公告)号：US20120044415A1
公开(公告)日：2012-02-23
申请号：US13212935
申请日：2011-08-18
申请人： Koji Tsuduki , Shin Hasegawa , Tadashi Kosaka , Yasuhiro Matsuki , Takanori Suzuki , Akiya Nakayama
发明人： Koji Tsuduki , Shin Hasegawa , Tadashi Kosaka , Yasuhiro Matsuki , Takanori Suzuki , Akiya Nakayama
IPC分类号： H04N5/225 , H01L27/146
CPC分类号： H01L27/14618 , H01L27/14636 , H01L2224/13 , H04N5/2253
摘要： An image pickup module includes a cover member, an image pickup device chip including photodiodes, a fixing member which is arranged around the image pickup device chip and which connects the cover member and the image pickup device chip together, a rewiring substrate arranged on the side opposite to the cover member of the image pickup device chip, connection members for connecting the image pickup device chip with the rewiring substrate, and a space surrounded by the cover member, the image pickup device chip, and the fixing member. The image pickup device chip includes a semiconductor substrate. The semiconductor substrate includes through-hole electrodes penetrating the substrate. When an area corresponding to the fixing member in the orthogonal projection of the image pickup module with respect to the cover module is defined as a fixed area, the through-hole electrodes and the connection members are arranged in the fixed area.
摘要翻译：图像拾取模块包括盖构件，包括光电二极管的图像拾取装置芯片，布置在图像拾取装置芯片周围并将盖构件和图像拾取装置芯片连接在一起的固定构件，布置在侧面的重新布线基板与图像拾取装置芯片的盖构件相对的连接构件，用于将图像拾取装置芯片与重新布线基板连接的连接构件以及由盖构件，图像拾取装置芯片和固定构件包围的空间。图像拾取器件芯片包括半导体衬底。半导体衬底包括穿透衬底的通孔电极。当将图像拾取模块相对于盖模块的正交投影中的固定构件对应的区域定义为固定区域时，通孔电极和连接构件布置在固定区域中。

7. 发明申请

US20090298237A1 SEMICONDUCTOR MODULE 有权
标题翻译：半导体模块
公开(公告)号：US20090298237A1
公开(公告)日：2009-12-03
申请号：US12490656
申请日：2009-06-24
申请人： Koji Tsuduki , Takanori Suzuki
发明人： Koji Tsuduki , Takanori Suzuki
IPC分类号： H01L21/56
CPC分类号： H01L21/56 , H01L23/3121 , H01L2224/45144 , H01L2224/49171 , H01L2924/00
摘要： A semiconductor module includes a semiconductor chip sealed with an encapsulation resin prevented from overflowing from an inside of the outer edge by a wiring pattern extended portion extending from the wiring pattern along an outer edge of a solder resist pattern at an outside of the outer edge of the solder resist pattern.
摘要翻译：半导体模块包括密封的半导体芯片，其封装树脂被防止从外边缘的内侧溢出的布线图案延伸部分沿着沿阻焊图案的外边缘延伸的布线图案延伸部分在外部边缘处阻焊图案。

8. 发明授权

US08790950B2 Method of manufacturing optical sensor, optical sensor, and camera including optical sensor 有权
标题翻译：制造光学传感器，光学传感器和包括光学传感器的照相机的方法
公开(公告)号：US08790950B2
公开(公告)日：2014-07-29
申请号：US13211102
申请日：2011-08-16
申请人： Takanori Suzuki , Tadashi Kosaka , Koji Tsuduki , Yasuhiro Matsuki , Shin Hasegawa , Akiya Nakayama
发明人： Takanori Suzuki , Tadashi Kosaka , Koji Tsuduki , Yasuhiro Matsuki , Shin Hasegawa , Akiya Nakayama
IPC分类号： H01L21/00 , H01L27/146
CPC分类号： H01L27/14618 , H01L27/14683 , H01L2224/13
摘要： A method of manufacturing an optical sensor includes providing a semiconductor wafer including a plurality of pixel areas, providing a light transmissive substrate including a light transmissive wafer with a plurality of light transmissive members attached thereto, the plurality of light transmissive members being arranged on a first main surface of the light transmissive wafer and each of plurality of light transmissive members emitting α rays, an amount of the α rays being smaller than or equal to 0.05 c/cm2·h, fixing the light transmissive substrate onto the semiconductor wafer together by a fixing member, and dividing the semiconductor wafer and the light transmissive substrate that are fixed together into individual pieces.
摘要翻译：一种制造光学传感器的方法，包括提供包括多个像素区域的半导体晶片，提供包括具有附接到其上的多个透光构件的透光晶片的透光基板，所述多个透光构件布置在第一透光晶片的主表面和发射α射线的多个透光部件中的每一个，α射线的量小于或等于0.05c / cm 2·h，将透光基板固定在半导体晶片上一起由固定部件，并且将固定在一起的半导体晶片和透光性基板分割成单独的片。

9. 发明申请

US20120052612A1 METHOD OF MANUFACTURING OPTICAL SENSOR 有权
标题翻译：制造光学传感器的方法
公开(公告)号：US20120052612A1
公开(公告)日：2012-03-01
申请号：US13211161
申请日：2011-08-16
申请人： Yasuhiro Matsuki , Takanori Suzuki , Koji Tsuduki , Shin Hasegawa , Tadashi Kosaka , Akiya Nakayama
发明人： Yasuhiro Matsuki , Takanori Suzuki , Koji Tsuduki , Shin Hasegawa , Tadashi Kosaka , Akiya Nakayama
IPC分类号： H01L31/18
CPC分类号： H01L27/14618 , H01L27/14685 , H01L2924/0002 , H01L2924/00
摘要： A method of manufacturing an optical sensor includes the steps of providing a semiconductor wafer having a plurality of pixel areas; forming a grid-like rib enclosing each pixel area on the semiconductor wafer, the grid-like rib having a predetermined width and being formed from a fixing member; providing a light-transmissive substrate having a gap portion on a main surface thereof, the gap portion having at least one of a groove having a width smaller than the grid-like rib and a plurality of through-holes; fixing the semiconductor wafer and the light-transmissive substrate such that the grid-like rib and the gap portion face each other; and cutting the fixed semiconductor wafer and light-transmissive substrate into pieces such that each piece includes one pixel area.
摘要翻译：一种制造光学传感器的方法包括以下步骤：提供具有多个像素区域的半导体晶片; 形成包围所述半导体晶片上的每个像素区域的格栅状肋，所述格子状肋具有预定的宽度并由固定构件形成; 提供在其主表面上具有间隙部分的透光基板，所述间隙部分具有宽度小于所述格子状肋条的槽和多个通孔中的至少一个; 固定所述半导体晶片和所述透光基板，使得所述格子状肋和所述间隙部彼此面对; 并且将固定的半导体晶片和透光基板切割成片，使得每个片包括一个像素区域。

10. 发明申请

US20120050590A1 METHOD OF MANUFACTURING OPTICAL SENSOR, OPTICAL SENSOR, AND CAMERA INCLUDING OPTICAL SENSOR 有权
标题翻译：制造光学传感器，光学传感器和相机的方法，包括光学传感器
公开(公告)号：US20120050590A1
公开(公告)日：2012-03-01
申请号：US13211102
申请日：2011-08-16
申请人： Takanori Suzuki , Tadashi Kosaka , Koji Tsuduki , Yasuhiro Matsuki , Shin Hasegawa , Akiya Nakayama
发明人： Takanori Suzuki , Tadashi Kosaka , Koji Tsuduki , Yasuhiro Matsuki , Shin Hasegawa , Akiya Nakayama
IPC分类号： H04N5/335 , H01L31/0232 , H01L31/18
CPC分类号： H01L27/14618 , H01L27/14683 , H01L2224/13
摘要： A method of manufacturing an optical sensor includes providing a semiconductor wafer including a plurality of pixel areas, providing a light transmissive substrate including a light transmissive wafer with a plurality of light transmissive members attached thereto, the plurality of light transmissive members being arranged on a first main surface of the light transmissive wafer and each of plurality of light transmissive members emitting α rays, an amount of the α rays being smaller than or equal to 0.05 c/cm2·h, fixing the light transmissive substrate onto the semiconductor wafer together by a fixing member, and dividing the semiconductor wafer and the light transmissive substrate that are fixed together into individual pieces.
摘要翻译：一种制造光学传感器的方法，包括提供包括多个像素区域的半导体晶片，提供包括具有附接到其上的多个透光构件的透光晶片的透光基板，所述多个透光构件布置在第一透光晶片的主表面和发射α射线的多个透光部件中的每一个，α射线的量小于或等于0.05c / cm 2·h，将透光基板固定在半导体晶片上一起由固定部件，并且将固定在一起的半导体晶片和透光性基板分割成单独的片。

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