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1. 发明授权

US07169648B2 Process for producing a semiconductor device 有权
标题翻译：半导体装置的制造方法
公开(公告)号：US07169648B2
公开(公告)日：2007-01-30
申请号：US10916177
申请日：2004-08-11
申请人： Akinori Sato , Osamu Yamazaki , Hideo Senoo , Takashi Sugino
发明人： Akinori Sato , Osamu Yamazaki , Hideo Senoo , Takashi Sugino
IPC分类号： H01L21/00
CPC分类号： H01L24/83 , H01L21/561 , H01L21/563 , H01L21/568 , H01L21/6835 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/90 , H01L2221/68327 , H01L2221/6834 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/274 , H01L2224/2919 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83191 , H01L2224/838 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2224/29099
摘要： A process for producing a resin-sealed semiconductor device having high reliability which is produced more easily and efficiently without voids, the process comprising the steps of: (a) providing a semiconductor wafer having circuits on a surface; (b) applying a resin sheet composed of a support and an adhesive resin layer releasable from the support, on the circuit surface of the semiconductor wafer, and fixing an outer periphery of the resin sheet with a ring frame; (c) cutting the semiconductor wafer and the resin layer by each circuit to form chips; (d) picking up each chip together with the resin layer from the support; (e) mounting each chip on a predetermined position of a chip mounting substrate through the resin layer; and (f) firmly bonding the chip on the chip mounting substrate so as to achieve conduction between the chip and the chip mounting substrate.
摘要翻译：一种制造具有高可靠性的树脂密封半导体器件的方法，该半导体器件更容易且高效地生产而没有空隙，该方法包括以下步骤：（a）提供在表面上具有电路的半导体晶片; （b）在半导体晶片的电路表面上涂敷由支撑体构成的树脂片和可从支持体剥离的粘合树脂层，并用环形框固定树脂片的外周; （c）通过每个电路切割半导体晶片和树脂层以形成芯片; （d）从树脂层与支撑体一起拾取每个芯片; （e）通过树脂层将每个芯片安装在芯片安装基板的预定位置上; 和（f）将芯片牢固地接合在芯片安装基板上，以实现芯片和芯片安装基板之间的导通。

2. 发明申请

US20050037542A1 Process for producing a semiconductor device 有权
标题翻译：半导体装置的制造方法
公开(公告)号：US20050037542A1
公开(公告)日：2005-02-17
申请号：US10916177
申请日：2004-08-11
申请人： Akinori Sato , Osamu Yamazaki , Hideo Senoo , Takashi Sugino
发明人： Akinori Sato , Osamu Yamazaki , Hideo Senoo , Takashi Sugino
IPC分类号： H01L23/12 , H01L21/44 , H01L21/56 , H01L21/60
CPC分类号： H01L24/83 , H01L21/561 , H01L21/563 , H01L21/568 , H01L21/6835 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/90 , H01L2221/68327 , H01L2221/6834 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/274 , H01L2224/2919 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83191 , H01L2224/838 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2224/29099
摘要： A process for producing a resin-sealed semiconductor device having high reliability which is produced more easily and efficiently without voids, the process comprising the steps of: (a) providing a semiconductor wafer having circuits on a surface; (b) applying a resin sheet composed of a support and an adhesive resin layer releasable from the support, on the circuit surface of the semiconductor wafer, and fixing an outer periphery of the resin sheet with a ring frame; (c) cutting the semiconductor wafer and the resin layer by each circuit to form chips; (d) picking up each chip together with the resin layer from the support; (e) mounting each chip on a predetermined position of a chip mounting substrate through the resin layer; and firmly bonding the chip on the chip mounting substrate so as to achieve conduction between the chip and the chip mounting substrate.
摘要翻译：一种制造具有高可靠性的树脂密封半导体器件的方法，该半导体器件更容易且高效地生产而没有空隙，该方法包括以下步骤：（a）提供在表面上具有电路的半导体晶片; （b）在半导体晶片的电路表面上涂敷由支撑体构成的树脂片和可从支持体剥离的粘合树脂层，并用环形框固定树脂片的外周; （c）通过每个电路切割半导体晶片和树脂层以形成芯片; （d）从树脂层与支撑体一起拾取每个芯片; （e）通过树脂层将每个芯片安装在芯片安装基板的预定位置上; 并将芯片牢固地接合在芯片安装基板上，以实现芯片和芯片安装基板之间的导通。

3. 发明申请

US20090075429A1 Sheet-Like Underfill Material and Semiconductor Device Manufacturing Method 审中-公开
标题翻译：片状底部填充材料和半导体器件制造方法
公开(公告)号：US20090075429A1
公开(公告)日：2009-03-19
申请号：US11912825
申请日：2006-04-19
申请人： Akinori Sato , Osamu Yamazaki , Kazuhiro Takahashi
发明人： Akinori Sato , Osamu Yamazaki , Kazuhiro Takahashi
IPC分类号： H01L21/50 , B32B7/12
CPC分类号： H01L23/293 , H01L21/563 , H01L21/6835 , H01L24/12 , H01L24/27 , H01L2224/1134 , H01L2224/131 , H01L2224/13144 , H01L2224/16 , H01L2224/274 , H01L2224/27436 , H01L2224/73104 , H01L2224/81191 , H01L2224/83191 , H01L2924/00013 , H01L2924/01004 , H01L2924/01019 , H01L2924/01025 , H01L2924/01079 , H01L2924/01322 , H01L2924/07802 , H01L2924/351 , Y10T428/2839 , H01L2924/014 , H01L2924/00014 , H01L2224/13099 , H01L2924/3512 , H01L2924/00
摘要： A sheet-like underfill material includes a base and adhesive layer provided peelably on the base for use in a flip chip mounting process in the manufacture of a semiconductor device. The process includes laminating a sheet-like underfill material onto a circuit face of a semiconductor wafer having bumps on its circuit face and, simultaneously, allowing the bumps to pierce the adhesive layer and allowing the tops of the bumps to penetrate the base. The base has a storage elastic modulus of 1.0×106 Pa to 4.0×109 Pa, a breaking stress of 1.0×105 Pa to 2.0×108 Pa, and a Young's modulus of 1.0×107 Pa to 1.1×1010 Pa. The adhesive layer has a storage elastic modulus of 1.0×104 Pa to 1.0×107 Pa and a breaking stress of 1.0×103 Pa to 3.0×107 Pa.
摘要翻译：片状底部填充材料包括可剥离地设置在基底上的基底和粘合剂层，以用于制造半导体器件的倒装芯片安装工艺。该方法包括将片状底部填充材料层叠在其电路面上具有凸块的半导体晶片的电路面上，同时允许凸块穿透粘合剂层并允许凸块的顶部穿透基部。该基材的储能弹性模量为1.0×10 6 Pa〜4.0×10 9 Pa，断裂应力为1.0×10 5 Pa〜2.0×10 8 Pa，杨氏模量为1.0×10 7 Pa〜1.1×10 10 Pa，粘合层的储能弹性模量 1.0×10 4 Pa〜1.0×10 7 Pa，断裂应力为1.0×10 3 Pa〜3.0×10 7 Pa。

4. 发明授权

US09546801B2 Solar-thermal conversion member, solar-thermal conversion device, and solar thermal power generation device comprising a β-FeSi2 phase material 有权
标题翻译：太阳能热转换构件，太阳能热转换装置和包含β-FeSi 2相材料的太阳能热发电装置
公开(公告)号：US09546801B2
公开(公告)日：2017-01-17
申请号：US14357777
申请日：2012-11-09
申请人： Akinori Sato , Yoshiki Okuhara , Seiichi Suda , Daisaku Yokoe , Takeharu Kato , Toru Sasatani
发明人： Akinori Sato , Yoshiki Okuhara , Seiichi Suda , Daisaku Yokoe , Takeharu Kato , Toru Sasatani
IPC分类号： F24J2/48 , F24J2/46 , C23C14/06 , C23C14/16 , F03G6/06
CPC分类号： F24S70/10 , C23C14/0682 , C23C14/0688 , C23C14/165 , F03G6/06 , F24S70/20 , F24S70/25 , F24S70/30 , F24S2080/01 , F24S2080/011 , Y02E10/46
摘要： A solar-thermal conversion member includes a β-FeSi2 phase material. The solar-thermal conversion member exhibits a high absorptance for visible light at wavelengths of several hundred nm and a low absorptance for infrared light at wavelengths of several thousand nm and, as a consequence, efficiently absorbs visible light at wavelengths of several hundred nm and converts the same into heat and exhibits little thermal radiation due to thermal emission at temperatures of several hundred ° C. The solar-thermal conversion member may therefore efficiently absorb sunlight, provide heat, and prevent thermal radiation due to thermal emission.
摘要翻译：太阳能热转换构件包括β-FeSi 2相材料。太阳能热转换构件对波长为几百nm的可见光具有高吸收率，对于波长为几千nm的红外光具有低吸收率，因此，有效地吸收波长为几百nm的可见光并转换同样的热量并且由于几百℃的温度下的热发射而表现出很少的热辐射。因此，太阳能 - 热转换构件可以有效地吸收阳光，提供热量并防止由于热发射引起的热辐射。

5. 发明授权

US09244557B2 Input device and a display device including the input device 有权
标题翻译：输入装置和包括输入装置的显示装置
公开(公告)号：US09244557B2
公开(公告)日：2016-01-26
申请号：US13395401
申请日：2010-09-30
申请人： Yasunari Nagata , Takashi Minami , Takashi Shimizu , Natsuko Yamagata , Akinori Sato , Yoshio Miyazaki
发明人： Yasunari Nagata , Takashi Minami , Takashi Shimizu , Natsuko Yamagata , Akinori Sato , Yoshio Miyazaki
IPC分类号： G06F3/044 , G06F3/041 , G02F1/1333
CPC分类号： G06F3/0412 , G02F1/13338 , G06F3/044 , G06F2203/04111
摘要： An input device includes a substrate having a first main surface and a second main surface located opposite to the first main surface; a protective member having an opposed surface opposite to the first main surface; a bonding member configured to bond the first main surface and the opposed surface to each other; a first coloring member disposed between the first main surface and the opposed surface, the first coloring member being in contact with the bonding member; and a second coloring member disposed on the second main surface and having a color different from a color of the first coloring member.
摘要翻译：输入装置包括具有第一主表面和与第一主表面相对的第二主表面的基板; 保护构件，具有与第一主表面相对的相对表面; 接合构件，其被配置为将所述第一主表面和所述相对表面彼此接合; 第一着色部件设置在第一主表面和相对表面之间，第一着色部件与接合部件接触; 以及第二着色构件，其设置在所述第二主表面上并且具有与所述第一着色构件的颜色不同的颜色。

6. 发明授权

US08979611B2 Polishing pad, production method for same, and production method for glass substrate 有权
标题翻译：抛光垫，其制造方法以及玻璃基板的制造方法
公开(公告)号：US08979611B2
公开(公告)日：2015-03-17
申请号：US13696759
申请日：2011-03-22
申请人： Akinori Sato , Nobuyoshi Ishizaka
发明人： Akinori Sato , Nobuyoshi Ishizaka
IPC分类号： B24D11/00 , B24B37/24 , B24B7/24
CPC分类号： B24D11/00 , B24B7/241 , B24B37/24
摘要： A polishing pad having a polishing layer comprising a thermoset polyurethane foam, wherein about the thermoset polyurethane foam, the Asker C hardness value thereof is 82 or less as a 60-second value, the hardness value being a value after the foam is immersed in water for 24 hours, and further the value of the tensile storage modulus E′ (30° C.) thereof at a frequency of 1.6 Hz satisfies the following expression (1): Y
摘要翻译：一种具有包括热固性聚氨酯泡沫的抛光层的抛光垫，其中围绕热固性聚氨酯泡沫，其Asker C硬度值为82或更小为60秒，硬度值为泡沫浸入水中后的值 24小时，其频率为1.6Hz的拉伸储能模量E'（30℃）的值进一步满足下式（1）：Y <5X-150（1）其中，Y表示拉伸储存模量E'（MPa），X表示将泡沫浸渍在水中24小时后的Asker C硬度值（60秒值）。

7. 发明授权

US08602846B2 Polishing pad and a method for manufacturing the same 有权
标题翻译：抛光垫及其制造方法
公开(公告)号：US08602846B2
公开(公告)日：2013-12-10
申请号：US13552346
申请日：2012-07-18
申请人： Takeshi Fukuda , Junji Hirose , Kenji Nakamura , Masato Doura , Akinori Sato
发明人： Takeshi Fukuda , Junji Hirose , Kenji Nakamura , Masato Doura , Akinori Sato
IPC分类号： B24B1/00
CPC分类号： B24B37/24 , B24D3/26 , B24D11/001
摘要： A polishing pad of excellent durability and adhesion between the polishing layer and the base material layer includes a polishing layer arranged on a base material layer, wherein the polishing layer includes a thermosetting polyurethane foam having roughly spherical interconnected cells having an average cell diameter of 20 to 300 μm. The polyurethane foam includes an isocyanate component and an active hydrogen-containing compound as starting material components, and the active hydrogen-containing compound includes 30 to 85% by weight of a high-molecular-weight polyol having 2 to 4 functional groups and a hydroxyl value of 20 to 100 mg KOH/g.
摘要翻译：抛光层和基材层之间具有优异的耐久性和粘附性的抛光垫包括布置在基材层上的抛光层，其中抛光层包括热固性聚氨酯泡沫，其具有平均泡孔直径为20至 300个妈妈聚氨酯泡沫包括异氰酸酯组分和含活性氢的化合物作为起始原料组分，并且含活性氢的化合物包括30至85重量％的具有2-4个官能团的高分子量多元醇和羟基值为20〜100mg KOH / g。

8. 发明申请

US20100162631A1 PROCESS FOR MANUFACTURING POLISHING PAD 有权
标题翻译：制造抛光垫的工艺
公开(公告)号：US20100162631A1
公开(公告)日：2010-07-01
申请号：US12601725
申请日：2008-05-15
申请人： Akinori Sato , Junji Hirose , Kenji Nakamura , Takeshi Fukuda , Masato Doura
发明人： Akinori Sato , Junji Hirose , Kenji Nakamura , Takeshi Fukuda , Masato Doura
IPC分类号： B24D3/32 , B24D11/00
CPC分类号： B24D18/00 , B24B37/205 , Y10T428/24322 , Y10T428/24331 , Y10T428/24364
摘要： A method for manufacturing a polishing pad that has a high level of optical detection accuracy and is prevented from causing slurry leak from between the polishing region and the light-transmitting region includes preparing a cell-dispersed urethane composition by a mechanical foaming method; placing a light-transmitting region at a predetermined position on a face material or a belt conveyor, continuously discharging the cell-dispersed urethane composition onto a part of the face material or the belt conveyor where the light-transmitting region is not placed; placing another face material or belt conveyor on the discharged cell-dispersed urethane composition; curing the cell-dispersed urethane composition to form a polishing region including a polyurethane foam, so that a polishing sheet is prepared; applying a coating composition containing an aliphatic and/or alicyclic polyisocyanate to one side of the polishing sheet and curing the coating composition to form a water-impermeable film; and cutting the polishing sheet.
摘要翻译：一种制造具有高水平的光学检测精度并且防止从抛光区域和透光区域之间的浆料泄漏的抛光垫的方法包括通过机械发泡法制备细胞分散的聚氨酯组合物; 在面材料或带式输送机上的预定位置放置透光区域，将细胞分散的聚氨酯组合物连续排出到未放置透光区域的面材或带式输送机的一部分上; 将另一种面材或带式输送机放置在排出的细胞分散的聚氨酯组合物上; 固化细胞分散的聚氨酯组合物以形成包括聚氨酯泡沫的抛光区域，从而制备抛光片; 将包含脂族和/或脂环族多异氰酸酯的涂料组合物施用到抛光片的一侧并固化涂料组合物以形成不透水膜; 并切割抛光片。

9. 发明授权

US07196667B2 Surface-mount type antenna and antenna apparatus employing the same, and wireless communication apparatus 有权
标题翻译：表面贴装式天线及采用该天线的天线装置，以及无线通信装置
公开(公告)号：US07196667B2
公开(公告)日：2007-03-27
申请号：US11212491
申请日：2005-08-26
申请人： Kazuo Watada , Shunichi Murakawa , Akinori Sato , Koji Hamada
发明人： Kazuo Watada , Shunichi Murakawa , Akinori Sato , Koji Hamada
IPC分类号： H01Q1/24 , H01Q1/38
CPC分类号： H01Q9/0421 , H01Q1/38 , H01Q5/35
摘要： A surface-mount type antenna includes a rectangular-parallelepiped base body made of a dielectric or magnetic material, having a first surface to be placed on a target substrate, second to fifth surfaces that are continuous with the first surface, and a sixth surface located in parallel with the first surface; a ground electrode formed on at least one of the second to fifth surfaces; two radiating electrodes that are continuous with the ground electrode and extend over two or more adjacent surfaces of the second to sixth surfaces; and two feeding electrodes formed on at least one of the second to fifth surfaces so as to be spaced apart circumferentially of the continuum of the second to fifth surfaces to provide the ground electrode in between. The feeding electrode is capacitance-coupled to the radiating electrode for effecting feeding.
摘要翻译：表面安装型天线包括由电介质或磁性材料制成的矩形平行六面体基体，具有放置在目标基板上的第一表面，与第一表面连续的第二至第五表面，以及位于与第一表面平行; 形成在所述第二至第五表面中的至少一个表面上的接地电极; 两个辐射电极，其与接地电极连续并且延伸到第二至第六表面的两个或更多个相邻表面上; 以及两个馈电电极，形成在第二至第五表面中的至少一个表面上，以便在第二至第五表面的连续体的周向间隔开，以在其间形成接地电极。馈电电极电容耦合到辐射电极以进行馈电。

10. 发明授权

US07109944B2 Antenna using variable capacitance element and wireless communication apparatus using the same 有权
标题翻译：使用可变电容元件的天线和使用其的无线通信装置
公开(公告)号：US07109944B2
公开(公告)日：2006-09-19
申请号：US11040526
申请日：2005-01-21
申请人： Akinori Sato , Takanori Ikuta
发明人： Akinori Sato , Takanori Ikuta
IPC分类号： H01Q1/50 , H01Q9/00
CPC分类号： H01Q9/0442
摘要： An antenna is constituted in which a variable capacitance capacitor portion Ct is connected between an antenna element and a ground. In the variable capacitance capacitor, a plurality of variable capacitance elements using a thin film dielectric layer whose dielectric constant is changed by a voltage applied are connected in parallel with regard to direct current component and in series with regard to high frequency component between an antenna-element-side terminal and a ground-side terminal. The capacitance change ratio of the variable capacitance capacitor that depends on the bias signal can be utilized to the maximum so as to perform impedance matching so that the electrical length of the antenna element is changed, and thus, the operating frequency can be changed. In addition, the antenna having small waveform distortion and intermodulation distortion, high power handling capability and low loss at high frequencies can be realized.
摘要翻译：构成天线，其中可变电容电容器部分Ct连接在天线元件和地之间。在可变电容电容器中，使用其介电常数被施加的电压改变的薄膜电介质层的多个可变电容元件相对于直流分量并联连接，并且与天线 - 元件侧端子和接地侧端子。可以将取决于偏置信号的可变电容电容器的电容变化率最大化地利用，以便执行阻抗匹配，使得天线元件的电长度改变，从而可以改变工作频率。此外，可以实现具有小的波形失真和互调失真，高功率处理能力和在高频率下的低损耗的天线。

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