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1. 发明申请

US20060292515A1 Heat treatment apparatus 审中-公开
标题翻译：热处理设备
公开(公告)号：US20060292515A1
公开(公告)日：2006-12-28
申请号：US11436739
申请日：2006-05-16
申请人： Akihiro Hisai , Shigehiro Goto
发明人： Akihiro Hisai , Shigehiro Goto
IPC分类号： F27D15/02
CPC分类号： F27B17/0025 , F27B5/04 , H01L21/67109
摘要： A heat treatment apparatus has a heat pipe structure, and includes a hollow heat-treating plate, and a temperature sensor for measuring temperatures of the heat-treating plate. A pair of operating fluid storage portions are formed below a hollow portion of the heat-treating plate. An operating fluid is stored in these operating fluid storage portions, and heaters are provided for heating the operating fluid. This heat treatment apparatus further includes a pair of operating fluid passages extending between the hollow portion and operating fluid storage portions of the heat-treating plate. At least a portion of each operating fluid passage lying above the surface of the operating fluid stored in the operating fluid storage portions are shaped to have an angle of inclination with respect to the horizontal.
摘要翻译：热处理装置具有热管结构，并且包括中空热处理板和用于测量热处理板的温度的温度传感器。在热处理板的中空部的下方形成有一对工作液储存部。工作流体储存在这些工作流体储存部分中，并且提供加热器以加热工作流体。该热处理装置还包括在中空部分和热处理板的工作流体储存部分之间延伸的一对工作流体通道。位于操作流体存储部分中的工作流体表面上方的每个工作流体通道的至少一部分被成形为具有相对于水平面的倾斜角。

2. 发明授权

US07718925B2 Substrate heat treatment apparatus 有权
标题翻译：基板热处理装置
公开(公告)号：US07718925B2
公开(公告)日：2010-05-18
申请号：US11566507
申请日：2006-12-04
申请人： Shigehiro Goto , Keiji Matsuchika
发明人： Shigehiro Goto , Keiji Matsuchika
IPC分类号： H01L21/68 , H05B3/22
CPC分类号： H01L21/67103 , H01L21/6838 , H01L21/68742 , H01L21/6875
摘要： A heat-treating plate has, arranged on the upper surface thereof, support elements for supporting a substrate, and a first sealer for closing lateral areas of a first space formed between the heat-treating plate and the substrate supported. Further, second sealers ring-shaped in plan view are arranged around openings of perforations accommodating transfer pins. The second sealers close lateral areas of second spaces opposed to the perforations. Gastightness of the first space excluding the second spaces is never impaired through the perforations. By exhausting gas from the first space through exhaust bores, the substrate is effectively sucked for heat treatment.
摘要翻译：热处理板在其上表面上布置有用于支撑基板的支撑元件，以及用于封闭形成在所述热处理板和所述基板之间形成的第一空间的横向区域的第一密封件。此外，平面图中环形的第二密封件围绕容纳传送销的穿孔的开口布置。第二个密封件封闭与穿孔相对的第二个空间的横向区域。不包括第二个空间的第一个空间的气密性绝对不会因穿孔而受损。通过从第一空间排出气体通过排气孔，基板被有效地吸入以进行热处理。

3. 发明申请

US20070128888A1 SUBSTRATE HEAT TREATMENT APPARATUS 有权
标题翻译：基材热处理设备
公开(公告)号：US20070128888A1
公开(公告)日：2007-06-07
申请号：US11566489
申请日：2006-12-04
申请人： Shigehiro Goto , Keiji Matsuchika , Akira Yamaguchi , Akihiko Morita
发明人： Shigehiro Goto , Keiji Matsuchika , Akira Yamaguchi , Akihiko Morita
IPC分类号： H01L21/00
CPC分类号： H01L21/6838 , H01L21/6875
摘要： A heat-treating plate has support elements projecting from an upper surface thereof. The support elements are located at apexes of equilateral triangles arranged regularly and continually. The heat-treating plate and a substrate placed on the support elements form a minute space therebetween which is sealed by a sealer. The substrate is sucked by reducing the pressure in the minute space to a negative pressure through exhaust bores. Since all the distances between adjoining support elements are equal, the substrate sags in the same amount between these support elements. With such arrangement of the support elements, sagging of the substrate is inhibited efficiently by a reduced number of support elements.
摘要翻译：热处理板具有从其上表面突出的支撑元件。支撑元件位于定期和连续排列的等边三角形的顶点。放置在支撑元件上的热处理板和基板在它们之间形成微小空间，由密封件密封。通过将微小空间中的压力通过排气孔减压至负压来吸引基板。由于相邻支撑元件之间的所有距离相等，所以基板在这些支撑元件之间的相同量的下垂。通过这种支撑元件的布置，通过减少数量的支撑元件有效地抑制了基板的下垂。

4. 发明授权

US09508573B2 Substrate processing apparatus and substrate processing method 有权
标题翻译：基板加工装置及基板处理方法
公开(公告)号：US09508573B2
公开(公告)日：2016-11-29
申请号：US13624536
申请日：2012-09-21
申请人： Masahito Kashiyama , Shigehiro Goto , Tomohiro Matsuo , Tomohiro Goto
发明人： Masahito Kashiyama , Shigehiro Goto , Tomohiro Matsuo , Tomohiro Goto
IPC分类号： H01L21/67 , H01L21/68
CPC分类号： H01L21/6715 , H01L21/67259 , H01L21/681
摘要： A processing liquid is supplied onto a substrate rotated by a spin chuck in a coating processing unit so that a film of the processing liquid is formed, and a rinse liquid is supplied to a peripheral edge of the substrate so that a processing liquid on the peripheral edge of the substrate is removed. An edge cut width between a position of an outer peripheral portion of the substrate rotated by the spin chuck in an edge exposure unit and a position of an outer peripheral portion of a film on the substrate is detected. Based on the detected edge cut width, a positional deviation of the center of the substrate held in the spin chuck from a rotation center of the spin chuck in the coating processing unit is determined while a supply state of the rinse liquid by an edge rinse nozzle is determined.
摘要翻译：将处理液体供给到由涂布处理单元中的旋转卡盘旋转的基板上，从而形成处理液体的膜，并且将冲洗液体供给到基板的周缘，使得周边的处理液去除衬底的边缘。检测由边缘曝光单元中的旋转卡盘旋转的基板的外周部的位置与基板上的膜的外周部的位置之间的边缘切割宽度。基于检测到的边缘切割宽度，确定保持在旋转卡盘中的基板的中心与涂布处理单元中的旋转卡盘的旋转中心的位置偏差，同时通过边缘冲洗喷嘴的冲洗液体的供给状态决心，决意，决定。

5. 发明申请

US20060236928A1 Treating solution supply nozzle, a substrate treating apparatus having this nozzle, and a method of manufacturing a treating solution supply nozzle 有权
标题翻译：处理溶液供给喷嘴，具有该喷嘴的基板处理装置以及处理液供给喷嘴的制造方法
公开(公告)号：US20060236928A1
公开(公告)日：2006-10-26
申请号：US11472612
申请日：2006-06-22
申请人： Shigehiro Goto , Hiroshi Kobayashi
发明人： Shigehiro Goto , Hiroshi Kobayashi
IPC分类号： B05B7/16
CPC分类号： H01L21/6715 , B05C11/08 , B05C11/1042
摘要： A resin block has a treating solution channel extending between and opening at front and back surfaces thereof. Heat conductive members are face-bonded to the front and back surfaces of the resin block, respectively, for closing the channel. Consequently, no air is present between the resin block and heat conduction members, thereby improving the efficiency of heat exchange. A nozzle of simple construction is realized only by face-bonding the two heat conductive members to the open front and rear surfaces of the resin block. Temperature control plates hold the heat conductive m embers along with the resin block to effect a temperature control, whereby the temperature of a treating solution in the treating solution channel is controlled effectively through the heat conductive members. The treating solution adjusted to a desired temperature is delivered from a discharge opening to a substrate for performing substrate treatment with high accuracy.
摘要翻译：树脂块具有在其前表面和后表面之间延伸并在其前后开口的处理溶液通道。导热构件分别面对粘合到树脂块的前表面和后表面，用于封闭通道。因此，树脂块和导热构件之间不存在空气，从而提高热交换的效率。仅通过将两个导热构件面对粘合到树脂块的敞开的前表面和后表面上来实现简单结构的喷嘴。温度控制板与树脂块一起保持导热填料以进行温度控制，由此通过导热构件有效地控制处理溶液通道中的处理溶液的温度。调节到期望温度的处理溶液从排出口输送到基板，以高精度进行基板处理。

6. 发明授权

US06440218B1 Coating solution applying method and apparatus 有权
标题翻译：涂布溶液施用方法和装置
公开(公告)号：US06440218B1
公开(公告)日：2002-08-27
申请号：US09450946
申请日：1999-11-29
申请人： Masakazu Sanada , Kayoko Nakano , Shigehiro Goto , Minobu Matsunaga
发明人： Masakazu Sanada , Kayoko Nakano , Shigehiro Goto , Minobu Matsunaga
IPC分类号： B05C1100
CPC分类号： H01L21/6715 , B05C11/08
摘要： An apparatus for applying a coating solution to a surface of a substrate to form a coating film of desired thickness thereon. The apparatus includes a rotary supporting device for supporting and spinning the substrate in horizontal posture, a solvent spraying device for spraying a solvent to the substrate, a coating solution supplying device for supplying the coating solution to the substrate, a storage device for storing a processing program stipulating varied points and periods of time, a timer acting as a reference for each point or period of time stored in the storage, and a controller operable to perform controls based on the points and periods of time and with reference to the timer.
摘要翻译：一种用于将涂布溶液施加到基材表面以在其上形成所需厚度的涂膜的设备。该装置包括用于水平姿态地支撑和旋转基板的旋转支撑装置，用于向基板喷射溶剂的溶剂喷射装置，用于将涂布溶液供给到基板的涂布液供给装置，用于存储处理的存储装置规定不同点和时间段的程序，作为存储在存储器中的每个点或时间段的参考的定时器，以及可操作以基于时间点和时间参考定时器执行控制的控制器。

7. 发明授权

US08003919B2 Substrate heat treatment apparatus 有权
标题翻译：基板热处理装置
公开(公告)号：US08003919B2
公开(公告)日：2011-08-23
申请号：US11566489
申请日：2006-12-04
申请人： Shigehiro Goto , Keiji Matsuchika , Akira Yamaguchi , Akihiko Morita
发明人： Shigehiro Goto , Keiji Matsuchika , Akira Yamaguchi , Akihiko Morita
IPC分类号： F27B5/06 , F27D5/00 , H01L21/30 , H01L21/68 , G03F7/20
CPC分类号： H01L21/6838 , H01L21/6875
摘要： A heat-treating plate has support elements projecting from an upper surface thereof. The support elements are located at apexes of equilateral triangles arranged regularly and continually. The heat-treating plate and a substrate placed on the support elements form a minute space therebetween which is sealed by a sealer. The substrate is sucked by reducing the pressure in the minute space to a negative pressure through exhaust bores. Since all the distances between adjoining support elements are equal, the substrate sags in the same amount between these support elements. With such arrangement of the support elements, sagging of the substrate is inhibited efficiently by a reduced number of support elements.
摘要翻译：热处理板具有从其上表面突出的支撑元件。支撑元件位于定期和连续排列的等边三角形的顶点。放置在支撑元件上的热处理板和基板在它们之间形成微小空间，由密封件密封。通过将微小空间中的压力通过排气孔减压至负压来吸引基板。由于相邻支撑元件之间的所有距离相等，所以基板在这些支撑元件之间的相同量的下垂。通过这种支撑元件的布置，通过减少数量的支撑元件有效地抑制了基板的下垂。

8. 发明授权

US07267723B2 Treating solution supply nozzle, a substrate treating apparatus having this nozzle, and a method of manufacturing a treating solution supply nozzle 有权
标题翻译：处理溶液供给喷嘴，具有该喷嘴的基板处理装置以及处理液供给喷嘴的制造方法
公开(公告)号：US07267723B2
公开(公告)日：2007-09-11
申请号：US10836146
申请日：2004-04-30
申请人： Shigehiro Goto , Hiroshi Kobayashi
发明人： Shigehiro Goto , Hiroshi Kobayashi
IPC分类号： B05B7/16 , B05C11/00
CPC分类号： H01L21/6715 , B05C11/08 , B05C11/1042
摘要： A resin block has a treating solution channel extending between and opening at front and back surfaces thereof. Heat conductive members are face-bonded to the front and back surfaces of the resin block, respectively, for closing the channel. Consequently, no air is present between the resin block and heat conduction members, thereby improving the efficiency of heat exchange. A nozzle of simple construction is realized only by face-bonding the two heat conductive members to the open front and rear surfaces of the resin block. Temperature control plates hold the heat conductive members along with the resin block to effect a temperature control, whereby the temperature of a treating solution in the treating solution channel is controlled effectively through the heat conductive members. The treating solution adjusted to a desired temperature is delivered from a discharge opening to a substrate for performing substrate treatment with high accuracy.
摘要翻译：树脂块具有在其前表面和后表面之间延伸并在其前后开口的处理溶液通道。导热构件分别面对粘合到树脂块的前表面和后表面，用于封闭通道。因此，树脂块和导热构件之间不存在空气，从而提高热交换的效率。仅通过将两个导热构件面对粘合到树脂块的敞开的前表面和后表面上来实现简单结构的喷嘴。温度控制板与树脂块一起保持导热构件以进行温度控制，从而通过导热构件有效地控制处理溶液通道中的处理溶液的温度。调节到期望温度的处理溶液从排出口输送到基板，以高精度进行基板处理。

9. 发明申请

US20070128889A1 SUBSTRATE HEAT TREATMENT APPARATUS 有权
标题翻译：基材热处理设备
公开(公告)号：US20070128889A1
公开(公告)日：2007-06-07
申请号：US11566507
申请日：2006-12-04
申请人： Shigehiro Goto , Keiji Matsuchika
发明人： Shigehiro Goto , Keiji Matsuchika
IPC分类号： H01L21/4763 , H01L21/00
CPC分类号： H01L21/67103 , H01L21/6838 , H01L21/68742 , H01L21/6875
摘要： A heat-treating plate has, arranged on the upper surface thereof, support elements for supporting a substrate, and a first sealer for closing lateral areas of a first space formed between the heat-treating plate and the substrate supported. Further, second sealers ring-shaped in plan view are arranged around openings of perforations accommodating transfer pins. The second sealers close lateral areas of second spaces opposed to the perforations. Gastightness of the first space excluding the second spaces is never impaired through the perforations. By exhausting gas from the first space through exhaust bores, the substrate is effectively sucked for heat treatment.
摘要翻译：热处理板在其上表面上布置有用于支撑基板的支撑元件，以及用于封闭形成在所述热处理板和所述基板之间形成的第一空间的横向区域的第一密封件。此外，平面图中环形的第二密封件围绕容纳传送销的穿孔的开口布置。第二个密封件封闭与穿孔相对的第二个空间的横向区域。不包括第二个空间的第一个空间的气密性绝对不会因穿孔而受损。通过从第一空间排出气体通过排气孔，基板被有效地吸入以进行热处理。

10. 发明申请

US20060289432A1 Substrate heat treatment apparatus 有权
标题翻译：基板热处理装置
公开(公告)号：US20060289432A1
公开(公告)日：2006-12-28
申请号：US11417691
申请日：2006-05-03
申请人： Akihiko Morita , Shigehiro Goto , Keiji Matsuchika
发明人： Akihiko Morita , Shigehiro Goto , Keiji Matsuchika
IPC分类号： F27B5/14 , F27D11/00
CPC分类号： F27B17/0025 , F27B5/04 , F27D3/0084 , H01L21/67109 , H01L21/67126 , H01L21/68735 , H01L21/68742 , H01L21/6875
摘要： A substrate heat treatment apparatus for heat-treating a substrate includes a bake plate having projections on an upper surface thereof, a seal unit disposed peripherally of the upper surface of the bake plate for closing a lateral area of a minute space formed between a lower surface of the substrate and the upper surface of the bake plate when the substrate is placed on the bake plate, and exhaust bores for exhausting gas from the minute space. The substrate placed on the bake plate is heat-treated in a state of the gas exhausted from the minute space through the exhaust bores.
摘要翻译：用于热处理基板的基板热处理装置包括：在其上表面上具有突起的烘烤板;密封单元，设置在烘烤板的上表面周围，用于封闭在下表面之间形成的微小空间的横向区域的基板和烘烤板的上表面，以及用于从微小空间排出气体的排气孔。放置在烘烤板上的基板在通过排气孔从微小空间排出的气体的状态下进行热处理。

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