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    • 1. 发明申请
    • SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
    • 基板处理装置和基板处理方法
    • US20140065309A1
    • 2014-03-06
    • US13965501
    • 2013-08-13
    • Masahito KASHIYAMAKoji NISHIYAMA
    • Masahito KASHIYAMAKoji NISHIYAMA
    • G03F7/16
    • G03F7/16H01L21/67028H01L21/67046H01L21/6838
    • Transport mechanisms are respectively provided in first and second processing blocks. Each transport mechanism has a hand. The hand holds the other surface of a substrate without coming into contact with an edge of the substrate. The hand is moved such that the substrate is transported between an adhesion reinforcement processing unit or a cooling unit and a coating processing unit or a development processing unit. In the adhesion reinforcement processing unit and the cooling unit, temperature processing is performed on the substrate while the back surface of the substrate is held by suction. In the coating processing unit and the development processing unit, a processing liquid is supplied to the main surface of the substrate while the back surface of the substrate is held by suction by a spin chuck.
    • 传送机构分别设置在第一处理块和第二处理块中。 每个运输机构都有一只手。 手握住基板的另一个表面而不与基板的边缘接触。 移动手,使得基材在粘合强化处理单元或冷却单元与涂布处理单元或显影处理单元之间传送。 在粘合强化处理单元和冷却单元中,通过抽吸来保持基板的背面的温度处理。 在涂布处理单元和显影处理单元中,通过旋转卡盘的吸附保持基板的背面,将处理液供给到基板的主面。
    • 4. 发明授权
    • Substrate processing apparatus and substrate processing method
    • 基板加工装置及基板处理方法
    • US09508573B2
    • 2016-11-29
    • US13624536
    • 2012-09-21
    • Masahito KashiyamaShigehiro GotoTomohiro MatsuoTomohiro Goto
    • Masahito KashiyamaShigehiro GotoTomohiro MatsuoTomohiro Goto
    • H01L21/67H01L21/68
    • H01L21/6715H01L21/67259H01L21/681
    • A processing liquid is supplied onto a substrate rotated by a spin chuck in a coating processing unit so that a film of the processing liquid is formed, and a rinse liquid is supplied to a peripheral edge of the substrate so that a processing liquid on the peripheral edge of the substrate is removed. An edge cut width between a position of an outer peripheral portion of the substrate rotated by the spin chuck in an edge exposure unit and a position of an outer peripheral portion of a film on the substrate is detected. Based on the detected edge cut width, a positional deviation of the center of the substrate held in the spin chuck from a rotation center of the spin chuck in the coating processing unit is determined while a supply state of the rinse liquid by an edge rinse nozzle is determined.
    • 将处理液体供给到由涂布处理单元中的旋转卡盘旋转的基板上,从而形成处理液体的膜,并且将冲洗液体供给到基板的周缘,使得周边的处理液 去除衬底的边缘。 检测由边缘曝光单元中的旋转卡盘旋转的基板的外周部的位置与基板上的膜的外周部的位置之间的边缘切割宽度。 基于检测到的边缘切割宽度,确定保持在旋转卡盘中的基板的中心与涂布处理单元中的旋转卡盘的旋转中心的位置偏差,同时通过边缘冲洗喷嘴的冲洗液体的供给状态 决心,决意,决定。
    • 8. 发明授权
    • Substrate processing apparatus and substrate processing method
    • 基板加工装置及基板处理方法
    • US09465293B2
    • 2016-10-11
    • US13965501
    • 2013-08-13
    • Masahito KashiyamaKoji Nishiyama
    • Masahito KashiyamaKoji Nishiyama
    • H01L21/67G03F7/16H01L21/683
    • G03F7/16H01L21/67028H01L21/67046H01L21/6838
    • Transport mechanisms are respectively provided in first and second processing blocks. Each transport mechanism has a hand. The hand holds the other surface of a substrate without coming into contact with an edge of the substrate. The hand is moved such that the substrate is transported between an adhesion reinforcement processing unit or a cooling unit and a coating processing unit or a development processing unit. In the adhesion reinforcement processing unit and the cooling unit, temperature processing is performed on the substrate while the back surface of the substrate is held by suction. In the coating processing unit and the development processing unit, a processing liquid is supplied to the main surface of the substrate while the back surface of the substrate is held by suction by a spin chuck.
    • 传送机构分别设置在第一处理块和第二处理块中。 每个运输机构都有一只手。 手握住基板的另一个表面而不与基板的边缘接触。 移动手,使得基材在粘合强化处理单元或冷却单元与涂布处理单元或显影处理单元之间传送。 在粘合强化处理单元和冷却单元中,通过抽吸来保持基板的背面的温度处理。 在涂布处理单元和显影处理单元中,通过旋转卡盘的吸附保持基板的背面,将处理液供给到基板的主面。
    • 9. 发明申请
    • ALIGNMENT DEVICE AND SUBSTRATE PROCESSING APPARATUS
    • 对准装置和基板处理装置
    • US20140196663A1
    • 2014-07-17
    • US14132334
    • 2013-12-18
    • Masahito KASHIYAMA
    • Masahito KASHIYAMA
    • B05C13/00
    • H01L21/681
    • An aligner includes a plurality of substrate rotators and a shaft member. Each substrate rotator includes a holder, a notch detector, an electromagnetic clutch and a driving belt. Each holder sucks the back surface of the substrate under vacuum and horizontally holds the substrate. Each notch detector detects a notch formed at the substrate, and supplies a detection result to the corresponding electromagnetic clutch as a detection signal. One end of the shaft member is connected to a motor. The shaft member is continuously rotated by the motor. Each electromagnetic clutch switches to a connection state in which rotational force of an inner periphery is transmitted to an outer periphery and a disconnection state in which rotational force of the inner periphery is transmitted to the outer periphery according to a detection signal supplied from the notch detector.
    • 对准器包括多个基板旋转器和轴构件。 每个基板旋转器包括保持器,切口检测器,电磁离合器和驱动带。 每个支架在真空下吸附基板的背面并水平地保持基板。 每个切口检测器检测在基板处形成的切口,并将检测结果提供给相应的电磁离合器作为检测信号。 轴构件的一端连接到电动机。 轴构件由马达连续旋转。 每个电磁离合器根据从陷波检测器提供的检测信号切换到内周的旋转力传递到外周的连接状态和内周的旋转力向外周传递的断开状态 。