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    • 4. 发明授权
    • Piezoelectric device and method of manufacturing the same
    • 压电元件及其制造方法
    • US5982010A
    • 1999-11-09
    • US976452
    • 1997-11-25
    • Akihiko NambaTetsuyoshi OguraYoshihiro TomitaKazuo Eda
    • Akihiko NambaTetsuyoshi OguraYoshihiro TomitaKazuo Eda
    • H01L41/22H01L41/312H01L41/338H03H3/02H01L29/84
    • H03H3/02H01L41/312H01L41/338
    • A piezoelectric device is manufactured by: (1) mirror finishing surfaces of a first substrate and a second substrate made of a piezoelectric element; (2) forming grooves on at least one of the two surfaces of the first and second substrates; (3) joining the mirror-finished surfaces of the first substrate and the second substrate; (4) applying heat to the joined substrates and bonding them; (5) forming an opening on the first substrate so that a part of the exposed areas of the second substrate is exposed through the opening; (6) forming piezoelectric devices by forming electrodes on at least one of the second substrate through the opening and a corresponding area to the exposed area on the rear side of the second substrate; and (7) dividing the bonded substrates into portions each having one of the piezoelectric devices. Through this manufacturing method, piezoelectric devices with high yield ratios and high reliability can be obtained.
    • 压电器件通过以下制造:(1)第一衬底和由压电元件制成的第二衬底的镜面精加工表面; (2)在第一和第二基板的两个表面中的至少一个上形成凹槽; (3)连接第一基板和第二基板的镜面抛光面; (4)向接合的基片施加热量并将其粘合; (5)在所述第一基板上形成开口,使得所述第二基板的所述暴露区域的一部分通过所述开口露出; (6)通过在所述第二基板中的至少一个上通过所述开口形成电极并形成与所述第二基板的后侧上的暴露区域相对应的区域来形成压电装置; 和(7)将接合的衬底分成各自具有一个压电器件的部分。 通过该制造方法,可以获得高屈服比和高可靠性的压电装置。
    • 8. 发明授权
    • Displacement control actuator
    • 位移控制执行器
    • US5994821A
    • 1999-11-30
    • US978422
    • 1997-11-25
    • Katsumi ImadaTetsuro OtsuchiMasato SugimotoYoshihiro TomitaOsamu Kawasaki
    • Katsumi ImadaTetsuro OtsuchiMasato SugimotoYoshihiro TomitaOsamu Kawasaki
    • H01L41/09H01L41/04
    • H01L41/094
    • Rectangular piezoelectric substrates each of which has main surfaces opposed to each other, measures 50 .mu.m thick by 1 mm wide by 8 mm long, and is made of lithium niobate (LiNbO.sub.3), are directly bonded on the main surfaces so that their axes of polarization are set in directions reverse to each other, thereby composing a piezoelectric element. Electrodes which are 0.2 .mu.m thick and made of chromium-nickel are formed on the two main surfaces of the piezoelectric element opposed to each other, thereby resulting in a precision displacement control actuator of a bimorph type mechanical-electrical converter element. This configuration makes it possible to provide a compact precision displacement control actuator which has a large displacement and extremely small variations of characteristics such as displacement and resonance frequency.
    • 矩形压电基板各自具有彼此相对的主表面,其厚度为50μm厚×1mm×8mm长,由铌酸锂(LiNbO 3)构成,直接接合在主表面上,使得它们的轴线 极化被设置在彼此相反的方向上,从而构成压电元件。 在压电元件的两个主表面上形成厚度为0.2μm,由铬镍制成的电极,从而形成双压电晶片式机电转换元件的精密位移控制致动器。 这种构造使得可以提供一种紧凑的精确位移控制致动器,其具有大的位移和极小的位移和共振频率等特性的变化。
    • 9. 发明授权
    • Method of processing a piezoelectric device
    • 压电装置的处理方法
    • US5647932A
    • 1997-07-15
    • US601539
    • 1996-02-14
    • Yutaka TaguchiKazuo EdaAkihiro KanaboshiTetsuyoshi OguraYoshihiro Tomita
    • Yutaka TaguchiKazuo EdaAkihiro KanaboshiTetsuyoshi OguraYoshihiro Tomita
    • H03H3/02H01L21/30H01L21/304H01L21/306
    • H03H3/02Y10S148/012Y10S148/135
    • The following steps are performed when processing electronic components such as piezoelectric devices. At Step 1 inter-atom bond is created between a functional member such as a quartz crystal plate and a first substrate, and the functional member and the quartz crystal plate are directly joined together. At Step 2, the functional member and a second substrate are fixed together with an adhesive agent or by a direct bond. At Step 3, the first substrate is removed chemically or mechanically, with said functional member and said second substrate still being joined together. A step of polishing said functional member for the adjustment of thickness thereof may be done between Step 1 and Step 2. For example, a silicon dioxide thin film may be provided between the functional member and the first substrate. Since no adhesive layer exists between the functional member and the first substrate, this improves the degree of plane of the functional member when joined to the first substrate. Therefore, functional member thickness accuracy becomes extremely high and mass productivity is also improved.
    • 在处理诸如压电装置的电子部件时执行以下步骤。 在步骤1中,在诸如石英晶体板的功能部件和第一基板之间产生原子间键合,并且功能部件和石英晶体板直接接合在一起。 在步骤2中,功能部件和第二基板通过粘合剂或直接粘合固定在一起。 在步骤3中,第一衬底被化学或机械地移除,所述功能构件和所述第二衬底仍然连接在一起。 可以在步骤1和步骤2之间进行用于调整其厚度的抛光所述功能部件的步骤。例如,可以在功能部件和第一基板之间设置二氧化硅薄膜。 由于在功能部件和第一基板之间不存在粘接层,因此能够提高与第一基板接合时的功能部件的平面度。 因此,功能元件厚度精度变得非常高,并且也提高了批量生产率。