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1. 发明授权

US5647932A Method of processing a piezoelectric device 失效
标题翻译：压电装置的处理方法
公开(公告)号：US5647932A
公开(公告)日：1997-07-15
申请号：US601539
申请日：1996-02-14
申请人： Yutaka Taguchi , Kazuo Eda , Akihiro Kanaboshi , Tetsuyoshi Ogura , Yoshihiro Tomita
发明人： Yutaka Taguchi , Kazuo Eda , Akihiro Kanaboshi , Tetsuyoshi Ogura , Yoshihiro Tomita
IPC分类号： H03H3/02 , H01L21/30 , H01L21/304 , H01L21/306
CPC分类号： H03H3/02 , Y10S148/012 , Y10S148/135
摘要： The following steps are performed when processing electronic components such as piezoelectric devices. At Step 1 inter-atom bond is created between a functional member such as a quartz crystal plate and a first substrate, and the functional member and the quartz crystal plate are directly joined together. At Step 2, the functional member and a second substrate are fixed together with an adhesive agent or by a direct bond. At Step 3, the first substrate is removed chemically or mechanically, with said functional member and said second substrate still being joined together. A step of polishing said functional member for the adjustment of thickness thereof may be done between Step 1 and Step 2. For example, a silicon dioxide thin film may be provided between the functional member and the first substrate. Since no adhesive layer exists between the functional member and the first substrate, this improves the degree of plane of the functional member when joined to the first substrate. Therefore, functional member thickness accuracy becomes extremely high and mass productivity is also improved.
摘要翻译：在处理诸如压电装置的电子部件时执行以下步骤。在步骤1中，在诸如石英晶体板的功能部件和第一基板之间产生原子间键合，并且功能部件和石英晶体板直接接合在一起。在步骤2中，功能部件和第二基板通过粘合剂或直接粘合固定在一起。在步骤3中，第一衬底被化学或机械地移除，所述功能构件和所述第二衬底仍然连接在一起。可以在步骤1和步骤2之间进行用于调整其厚度的抛光所述功能部件的步骤。例如，可以在功能部件和第一基板之间设置二氧化硅薄膜。由于在功能部件和第一基板之间不存在粘接层，因此能够提高与第一基板接合时的功能部件的平面度。因此，功能元件厚度精度变得非常高，并且也提高了批量生产率。

2. 发明授权

US5747857A Electronic components having high-frequency elements and methods of manufacture therefor 失效
标题翻译：具有高频元件的电子部件及其制造方法
公开(公告)号：US5747857A
公开(公告)日：1998-05-05
申请号：US182561
申请日：1994-01-18
申请人： Kazuo Eda , Yutaka Taguchi , Akihiro Kanaboshi , Tetsuyoshi Ogura
发明人： Kazuo Eda , Yutaka Taguchi , Akihiro Kanaboshi , Tetsuyoshi Ogura
IPC分类号： H01L27/20 , H03B5/04 , H03B5/36 , H03H3/02 , H03H9/02 , H03H9/05 , H03H9/10 , H03H9/17 , H03H9/19 , H03H9/54 , H03H9/56 , H01L41/10 , H01L41/08
CPC分类号： H01L27/20 , H03B5/368 , H03H3/02 , H03H9/02102 , H03H9/02133 , H03H9/0542 , H03H9/1021 , H03H9/174 , H03H9/19 , H03H9/545 , H03H9/562 , H03H9/564 , H03B5/04
摘要： Integrated circuits utilizing piezoelectric elements can be advantageously constructed by bonding elements together via direct bonds. Such integrated circuits include an electro-acoustic hybrid integrated circuit such as a voltage controlled oscillator wherein a semiconductor substrate having an active element is bonded through direct bonding to a surface acoustic wave resonator or a quartz oscillator as an electro-acoustic element. A quartz device can also be provided which includes a quartz plate, excitation electrodes on opposite surfaces, and a holding member made of a material having a thermal expansion coefficient substantially equal to that of the quartz plate. The holding member is connected to the quartz plate by direct bonding without using any adhesives. Because the thermal expansion coefficients of the quartz plate and the holding member are equal, no thermal stress occurs in the bonding area. As a result, virtually no stress is applied to the quartz plate and the frequency-temperature characteristic can be improved. A piezoelectric filter according to the invention includes an oscillatory piezoelectric plate made of quartz, lithium tantalate, lithium niobate or lithium borate and having an oscillatory portion; a glass plate to which the piezoelectric plate is directly bonded; and first and second oscillatory electrode members which are provided on opposite faces of the oscillatory portion, respectively, such that at least one of the oscillatory electrode members is divided into a plurality of counter electrodes.
摘要翻译：利用压电元件的集成电路可以有利地通过直接结合将元件结合在一起而构成。这种集成电路包括诸如压控振荡器的电声混合集成电路，其中具有有源元件的半导体衬底通过直接接合结合到表面声波谐振器或作为电声元件的石英振荡器。还可以提供石英装置，其包括石英板，相对表面上的激励电极以及由具有基本上等于石英板的热膨胀系数的材料制成的保持构件。保持构件通过直接接合而不使用任何粘合剂连接到石英板。由于石英板和保持构件的热膨胀系数相等，所以在接合区域中不产生热应力。结果，几乎没有对石英板施加应力，并且可以提高频率 - 温度特性。根据本发明的压电滤波器包括由石英，钽酸锂，铌酸锂或硼酸锂制成并具有振荡部分的振荡压电板; 压电板直接接合的玻璃板; 以及第一和第二振荡电极部件，其分别设置在所述振荡部分的相对面上，使得所述振荡电极部件中的至少一个被分成多个对置电极。

3. 发明授权

US5668057A Methods of manufacture for electronic components having high-frequency elements 失效
标题翻译：具有高频元件的电子部件的制造方法
公开(公告)号：US5668057A
公开(公告)日：1997-09-16
申请号：US473932
申请日：1995-06-07
申请人： Kazuo Eda , Yutaka Taguchi , Akihiro Kanaboshi , Tetsuyoshi Ogura
发明人： Kazuo Eda , Yutaka Taguchi , Akihiro Kanaboshi , Tetsuyoshi Ogura
IPC分类号： H01L27/20 , H03B5/04 , H03B5/36 , H03H3/02 , H03H9/02 , H03H9/05 , H03H9/10 , H03H9/17 , H03H9/19 , H03H9/54 , H03H9/56 , H01L21/60
CPC分类号： H03H9/19 , H01L27/20 , H03B5/368 , H03H3/02 , H03H9/02102 , H03H9/02133 , H03H9/0542 , H03H9/1021 , H03H9/174 , H03H9/545 , H03H9/562 , H03H9/564 , H01L2224/48091 , H01L2924/1305 , H03B5/04
摘要： Integrated circuits utilizing piezoelectric elements can be advantageously constructed by bonding elements together via direct bonds. Such integrated circuits include an electro-acoustic hybrid integrated circuit such as a voltage controlled oscillator wherein a semiconductor substrate having an active element is bonded through direct bonding to a surface acoustic wave resonator or a quartz oscillator as an electro-acoustic element. A quartz device can also be provided which includes a quartz plate, excitation electrodes on opposite surfaces, and a holding member made of a material having a thermal expansion coefficient substantially equal to that of the quartz plate. The holding member is connected to the quartz plate by direct bonding without using any adhesives. Because the thermal expansion coefficients of the quartz plate and the holding member are equal, no thermal stress occurs in the bonding area. As a result, virtually no stress is applied to the quartz plate and the frequency-temperature characteristic can be improved. A piezoelectric filter according to the invention includes an oscillatory piezoelectric plate made of quartz, lithium tantalate, lithium niobate or lithium borate and having an oscillatory portion; a glass plate to which the piezoelectric plate is directly bonded; and first and second oscillatory electrode members which are provided on opposite faces of the oscillatory portion, respectively, such that at least one of the oscillatory electrode members is divided into a plurality of counter electrodes.
摘要翻译：利用压电元件的集成电路可以有利地通过直接结合将元件结合在一起而构成。这种集成电路包括诸如压控振荡器的电声混合集成电路，其中具有有源元件的半导体衬底通过直接接合结合到表面声波谐振器或作为电声元件的石英振荡器。还可以提供石英装置，其包括石英板，相对表面上的激励电极以及由具有基本上等于石英板的热膨胀系数的材料制成的保持构件。保持构件通过直接接合而不使用任何粘合剂连接到石英板。由于石英板和保持构件的热膨胀系数相等，所以在接合区域中不产生热应力。结果，几乎没有对石英板施加应力，并且可以提高频率 - 温度特性。根据本发明的压电滤波器包括由石英，钽酸锂，铌酸锂或硼酸锂制成并具有振荡部分的振荡压电板; 压电板直接接合的玻璃板; 以及第一和第二振荡电极部件，其分别设置在所述振荡部分的相对面上，使得所述振荡电极部件中的至少一个被分成多个对置电极。

4. 发明授权

US5666706A Method of manufacturing a piezoelectric acoustic wave device 失效
标题翻译：制造压电声波装置的方法
公开(公告)号：US5666706A
公开(公告)日：1997-09-16
申请号：US438966
申请日：1995-05-11
申请人： Yoshihiro Tomita , Akihiro Kanaboshi , Yutaka Taguchi , Kazuo Eda
发明人： Yoshihiro Tomita , Akihiro Kanaboshi , Yutaka Taguchi , Kazuo Eda
IPC分类号： H03H3/02 , H03H9/05 , H01L41/22
CPC分类号： H03H9/172 , H03H3/02 , Y10T29/42 , Y10T29/49812
摘要： A piezoelectric acoustic wave device includes a substrate and a piezoelectric plate. The piezoelectric plate includes a resonating part, and has a top electrode at least on the top surface of the resonating part. The substrate and the piezoelectric plate are directly bonded at an area where they are in contact with each other by a chemical bond such as a covalent bond and an ionic bond. A depression is formed in at least one of the substrate and the piezoelectric plate. The method of manufacturing the piezoelectric acoustic wave device includes the steps of forming a depression in at least one of the substrate and the piezoelectric plate, filling the depression with an intermediate support layer, cleaning the surfaces of the substrate and the piezoelectric plate to directly bond to each other by a chemical bond, forming electrodes, and removing the intermediate support layer.
摘要翻译：压电声波装置包括基板和压电板。压电板包括谐振部分，并且至少在谐振部分的顶表面上具有顶电极。基板和压电板通过诸如共价键和离子键的化学键彼此接触的区域直接结合。在基板和压电板中的至少一个上形成凹陷。制造压电声波装置的方法包括以下步骤：在至少一个基板和压电板中形成凹陷，用中间支撑层填充凹陷，清洁基板和压电板的表面直接键合通过化学键彼此形成电极，并除去中间支撑层。

5. 发明授权

US6018211A Surface acoustic wave device and method of manufacturing the same 失效
标题翻译：表面声波装置及其制造方法
公开(公告)号：US6018211A
公开(公告)日：2000-01-25
申请号：US921499
申请日：1997-09-02
申请人： Akihiro Kanaboshi , Masato Sugimoto , Yutaka Taguchi , Kazuo Eda
发明人： Akihiro Kanaboshi , Masato Sugimoto , Yutaka Taguchi , Kazuo Eda
IPC分类号： H03H9/05 , H01L41/08
CPC分类号： H03H9/1092
摘要： A surface acoustic wave device is manufactured by directly or indirectly bonding a lid to a substrate having a surface acoustic wave element to seal the element under the lid. The lid is made of at least one material selected from the group comprising lithium niobate, lithium tantalete, lithium borate, glass and quartz. The substrate is made of at least one material selected from the group comprising quartz, lithium niobate, lithium tantalete and lithium borate.
摘要翻译：通过将盖直接或间接地接合到具有表面声波元件的基板上来密封盖下的元件来制造表面声波装置。该盖由选自铌酸锂，钽酸锂，硼酸锂，玻璃和石英的组中的至少一种材料制成。衬底由选自石英，铌酸锂，钽酸锂和硼酸锂的组中的至少一种材料制成。

6. 发明授权

US5925973A Electronic component and method for producing the same 失效
标题翻译：电子元件及其制造方法
公开(公告)号：US5925973A
公开(公告)日：1999-07-20
申请号：US787362
申请日：1997-01-22
申请人： Kazuo Eda , Yoshihiro Tomita , Akihiro Kanaboshi , Masato Sugimoto
发明人： Kazuo Eda , Yoshihiro Tomita , Akihiro Kanaboshi , Masato Sugimoto
IPC分类号： C04B37/00 , H01L21/02 , H01L27/12 , H01L41/04 , H01L41/18 , H03H3/02 , H03H3/08 , H03H9/10 , H03H9/17 , H03H9/25 , H01L41/08
CPC分类号： H03H9/0595 , H01L41/053 , H01L41/312 , H03H3/02 , H03H3/08 , H03H9/1035 , Y10T29/42
摘要： An electronic component of the present invention includes a first substrate, a second substrate, a first conductive layer constituting a terminal electrode on a first surface of the first substrate, and a first insulating layer formed on the first conductive layer, wherein the first insulating layer and the second substrate are directly bonded to each other by at least one bond selected from the group consisting of a hydrogen bond and a covalent bond.
摘要翻译：本发明的电子元件包括第一基板，第二基板，构成第一基板的第一表面上的端子电极的第一导电层和形成在第一导电层上的第一绝缘层，其中第一绝缘层并且第二底物通过选自氢键和共价键的至少一个键直接键合。

7. 发明授权

US5771555A Method for producing an electronic component using direct bonding 失效
标题翻译：使用直接接合制造电子部件的方法
公开(公告)号：US5771555A
公开(公告)日：1998-06-30
申请号：US433687
申请日：1995-05-04
申请人： Kazuo Eda , Yoshihiro Tomita , Akihiro Kanaboshi , Masato Sugimoto
发明人： Kazuo Eda , Yoshihiro Tomita , Akihiro Kanaboshi , Masato Sugimoto
IPC分类号： C04B37/00 , H01L21/02 , H01L27/12 , H01L41/04 , H01L41/18 , H03H3/02 , H03H3/08 , H03H9/10 , H03H9/17 , H03H9/25 , H01L41/22
CPC分类号： H03H9/0595 , H01L41/053 , H01L41/312 , H03H3/02 , H03H3/08 , H03H9/1035 , Y10T29/42
摘要： An electronic component includes a first substrate and a second substrate. A first conductive layer constituting a terminal electrode is formed on a first surface of the first substrate. A first insulating layer is formed on the first conductive layer. The first insulating layer and the second substrate are directly bonded to each other by at least one bond selected from the group consisting of a hydrogen bond and a covalent bond.
摘要翻译：电子部件包括第一基板和第二基板。构成端子电极的第一导电层形成在第一基板的第一表面上。在第一导电层上形成第一绝缘层。第一绝缘层和第二基板通过选自由氢键和共价键组成的组中的至少一个键彼此直接键合。

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