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    • 1. 发明授权
    • Human betacellulin-specific antibodies and uses thereof
    • 人类细胞素特异性抗体及其用途
    • US06183971B2
    • 2001-02-06
    • US08663191
    • 1996-06-11
    • Reiko SasadaTatsuya WatanabeYukio Toyoda
    • Reiko SasadaTatsuya WatanabeYukio Toyoda
    • G01N3353
    • C07K14/475A61K38/00C07K16/22C07K2317/73Y10S435/81
    • Disclosed are an antibody which have a binding activity to human betacellulin protein or a mutein thereof with specificity; especially a monoclonal antibody which does not have cross reactitivity with human epidermal growth factor (EGF) and human transforming growth factor a (TGF-&agr;), belongs to the immunoglobulin class of IgG, and,specifically binds to human betacellulin protein to neutralize biological activity thereof; a hybridoma for producing the monoclonal antibody; and a method for producing the monoclonal antibody. Said monoclonal antibody neutralizes biological activity of a human BTC protein, and bind to the protein with high sensitivity and specificity, so that they can be used as a therapeutic agent for diseases such as arterial sclerosis and cancers, and also used as a reagent for assaying the human BTC protein or a mutein thereof and as a diagnostic agent for diabetes or complications thereof.
    • 公开了具有与特异性的人β细胞素蛋白或其突变蛋白结合活性的抗体; 特别是与人表皮生长因子(EGF)和人转化生长因子α(TGF-α)不具有交叉反应性的单克隆抗体属于IgG的免疫球蛋白类,并且特异性结合人β细胞素蛋白以中和生物活性 的; 用于产生单克隆抗体的杂交瘤; 和单克隆抗体的制造方法。 所述单克隆抗体中和人BTC蛋白的生物活性,并以高灵敏度和特异性结合蛋白质,使其可用作疾病如动脉硬化和癌症的治疗剂,并且还可用作测定试剂 人BTC蛋白或其突变蛋白,并且作为糖尿病的诊断剂或其并发症。
    • 3. 发明授权
    • Method of forming fine structure on compound semiconductor with inclined
ion beam etching
    • 用倾斜离子束蚀刻在化合物半导体上形成精细结构的方法
    • US5376225A
    • 1994-12-27
    • US2973
    • 1993-01-11
    • Shinichi WakabayashiHitomaro TougouYukio Toyoda
    • Shinichi WakabayashiHitomaro TougouYukio Toyoda
    • H01L21/302H01L21/3065H01L21/308H01L21/335H01S5/00H01L21/00
    • B82Y10/00H01L21/3081H01L29/66469Y10S438/947Y10S438/962
    • A first method of forming a fine structure on a compound semiconductor for providing vertical side wall surfaces of a wire is as follows:One side wall surface of a wire is formed by applying an ion beam for etching with a predetermined incident angle on the side of this side wall surface to a surface of a compound semiconductor layer having a multiquantum well structure, covered with a first mask to from this side wall surface; and then, the other side wall surface is formed by applying the ion beam with the predetermined incident angle from the side of the other side wall surface to be formed after removal of the first mask and forming a second mask for forming the other side wall surface. In a second method, a third mask having a stripe pattern is formed on the surface of the compound semiconductor; one side of the wire is formed by first etching with the slantwise incident ion beam. The second etching is also formed similarly by the ion beam with the one side wall surface is protected. In the third method, a substantially circle mask is formed; and etched with the slantwise incident ion beam with the work being rotated.
    • 在用于提供线的垂直侧壁表面的化合物半导体上形成精细结构的第一种方法如下:线的一个侧壁表面通过以预定的入射角施加用于蚀刻的离子束 该侧壁表面到具有多量子阱结构的化合物半导体层的表面,被覆有来自该侧壁表面的第一掩模; 然后,通过在去除第一掩模之后从另一侧壁表面侧施加预定入射角的离子束形成另一侧壁表面,并形成用于形成另一侧壁表面的第二掩模 。 在第二种方法中,在化合物半导体的表面上形成具有条纹图案的第三掩模; 线的一侧通过用倾斜入射离子束进行第一次蚀刻而形成。 第二蚀刻也通过离子束类似地形成,其中一个侧壁表面被保护。 在第三种方法中,形成大致圆形的掩模; 并在工作旋转的情况下用倾斜入射离子束进行蚀刻。
    • 4. 发明授权
    • Fabricating method of micro lens
    • 微晶镜的制作方法
    • US5316640A
    • 1994-05-31
    • US896018
    • 1992-06-09
    • Shinichi WakabayashiHitomaro TougouYukio ToyodaYoshimasa Ohki
    • Shinichi WakabayashiHitomaro TougouYukio ToyodaYoshimasa Ohki
    • G02B6/124H01L21/00
    • G02B6/1245
    • A testing sample is formed in a three-story structure consisting of a photo-resist 13, a silicon dioxide film 12, and a GaAs substrate 11. The pattern of the photo-resist 13 is transferred onto the silicon dioxide film 12 by effecting the photo-resist 13 as a mask. Thus obtained silicon dioxide film mask 14 and the GaAs substrate 11 are processed in compliance with a reactive ion beam etching method; that is, the silicon dioxide film mask 14 and the GaAs substrate 11 are irradiated by the chlorine ion beam 15. The silicon dioxide film and the GaAs substrate are gradually etched by the irradiation of the chlorine ion beam 15. In this case, the etching is differently developed in two regions. In one region which is not covered by the mask, the etching advances uniformly in a normal direction with respect to the GaAs substrate at a certain etching rate. On the other hand, in the other region which is covered by the mask, the silicon dioxide film is gradually etched first of all, and the tapered portion of the silicon dioxide film is completely etched earlier than other portion of the silicon dioxide film. Then, the GaAs surface is exposed to the chlorine ion beam at the portion the silicon dioxide film is removed and, in turn, the GaAs substrate is gradually etched by being directly irradiated by the chlorine beam. And, when the silicon dioxide film mask is completely removed, the micro lens is finally formed on the GaAs substrate.
    • 测试样品形成为由光致抗蚀剂13,二氧化硅膜12和GaAs衬底11组成的三层结构。光致抗蚀剂13的图案通过实施 光阻13作为掩模。 由此获得的二氧化硅膜掩模14和GaAs衬底11根据反应离子束蚀刻方法进行加工; 也就是说,二氧化硅膜掩模14和GaAs衬底11被氯离子束15照射。二氧化硅膜和GaAs衬底通过氯离子束15的照射逐渐蚀刻。在这种情况下,蚀刻 在两个地区有不同的发展。 在未被掩模覆盖的一个区域中,蚀刻以一定的蚀刻速率相对于GaAs衬底在法线方向均匀地前进。 另一方面,在由掩模覆盖的其他区域中,首先逐渐蚀刻二氧化硅膜,并且二氧化硅膜的锥形部分比二氧化硅膜的其它部分更早地完全蚀刻。 然后,在除去二氧化硅膜的部分,将GaAs表面暴露于氯离子束,并且继而通过直接用氯束照射GaAs衬底而逐渐蚀刻。 并且,当完全除去二氧化硅膜掩模时,最终在GaAs衬底上形成微透镜。