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    • 1. 发明授权
    • Biomarkers for aggressive prostate cancer
    • 用于侵略性前列腺癌的生物标志物
    • US09594086B2
    • 2017-03-14
    • US14006503
    • 2012-03-22
    • Hui ZhangYuan TianDaniel W. ChanJing Chen
    • Hui ZhangYuan TianDaniel W. ChanJing Chen
    • G01N33/53G01N33/68G01N33/574
    • G01N33/6893G01N33/57434
    • The present invention relates to the field of biomarkers and, more specifically, to biomarkers useful in diagnosing aggressive prostate cancer. In specific embodiments, a method for diagnosing aggressive prostate cancer in a patient comprises (a) measuring the levels of one or more biomarkers in a sample collected from the patient; and (b) comparing the levels of the one or more biomarkers with predefined levels of the same biomarkers that correlate to a patient having aggressive prostate cancer and predefined levels of the same biomarkers that correlate to a patient not having aggressive prostate cancer, wherein a correlation to one of the predefined levels provides the diagnosis. In a specific embodiment, the one or more biomarkers may comprise cathepsin-L (CTSL), periostin, microfibrillar-associated protein 4 (MFAP4), collagen XII, neprilysin, clusterin, neutrophil gelatinase associated lipocalin (NGAL), epithelial cell activating molecule (EpCAM), prostate specific antigen (PSA), membrane metallo-endopeptidase (MME) and asporin (ASPN).
    • 本发明涉及生物标记领域,更具体地涉及可用于诊断侵略性前列腺癌的生物标志物。 在具体实施方案中,用于诊断患者中侵袭性前列腺癌的方法包括(a)测量从患者收集的样品中的一种或多种生物标志物的水平; 和(b)将一种或多种生物标志物的水平与与具有侵袭性前列腺癌的患者相关的相同生物标志物的预定水平和与不具有侵袭性前列腺癌的患者相关的相同生物标志物的预定水平进行比较,其中相关性 到其中一个预定义的级别提供诊断。 在一个具体的实施方案中,一种或多种生物标志物可以包含组织蛋白酶-L(CTSL),骨膜素,微原纤维相关蛋白4(MFAP4),胶原XII,起泡蛋白,聚集蛋白,嗜中性粒细胞明胶酶相关脂质运载蛋白(NGAL),上皮细胞活化分子 EpCAM),前列腺特异性抗原(PSA),膜金属内肽酶(MME)和阿泊菌(ASPN)。
    • 4. 发明申请
    • ANTIMICROBIAL POLYMERS AND THEIR USES
    • 抗微生物聚合物及其用途
    • US20110124772A1
    • 2011-05-26
    • US12994836
    • 2009-05-26
    • Shanger WangRobert S. WardYuan TianLi LiKeith MccreaJames ParakkaRobert L. Jones, JR.
    • Shanger WangRobert S. WardYuan TianLi LiKeith MccreaJames ParakkaRobert L. Jones, JR.
    • C09D175/04C08G71/04
    • A01N33/12A01N47/44A01N25/10A01N2300/00
    • Polymers with non-leaching antimicrobial activity and their use as surface coatings or bulk resins for medical devices. The antimicrobial polymers are prepared with antimicrobial moieties covalently bonded to a polymer chain end or to a polymer backbone at a side chain end. The antimicrobial moiety-containing endgroups include surface active (or surface assembling) moieties which promote enrichment of antimicrobial endgroups at the polymer surface and thus formation of an antimicrobially active surface. Polymers with built-in antimicrobial endgroups can be used as bulk resins, as antimicrobial additives, or as infection preventative coatings in the manufacture of medical devices (e.g., catheters, vascular access devices, peripheral lines, IV sites, drains, gastric feeding and tubes, and other implantable devices). Such materials can also be used as antimicrobial and antifouling coatings on structures in contact with microorganism in environments that require control of biofilm formation, such as marine products.
    • 具有非浸出抗菌活性的聚合物及其用作医疗器械的表面涂层或体积树脂。 抗微生物聚合物通过共价键合到聚合物链末端的抗微生物部分或在侧链末端与聚合物主链一起制备。 含抗微生物部分的端基包括表面活性(或表面组装)部分,其促进抗微生物端基在聚合物表面的富集,从而形成抗微生物活性表面。 具有内置抗微生物端基的聚合物可用作散装树脂,作为抗微生物添加剂,或作为医疗器械制造中的感染预防性涂层(例如,导管,血管通路装置,外围线,IV部位,下水道,胃饲和管 ,和其他可植入装置)。 在需要控制生物膜形成的环境中,例如海产品,这些材料也可用作与微生物接触的结构上的抗微生物和防污涂料。
    • 5. 发明申请
    • SILICONE HYDROGELS FOR TISSUE ADHESIVES AND TISSUE DRESSING APPLICATIONS
    • 用于组织粘合剂和组织粘合应用的硅胶水凝胶
    • US20110086077A1
    • 2011-04-14
    • US12745509
    • 2008-11-21
    • Keith R. McCreaRobert S. WardYuan Tian
    • Keith R. McCreaRobert S. WardYuan Tian
    • A61L15/22A61K38/39A61P17/02
    • A61L15/60A61L15/225A61L15/26A61L26/0019A61L26/0076A61L26/008C08L83/04
    • A silicone hydrogel formulation may contains random and/or block copolymers or oligomers or macromers. The silicone copolymer is copolymerized or blended with other polymers or monomers or macromers to obtain final formulation. The silicone hydrogel may contain crosslinking groups to provide a complete or partially crosslinked final structure. The silicone hydrogel formulation may be pre-formed as a film or other structure, or it may be polymerized during application as in the case of an adhesive formulation. A wound dressing comprising a silicone hydrogel formed as a film, either prior to application to a wound or in situ on a wound, which film has gas permeability, moisture permeability, and high water content, wherein said silicone hydrogel is formed from a polymerizable silicone such as a difunctional polydimethylsiloxane methacrylate and crosslinking agents such as N,N-dimethyllacrylamide (DMA), 2-hydroxyethyl methacrylate (HEMA), and trimethylsiloxy silane (TRIS).
    • 硅氧烷水凝胶制剂可以含有无规和/或嵌段共聚物或低聚物或大分子单体。 硅氧烷共聚物与其它聚合物或单体或大分子单体共聚或共混以获得最终配方。 硅氧烷水凝胶可以含有交联基团以提供完全或部分交联的最终结构。 硅氧烷水凝胶制剂可以预先形成为膜或其它结构,或者可以在使用时聚合,如在粘合剂制剂的情况下。 一种伤口敷料,其包含在施加到伤口之前或原位在伤口上形成的膜的硅酮水凝胶,该膜具有透气性,透湿性和高含水量,其中所述硅氧水凝胶由可聚合硅氧烷形成 例如甲基丙烯酸二官能聚二甲基硅氧烷和N,N-二甲基丙烯酰胺(DMA),甲基丙烯酸2-羟乙酯(HEMA)和三甲基甲硅烷氧基硅烷(TRIS)等交联剂。
    • 7. 发明授权
    • Control of polymer surface molecular architecture via amphipathic endgroups
    • 通过两亲性端基控制聚合物表面分子结构
    • US07671162B2
    • 2010-03-02
    • US11211734
    • 2005-08-26
    • Robert S. WardKeith R. McCreaYuan TianJames P. Parakka
    • Robert S. WardKeith R. McCreaYuan TianJames P. Parakka
    • C08G18/00C08G77/04C08G77/22
    • C08G18/6287A61L27/18A61L29/06A61L31/06C08G18/0823C08G18/12C08G18/283C08G18/2865C08G18/289C08G18/5024C08G18/5039C08G18/6283C08G18/6795C08L75/04C08G18/3228
    • Polymers whose surfaces are modified by endgroups that include amphipathic surface-modifying moieties. An amphipathic endgroup of a polymer molecule is an endgroup that contains at least two moieties of significantly differing composition, such that the amphipathic endgroup spontaneously rearranges its positioning in a polymer body to position the moiety on the surface of the body, depending upon the composition of the medium with which the body is in contact, when that re-positioning causes a reduction in interfacial energy. An example of an amphipathic surface-modifying endgroup is one that has both a hydrophobic moiety and a hydrophilic moiety in a single endgroup. For instance, a hydrophilic poly(ethylene oxide) terminated with a hydrophilic hydroxyl group is not surface active in air when the surface-modifying endgroup is bonded to a more hydrophobic base polymer. If the hydroxyl group on the oligomeric poly(ethylene oxide) is replaced by a hydrophobic methoxy ether terminus, the poly(ethylene oxide) becomes surface active in air, and allows the poly(ethylene oxide) groups to crystallize in the air-facing surface. In this example, immersion in water destroys the crystallinity as the poly(ethylene oxide) sorbs water and the hydrophobic methoxy group retreats below the surface of the polymer. Also disclosed are methods and articles of manufacture that make use of these polymers.
    • 其表面被包括两亲表面改性部分的端基修饰的聚合物。 聚合物分子的两亲端基是含有至少两个具有显着不同组成的部分的端基,使得两亲性端基在聚合物体中自发地重排其定位,以将该部分定位在身体的表面上,这取决于 当该重新定位导致界面能量降低时,与身体接触的介质。 两亲性表面改性端基的实例是在单个端基具有疏水部分和亲水部分的实例。 例如,当表面改性端基键合到更疏水的基础聚合物上时,用亲水羟基封端的亲水性聚(环氧乙烷)在空气中不是表面活性的。 如果低聚聚(环氧乙烷)上的羟基被疏水性甲氧基醚末端所代替,则聚(环氧乙烷)在空气中变得表面活性,并允许聚(环氧乙烷)基团在面向空气的表面中结晶 。 在该实施例中,当聚(环氧乙烷)吸附水和疏水性甲氧基在聚合物表面下方退缩时,浸入水中会破坏结晶度。 还公开了利用这些聚合物的方法和制品。
    • 9. 发明申请
    • PROCESS AND COMPOSITION FOR PASSIVATING A SUBSTRATE DURING ELECTROCHEMICAL MECHANICAL POLISHING
    • 电化学机械抛光过程中用于剥离基材的方法和组合
    • US20070144915A1
    • 2007-06-28
    • US11613918
    • 2006-12-20
    • Yuan TianRenhe JiaFeng LiuYongqi HuStan TsaiLiang-Yuh ChenRobert Ewald
    • Yuan TianRenhe JiaFeng LiuYongqi HuStan TsaiLiang-Yuh ChenRobert Ewald
    • B23H7/00H05K3/07
    • C25F3/02B23H5/08H01L21/32125
    • Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In one embodiment, a method of electrochemically processing a substrate using a conductive polishing article is provided. The method includes disposing a substrate having a conductive material layer formed thereon in a process apparatus comprising a cathode coupled to the conductive polishing article and an anode, wherein the substrate is in electrical contact with the anode, supplying a polishing composition comprising a cathodic inhibitor and an anodic inhibitor, forming a protective film on the cathode to prevent corrosion of the cathode, and polishing the substrate. In another embodiment, a composition for processing a substrate having a conductive material layer disposed thereon is provided which composition includes a corrosion inhibitor selected from the group of an amino acid based inhibitor, a polymeric based corrosion inhibitor, an oxidizer, a chelating inhibitor or combinations thereof.
    • 提供了用于处理其上设置有导电材料层的基板的组合物和方法。 在一个实施例中,提供了使用导电抛光制品电化学处理衬底的方法。 该方法包括将包括形成在其上的导电材料层的衬底放置在包括耦合到导电抛光制品的阴极和阳极的处理装置中,其中衬底与阳极电接触,提供包含阴极抑制剂的抛光组合物, 阳极抑制剂,在阴极上形成保护膜以防止阴极腐蚀,并抛光衬底。 在另一个实施方案中,提供了一种用于处理其上设置有导电材料层的基材的组合物,其组成包括选自氨基酸基抑制剂,聚合物基腐蚀抑制剂,氧化剂,螯合抑制剂或组合的腐蚀抑制剂 其中。
    • 10. 发明申请
    • Method and composition for polishing a substrate
    • 抛光基材的方法和组合物
    • US20060169597A1
    • 2006-08-03
    • US11356352
    • 2006-02-15
    • Feng LiuTianbao DuAlain DuboustWei-Yung HsuRobert EwaldYuan TianYou WangStan Tsai
    • Feng LiuTianbao DuAlain DuboustWei-Yung HsuRobert EwaldYuan TianYou WangStan Tsai
    • B23H9/00B23H7/00
    • C25F3/02B23H5/08
    • Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition includes an acid based electrolyte system, a corrosion inhibitor having an azole group, an organic acid salt, a pH adjusting agent to provide a pH between about 2 and about 10, and a solvent, and a solvent. The composition may be used in a conductive material removal process including disposing a substrate having a conductive material layer formed thereon in a process apparatus comprising an electrode, providing the composition between the electrode and substrate, applying a bias between the electrode and the substrate, and removing conductive material from the conductive material layer. The polishing compositions and methods described herein improve the effective removal rate of materials from the substrate surface, such as copper, with a reduction in planarization type defects and yielding a desirable surface finish.
    • 提供了抛光组合物和从衬底表面去除导电材料的方法。 在一个方面,组合物包括酸基电解质体系,具有唑基的腐蚀抑制剂,有机酸盐,pH调节剂以提供约2至约10的pH以及溶剂和溶剂。 该组合物可以用于导电材料去除工艺中,包括在包括电极的工艺设备中设置其上形成有导电材料层的衬底,在电极和衬底之间提供组合物,在电极和衬底之间施加偏压,以及 从导电材料层去除导电材料。 本文所述的抛光组合物和方法提高了材料从衬底表面(例如铜)的有效去除速率,同时平坦化型缺陷减少并产生理想的表面光洁度。