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    • 9. 发明授权
    • Method of manufacturing a flash memory device having compensation members formed on edge portions of a tunnel oxide layer
    • 制造具有形成在隧道氧化物层的边缘部分上的补偿部件的闪存装置的方法
    • US07608509B2
    • 2009-10-27
    • US11494439
    • 2006-07-27
    • Chul-Sung KimYu-Gyun ShinBon-Young KooSung-Kweon BaekYoung-Jin Noh
    • Chul-Sung KimYu-Gyun ShinBon-Young KooSung-Kweon BaekYoung-Jin Noh
    • H01L21/336H01L29/788
    • H01L29/7881H01L27/115H01L27/11521H01L29/42336
    • In a semiconductor device and a method of manufacturing the semiconductor device, preliminary isolation regions having protruded upper portions are formed on a substrate to define an active region. After an insulation layer is formed on the active region, a first conductive layer is formed on the insulation layer. The protruded upper portions of the preliminary isolation regions are removed to form isolation regions on the substrate and to expose sidewalls of the first conductive layer, and compensation members are formed on edge portions of the insulation layer. The compensation members may complement the edge portions of the insulation layer that have thicknesses substantially thinner than that of a center portion of the insulation layer, and may prevent deterioration of the insulation layer. Furthermore, the first conductive layer having a width substantially greater than that of the active region may enhance a coupling ratio of the semiconductor device. Thus, the semiconductor device may have improved electrical characteristics and reliability.
    • 在半导体器件和半导体器件的制造方法中,在衬底上形成具有突出的上部的预备隔离区以限定有源区。 在有源区上形成绝缘层之后,在绝缘层上形成第一导电层。 去除预分离区域的突出的上部,以在衬底上形成隔离区域并暴露第一导电层的侧壁,并且补偿构件形成在绝缘层的边缘部分上。 补偿构件可以补充绝缘层的边缘部分,该边缘部分的厚度基本上比绝缘层的中心部分的厚度更薄,并且可以防止绝缘层的劣化。 此外,具有基本上大于有源区的宽度的第一导电层可以增强半导体器件的耦合比。 因此,半导体器件可以具有改善的电特性和可靠性。