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    • 1. 发明申请
    • VACUUM THIN FILM FORMING APPARATUS
    • 真空薄膜成型装置
    • US20100200394A1
    • 2010-08-12
    • US12719920
    • 2010-03-09
    • Yoshinori NagamineKanto NakamuraKoji Tsunekawa
    • Yoshinori NagamineKanto NakamuraKoji Tsunekawa
    • C23C14/34
    • C23C14/225C23C14/081C23C14/345H01J37/32091H01J37/32174H01J37/32706H01J37/34H01L43/12
    • In order to automatically adjust a self-bias on a substrate to a constant value at all times and to form a high-quality insulating film with excellent process reproducibility, a vacuum thin film forming apparatus according to the present invention includes: a high-frequency sputtering device having a chamber, an evacuation means for evacuating the inside of the chamber, a gas introduction means for supplying gas into the chamber, a substrate holder provided within the chamber, and an electrode provided within the substrate holder; and at least one vacuum treatment chamber that can be selected from a group including a physical vapor deposition (PVD) chamber, a chemical vapor deposition (CVD) chamber, a physical etching chamber, a chemical etching chamber, a substrate heating chamber, a substrate cooling chamber, an oxidation treatment chamber, a reduction treatment chamber, and an ashing chamber, wherein the high-frequency sputtering device further includes a variable impedance mechanism electrically connected to the electrode for adjusting the potential of the substrate on the substrate holder.
    • 为了始终将基板上的自偏压自动调整为恒定值,并且形成具有优异的工艺再现性的高品质绝缘膜,根据本发明的真空薄膜形成装置包括:高频 具有室的溅射装置,用于抽空室内的抽气装置,用于向室内供给气体的气体引入装置,设置在室内的基板保持架以及设置在基板保持架内的电极; 以及至少一个真空处理室,其可以选自包括物理气相沉积(PVD)室,化学气相沉积(CVD)室,物理蚀刻室,化学蚀刻室,基板加热室,基板 冷却室,氧化处理室,还原处理室和灰化室,其中所述高频溅射装置还包括电连接到所述电极的可变阻抗机构,用于调节所述基板保持器上的所述基板的电位。
    • 10. 发明申请
    • OXIDIZING METHOD AND OXIDIZING APPARATUS
    • 氧化方法和氧化装置
    • US20090004884A1
    • 2009-01-01
    • US12201630
    • 2008-08-29
    • Yoshinori NagamineNaoki Wtanabe
    • Yoshinori NagamineNaoki Wtanabe
    • H01L21/31C23C16/00
    • H01L43/12H01L43/08
    • An oxidizing method and oxidizing apparatus in which a plasma generating chamber having an oxidizing gas supply port and a substrate processing chamber having an exhaust port and internally having a substrate susceptor are connected via a partition having a number of through holes, a plasma of an oxidizing gas supplied into the plasma generating chamber is generated, and an oxide layer is formed on a substrate surface by supplying the generated active species onto a substrate are characterized in that the partition is connected to a power supply via a switching mechanism such that a positive, negative, or zero voltage is applied to the partition, and an oxidation process is performed by changing the ratio of radicals, positive ions, and negative ions in the active species supplied onto the substrate by switching the voltages at least once during the oxidation process.
    • 一种氧化方法和氧化装置,其中具有氧化气体供给口的等离子体发生室和具有排气口并且内部具有基板基座的基板处理室经由具有多个通孔的隔板连接,氧化等离子体 产生供应到等离子体产生室中的气体,并且通过将所产生的活性物质提供到衬底上而在衬底表面上形成氧化物层,其特征在于,隔板经由开关机构连接到电源, 将负电压或零电压施加到隔板,并且通过在氧化处理期间通过切换电压至少一次来改变提供给衬底上的活性物质中的自由基,正离子和负离子的比例来进行氧化过程。