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    • 9. 发明申请
    • SPUTTERING APPARATUS AND SPUTTERING METHOD
    • 溅射装置和喷射方法
    • US20090134010A1
    • 2009-05-28
    • US12274022
    • 2008-11-19
    • Masahiro ShibamotoKazuto YamanakaHitoshi JimbaDavid Djulianto Djayaprawira
    • Masahiro ShibamotoKazuto YamanakaHitoshi JimbaDavid Djulianto Djayaprawira
    • C23C16/44
    • C23C14/34C23C14/505C23C14/568
    • A sputtering apparatus according to the present invention includes a substrate holding means for holding substrates and gas introducing routes having a plurality of gas jetting ports arranged at a plurality of places surrounding the substrates, and characterized in that at least one of the gas introducing routes is provided with a gas introduction connecting port, and the number of gas jetting ports provided in at least one of the gas introducing routes with the gas introduction connecting port is smaller than the number of gas jetting ports provided in the other gas introducing routes without the gas introduction connecting ports, or an aperture of each of the gas jetting ports provided in at least one of the gas introducing routes with the gas introduction connecting port is smaller than an aperture of each of the gas jetting ports provided in the other gas introducing routes without the gas introduction connecting ports.
    • 根据本发明的溅射装置包括用于保持基板的基板保持装置和布置在围绕基板的多个位置处的多个气体喷射口的气体引入路径,其特征在于,至少一个气体导入路径是 设置有气体导入连接口,并且设置在至少一个气体导入路径中的气体引入连接口的气体喷射口的数量小于在没有气体的其他气体导入路径中设置的气体喷射口的数量 引入连接端口,或者在至少一个气体引入路径中设置有气体引入连接口的每个气体喷射口的孔径小于设置在另一个气体引入路径中的每个气体喷射口的孔径,而没有 气体引入连接口。