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1. 发明申请

US20080014779A1 CAM ACTIVATED CIRCUIT CARD CLAMP 失效
标题翻译： CAM激活电路卡夹
公开(公告)号：US20080014779A1
公开(公告)日：2008-01-17
申请号：US11484517
申请日：2006-07-11
申请人： Ying-Ming Lee , Matthew Neil , Frank Daneshgar
发明人： Ying-Ming Lee , Matthew Neil , Frank Daneshgar
IPC分类号： H01R13/62
CPC分类号： H01R12/88 , H05K7/1404
摘要： A cam activated circuit card clamp is provided. The circuit card clamp is comprised of a base member (204), a leverage arm (412), and a cam activation shaft (422). The circuit card clamp is also comprised of one or more cams (410-1, 410-2, 410-3, 410-4), one or more ramp members (308-1, 308-2, 308-3, 308-4), and one or more wedge members (418-1, 418-2, 418-3, 418-4). The cam activation shaft is coupled to the leverage arm. The cams are in contact with the cam activation shaft which has one or more compression springs disposed thereon. The cams are adapted to pivot about a pivot shaft when actuated. The cams also have a surface adapted to engage an adjacent wedge member when actuated. Each ramp member has an inclined surface adapted to deflect an adjacent wedge member when the adjacent wedge member is compressed against the ramp member. Each wedge member has a surface adapted to engage an adjacent cam. Each wedge member also has an inclined surface adapted to slidingly engage an adjacent ramp member when compressed together. A method for applying a clamping force to a circuit card is also provided.
摘要翻译：提供凸轮激活的电路卡夹。电路卡夹由基座构件（204），杠杆臂（412）和凸轮活动轴（422）构成。电路卡夹还包括一个或多个凸轮（410-1,410-2,410-3,410-4），一个或多个斜坡构件（308-1,308-2,308-3,308- 4）和一个或多个楔形构件（418-1,418-2,418-3,418-4）。凸轮活动轴联接到杠杆臂。凸轮与设置在其上的一个或多个压缩弹簧的凸轮活动轴接触。当致动时，凸轮适于绕枢轴枢转。凸轮还具有适于在致动时接合相邻楔形构件的表面。每个斜坡构件具有倾斜表面，当相邻的楔形构件被压靠在斜坡构件上时，倾斜表面适于偏转相邻的楔形构件。每个楔形构件具有适于接合相邻凸轮的表面。每个楔形构件还具有适于在压缩在一起时滑动地接合相邻斜面构件的倾斜表面。还提供了一种向电路卡施加夹紧力的方法。

2. 发明申请

US20130229323A1 INTERCONNECT FEED DEVICES FOR ELECTRICAL COMPONENTS, AND PROCESSES FOR MANUFACTURING SAME 有权
标题翻译：电气元件的互连馈电装置及其制造方法
公开(公告)号：US20130229323A1
公开(公告)日：2013-09-05
申请号：US13410480
申请日：2012-03-02
申请人： Ying-Ming Lee , Brinnan C. Riley , Brett Pigon , William E. Clark , Steven R. Sprinkle
发明人： Ying-Ming Lee , Brinnan C. Riley , Brett Pigon , William E. Clark , Steven R. Sprinkle
IPC分类号： H01Q1/00 , H01R43/00 , H02G3/04
CPC分类号： H01R13/6599 , B33Y80/00 , H01Q21/0006 , H01R13/6473 , Y10T29/49117
摘要： Interconnect feed devices (10) are provided for electrically connecting first and second electrical components (17, 21). The interconnect feed devices (10) can include a dielectric shell (23) with an electrically-conductive coating (40), and leads (22) positioned within individual conduits (30) of the shell. Each lead (22) and its associated conduit (30) can act as a coaxial cable for transmitting radio frequency (RF) energy between the first and second electrical components (17, 21). The shell (23) can be manufactured using a process, such as stereolithography, that allows the shell to be formed with relatively complicated geometries, which in turn can facilitate relatively complicated cable routing.
摘要翻译：互连馈电装置（10）用于电连接第一和第二电气部件（17,21）。互连馈电装置（10）可以包括具有导电涂层（40）的电介质外壳（23）和位于外壳的各个导管（30）内的引线（22）。每个引线（22）及其相关联的导管（30）可以用作在第一和第二电气部件（17,21）之间传输射频（RF）能量的同轴电缆。外壳（23）可以使用诸如立体光刻法的方法制造，其允许壳体形成有相对复杂的几何形状，这又可以促进相对复杂的电缆布线。

3. 发明申请

US20100020514A1 MULTI-DIRECTION WEDGE CLAMP 有权
标题翻译：多方向楔形夹
公开(公告)号：US20100020514A1
公开(公告)日：2010-01-28
申请号：US12178088
申请日：2008-07-23
申请人： Ying-Ming Lee , Matthew Neil , Neal Knoblock
发明人： Ying-Ming Lee , Matthew Neil , Neal Knoblock
IPC分类号： H05K7/14
CPC分类号： H05K7/1404
摘要： A circuit card clamp (300) including a base member (316), at least one first wedge member (446), and a thermally conductive membrane (350). The base member has an elongated shape configured for insertion in a circuit card chassis slot (106). The first wedge member is movable relative to the base member in response to a first actuator (304) for engaging the circuit card chassis slot. The thermally conductive membrane is coupled to the base member and the first wedge member. The thermally conductive membrane has slack for permitting the first wedge member to move relative to the base member between a first clamped position and a second unclamped position. The thermally conductive membrane defines a thermal conductive path (206) between a circuit card (104) and the chassis slot for releasably securing a circuit card in the circuit card chassis slot.
摘要翻译：一种包括基座构件（316），至少一个第一楔形构件（446）和导热膜（350）的电路卡夹（300）。基部构件具有被配置用于插入电路卡底盘槽（106）中的细长形状。响应于用于接合电路卡底盘槽的第一致动器（304），第一楔形构件可相对于基座构件移动。导热膜联接到基部构件和第一楔形构件。导热膜具有松弛，以允许第一楔形构件在第一夹紧位置和第二未夹紧位置之间相对于基底构件移动。导热膜在电路卡（104）和底盘槽之间限定导热路径（206），用于可释放地将电路卡固定在电路卡机箱槽中。

4. 发明授权

US5529809A Method and apparatus for spraying molten materials 失效
标题翻译：熔融材料喷涂方法和设备
公开(公告)号：US5529809A
公开(公告)日：1996-06-25
申请号：US192691
申请日：1994-02-07
申请人： Ronald J. Glovan , John C. Tierney , Leroy L. McLean , Lawrence L. Johnson , Gordon L. Nelson , Ying-Ming Lee
发明人： Ronald J. Glovan , John C. Tierney , Leroy L. McLean , Lawrence L. Johnson , Gordon L. Nelson , Ying-Ming Lee
IPC分类号： B05B7/16 , C23C4/12 , B05D1/02 , B05C5/04
CPC分类号： B05B7/168 , B05B7/1613 , B05B7/1646 , C23C4/123
摘要： A metal spray apparatus is provided with a supersonic nozzle. Molten metal is injected into a gas stream flowing through the nozzle under pressure. By varying the pressure of the injected metal, the droplet can be made in various selected sizes with each selected size having a high degree of size uniformity. A unique one piece graphite heater provides easily controlled uniformity of temperature in the nozzle and an attached tundish which holds the pressurized molten metal. A unique U-shaped gas heater provides extremely hot inlet gas temperatures to the nozzle. A particularly useful application of the spray apparatus is coating of threads of a fastener with a shape memory alloy. This permits a fastener to be easily inserted and removed but provides for a secure locking of the fastener in high temperature environments.
摘要翻译：金属喷涂装置设有超音速喷嘴。将熔融金属在压力下注入流经喷嘴的气流中。通过改变注入的金属的压力，可以使各个选定的尺寸具有高度尺寸均匀性的各种尺寸的液滴。独特的一体式石墨加热器提供了容易控制的喷嘴温度均匀性以及保持加压熔融金属的中间包。独特的U形气体加热器为喷嘴提供了非常热的入口气体温度。喷涂装置的特别有用的应用是用形状记忆合金涂覆紧固件的螺纹。这允许紧固件容易地插入和移除，但是提供紧固件在高温环境中的牢固锁定。

5. 发明申请

US20070279276A1 Pseudomonopulse tracking system with variable coupler and integrated LNA 审中-公开
标题翻译：具有可变耦合器和集成LNA的伪脉冲跟踪系统
公开(公告)号：US20070279276A1
公开(公告)日：2007-12-06
申请号：US11443737
申请日：2006-05-31
申请人： James K. Conn , James B. Offner , Larry P. Serulneck , Earl B. Knick , Ron Hash , Ying-Ming Lee , Pete Denney , Joseph A. Elam , Brian A. Smith
发明人： James K. Conn , James B. Offner , Larry P. Serulneck , Earl B. Knick , Ron Hash , Ying-Ming Lee , Pete Denney , Joseph A. Elam , Brian A. Smith
IPC分类号： G01S13/44 , G01S13/66
CPC分类号： G01S3/325
摘要： System for dynamically tracking a position of a target with an antenna in a communication system. The system includes an antenna system (410) configured for generating a sum and difference antenna pattern (201-1, 201-2). A sum RF channel (401) is coupled to a sum channel output of the antenna system. A difference RF channel (402) is coupled to a difference channel output of the antenna system. An RF coupler (422-1) is provided that has a first input coupled to the sum RF channel and a second input coupled to the RF difference channel. One or more coupling control devices (418-1, 418-2) selectively vary an effective coupling value as between the difference channel and the sum channel. An antenna tracking error signal is generated at an output of the coupler.
摘要翻译：用于在通信系统中用天线动态跟踪目标位置的系统。该系统包括配置用于产生和差和差分天线方向图（201-1,201-2）的天线系统（410）。总和RF信道（401）耦合到天线系统的和信道输出。差分RF信道（402）耦合到天线系统的差分信道输出。提供RF耦合器（422-1），其具有耦合到和RF通道的第一输入和耦合到RF差分通道的第二输入。一个或多个耦合控制装置（418-1,418-2）选择性地改变在差信道和和信道之间的有效耦合值。在耦合器的输出端产生天线跟踪误差信号。

6. 发明授权

US06621694B2 Vibration tolerant electronic assembly and related methods 失效
标题翻译：耐振电子组装及相关方法
公开(公告)号：US06621694B2
公开(公告)日：2003-09-16
申请号：US09949289
申请日：2001-09-07
申请人： Ying-Ming Lee , Frank Daneshgar
发明人： Ying-Ming Lee , Frank Daneshgar
IPC分类号： G06F116
CPC分类号： G11B33/08
摘要： A vibration tolerant electronic assembly may include a base and a first isolation stage including a first frame, at least one first linear bearing coupling the first frame to the base to constrain movement of the first frame along a first coordinate axis, and at least one first damper for damping movement of the first frame. A second similar isolation stage may be coupled to the first isolation stage, and a third similar isolation stage may be coupled to the second isolation stage. Furthermore, an electronic device may be coupled to the third isolation stage. The electronic assembly provides resistance to disturbance of the electronic device by vibration in one or more of three coordinate axis.
摘要翻译：耐振电子组件可以包括基座和第一隔离台，所述第一隔离台包括第一框架，至少一个第一直线轴承，其将所述第一框架连接到所述基座以约束所述第一框架沿着第一坐标轴的运动;以及至少一个第一阻尼器用于第一框架的阻尼运动。第二类似的隔离级可以耦合到第一隔离级，并且第三类似的隔离级可耦合到第二隔离级。此外，电子设备可以耦合到第三隔离级。电子组件通过在三个坐标轴中的一个或多个中的振动来提供对电子装置的干扰的阻力。

7. 发明授权

US09247632B2 Cover structure and manufacturing method thereof 有权
标题翻译：盖结构及其制造方法
公开(公告)号：US09247632B2
公开(公告)日：2016-01-26
申请号：US14228277
申请日：2014-03-28
申请人： Ying-Ming Lee
发明人： Ying-Ming Lee
IPC分类号： H05K1/02 , H05K9/00 , C25D5/02 , C25D7/00 , B32B37/02 , B32B38/10 , B32B37/24
CPC分类号： H05K1/0216 , B32B37/02 , B32B38/10 , B32B2037/243 , B32B2307/202 , B32B2307/204 , B32B2307/206 , B32B2307/212 , B32B2311/12 , B32B2457/00 , C25D1/04 , C25D5/022 , C25D5/12 , C25D7/00 , H01J2211/446 , H01L23/552 , H01L2924/14 , H01L2924/1461 , H01L2924/16251 , H01L2924/3025 , H05K1/0218 , H05K3/007 , H05K9/0024 , H05K9/0088 , H05K2203/0152 , H05K2203/06
摘要： A method of manufacturing a cover structure is provided. A metal substrate disposed on a carrier is provided. The carrier has a surface, and the metal substrate has a plurality of openings exposing a portion of the surface. A first metal layer is formed on the metal substrate and is conformal with the metal substrate. The first metal layer covers the portion of the surface exposed by the openings. An insulating layer and a second metal layer located on the insulating layer are laminated on the metal substrate. The insulating layer is located between the first metal layer and the second metal layer to cover the first metal layer and fill the openings. The metal substrate and the carrier are removed to expose the first metal layer and define a plurality of cavity regions and a plurality of connecting regions connected with the cavity regions.
摘要翻译：提供一种制造盖结构的方法。设置在载体上的金属基板。载体具有表面，并且金属基底具有暴露表面的一部分的多个开口。在金属基板上形成第一金属层，并与金属基板共形。第一金属层覆盖由开口暴露的表面的部分。位于绝缘层上的绝缘层和第二金属层层叠在金属基板上。绝缘层位于第一金属层和第二金属层之间，以覆盖第一金属层并填充开口。去除金属基板和载体以露出第一金属层并限定多个空腔区域和与空腔区域连接的多个连接区域。

8. 发明授权

US09013365B2 Interconnect feed devices for electrical components, and processes for manufacturing same 有权
标题翻译：电气元件的互连馈电装置及其制造工艺
公开(公告)号：US09013365B2
公开(公告)日：2015-04-21
申请号：US13410480
申请日：2012-03-02
申请人： Ying-Ming Lee , Brinnan C. Riley , Brett Pigon , William E. Clark , Steven R. Sprinkle
发明人： Ying-Ming Lee , Brinnan C. Riley , Brett Pigon , William E. Clark , Steven R. Sprinkle
IPC分类号： H01Q1/00 , H02G3/04 , H01P1/00 , H01R13/6599 , H01Q21/00 , H01R13/6473
CPC分类号： H01R13/6599 , B33Y80/00 , H01Q21/0006 , H01R13/6473 , Y10T29/49117
摘要： Interconnect feed devices (10) are provided for electrically connecting first and second electrical components (17, 21). The interconnect feed devices (10) can include a dielectric shell (23) with an electrically-conductive coating (40), and leads (22) positioned within individual conduits (30) of the shell. Each lead (22) and its associated conduit (30) can act as a coaxial cable for transmitting radio frequency (RF) energy between the first and second electrical components (17, 21). The shell (23) can be manufactured using a process, such as stereolithography, that allows the shell to be formed with relatively complicated geometries, which in turn can facilitate relatively complicated cable routing.
摘要翻译：互连馈电装置（10）用于电连接第一和第二电气部件（17,21）。互连馈电装置（10）可以包括具有导电涂层（40）的电介质外壳（23）和位于外壳的各个导管（30）内的引线（22）。每个引线（22）及其相关联的导管（30）可以用作在第一和第二电气部件（17,21）之间传输射频（RF）能量的同轴电缆。外壳（23）可以使用诸如立体光刻法的方法制造，其允许壳体形成有相对复杂的几何形状，这又可以促进相对复杂的电缆布线。

9. 发明授权

US08045332B2 Multi-direction wedge clamp 有权
标题翻译：多向楔形夹
公开(公告)号：US08045332B2
公开(公告)日：2011-10-25
申请号：US12178088
申请日：2008-07-23
申请人： Ying-Ming Lee , Matthew Neil , Neal Knoblock
发明人： Ying-Ming Lee , Matthew Neil , Neal Knoblock
IPC分类号： H05K5/00
CPC分类号： H05K7/1404
摘要： A circuit card clamp (300) including a base member (316), at least one first wedge member (446), and a thermally conductive membrane (350). The base member has an elongated shape configured for insertion in a circuit card chassis slot (106). The first wedge member is movable relative to the base member in response to a first actuator (304) for engaging the circuit card chassis slot. The thermally conductive membrane is coupled to the base member and the first wedge member. The thermally conductive membrane has slack for permitting the first wedge member to move relative to the base member between a first clamped position and a second unclamped position. The thermally conductive membrane defines a thermal conductive path (206) between a circuit card (104) and the chassis slot for releasably securing a circuit card in the circuit card chassis slot.
摘要翻译：一种包括基座构件（316），至少一个第一楔形构件（446）和导热膜（350）的电路卡夹（300）。基部构件具有被配置用于插入电路卡底盘槽（106）中的细长形状。响应于用于接合电路卡底盘槽的第一致动器（304），第一楔形构件可相对于基座构件移动。导热膜联接到基部构件和第一楔形构件。导热膜具有松弛，以允许第一楔形构件在第一夹紧位置和第二未夹紧位置之间相对于基底构件移动。导热膜在电路卡（104）和底盘槽之间限定导热路径（206），用于可释放地将电路卡固定在电路卡机箱槽中。

10. 发明申请

US20150216032A1 COVER STRUCTURE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：其结构及其制造方法
公开(公告)号：US20150216032A1
公开(公告)日：2015-07-30
申请号：US14228277
申请日：2014-03-28
申请人： Ying-Ming Lee
发明人： Ying-Ming Lee
IPC分类号： H05K1/02 , C25D7/00 , B32B38/10 , C25D5/02 , H05K9/00 , B32B37/24
CPC分类号： H05K1/0216 , B32B37/02 , B32B38/10 , B32B2037/243 , B32B2307/202 , B32B2307/204 , B32B2307/206 , B32B2307/212 , B32B2311/12 , B32B2457/00 , C25D1/04 , C25D5/022 , C25D5/12 , C25D7/00 , H01J2211/446 , H01L23/552 , H01L2924/14 , H01L2924/1461 , H01L2924/16251 , H01L2924/3025 , H05K1/0218 , H05K3/007 , H05K9/0024 , H05K9/0088 , H05K2203/0152 , H05K2203/06
摘要： A method of manufacturing a cover structure is provided. A metal substrate disposed on a carrier is provided. The carrier has a surface, and the metal substrate has a plurality of openings exposing a portion of the surface. A first metal layer is formed on the metal substrate and is conformal with the metal substrate. The first metal layer covers the portion of the surface exposed by the openings. An insulating layer and a second metal layer located on the insulating layer are laminated on the metal substrate. The insulating layer is located between the first metal layer and the second metal layer to cover the first metal layer and fill the openings. The metal substrate and the carrier are removed to expose the first metal layer and define a plurality of cavity regions and a plurality of connecting regions connected with the cavity regions.
摘要翻译：提供一种制造盖结构的方法。设置在载体上的金属基板。载体具有表面，并且金属基底具有暴露表面的一部分的多个开口。在金属基板上形成第一金属层，并与金属基板共形。第一金属层覆盖由开口暴露的表面的部分。位于绝缘层上的绝缘层和第二金属层层叠在金属基板上。绝缘层位于第一金属层和第二金属层之间，以覆盖第一金属层并填充开口。去除金属基板和载体以露出第一金属层并限定多个空腔区域和与空腔区域连接的多个连接区域。

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