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1. 发明公开

US20230262941A1 CIRCUIT CARD ASSEMBLY (CCA) MODULE THERMAL INTERFACE DEVICES 审中-公开
公开(公告)号：US20230262941A1
公开(公告)日：2023-08-17
申请号：US17674035
申请日：2022-02-17
申请人： Hamilton Sundstrand Corporation (HSC)
发明人： Alexander Trotman , Josh Kamp , Judy Schwartz , Robert DeFelice , Michael Doe, JR. , Anthony Matthew DeLugan
IPC分类号： H05K7/20 , H05K7/14
CPC分类号： H05K7/205 , H05K7/20545 , H05K7/1404
摘要： An assembly includes a circuit card assembly (CCA) module including a CCA with heat generating electronic components and a connector electrically connected to the heat generating electronic components. A chassis including an electrical interface is included. The connector of the CCA module is electrically connected to the electrical interface. The chassis includes a removable cover. A heat transfer element is included between the cover of the chassis and an edge of the CCA module for heat sinking heat from the heat generating electronic components through the heat transfer element to the cover of the chassis.

2. 发明申请

US20190082551A1 CIRCUIT CARD RACK SYSTEM AND METHOD 审中-公开
公开(公告)号：US20190082551A1
公开(公告)日：2019-03-14
申请号：US16178259
申请日：2018-11-01
申请人： MARTIN BROKNER CHRISTIANSEN , LEONARD GEORGE CHOROSINSKI , H. CRAIG HEFFNER , STANLEY KATSUYOSHI WAKAMIYA
发明人： MARTIN BROKNER CHRISTIANSEN , LEONARD GEORGE CHOROSINSKI , H. CRAIG HEFFNER , STANLEY KATSUYOSHI WAKAMIYA
IPC分类号： H05K7/14
CPC分类号： H05K7/1404 , H05K7/1425 , H05K7/20
摘要： A method of maintaining a circuit card in a card rack and a circuit card rack system are disclosed. A card rack including a laterally oriented clamping slot is provided. The clamping slot is at least partially formed from a temperature-contractible material. A circuit card having a clamped side region is provided. At least a portion of the clamped side region is inserted into the clamping slot. A predetermined temperature differential is applied to the clamping slot to reduce a longitudinal dimension of at least a portion of the clamping slot. A compressive force is exerted on the portion of the clamped side region which is located longitudinally within the clamping slot, via thermal expansion of the clamping slot.

3. 发明申请

US20180295747A1 EDGE SEALING HEAT-DISSIPATING FILM 审中-公开
公开(公告)号：US20180295747A1
公开(公告)日：2018-10-11
申请号：US15912522
申请日：2018-03-05
申请人： GETAC TECHNOLOGY CORPORATION
发明人： Chi-Jung Wu
IPC分类号： H05K7/20 , F25D5/00 , F28F21/08 , H05K7/14
CPC分类号： H05K7/20481 , F25D5/00 , F28F21/084 , H01L23/367 , H01L23/3735 , H01L23/3736 , H01L23/3737 , H01L27/016 , H05K7/1404 , H05K7/20472
摘要： An edge sealing heat-dissipating film includes a heat radiation emitting film, a metal film and a heat radiation receiving film. The heat radiation emitting film has a first opening. The metal film is disposed to the heat radiation emitting film and the metal film has a second opening. The second opening is positioned corresponding to the first opening. The heat radiation receiving film is disposed to the metal film and the heat radiation receiving film has a third opening. Wherein, the shape of the heat radiation emitting film is the same as the shape of the heat radiation receiving film. And the area of the metal film is slightly smaller than the area of the heat radiation receiving film and the heat radiation emitting film. Therefore, the outer periphery of the heat radiation emitting film and the outer periphery of the heat radiation receiving film could be closely bonded together.

4. 发明申请

US20180192535A1 GUIDE ASSEMBLY FOR PROPER ELECTRICAL BLIND MATING OF A MODULE IN AN ENCLOSURE 审中-公开
公开(公告)号：US20180192535A1
公开(公告)日：2018-07-05
申请号：US15399517
申请日：2017-01-05
申请人： Oracle International Corporation
发明人： ANDRES GABRIEL HOFMANN , REBECCA DI RICCO KURZAVA , GABRIELLE KARIANN STETOR
IPC分类号： H05K7/14 , H01R12/73
CPC分类号： H05K7/1454 , G06F1/181 , G06F1/184 , G06F1/185 , H01R12/737 , H01R12/91 , H05K7/1401 , H05K7/1402 , H05K7/1404 , H05K7/1405 , H05K7/1408 , H05K7/1409 , H05K7/1418 , H05K7/1455 , H05K7/1492
摘要： A guide assembly an enclosure-based device such as a computer provided in a rack-mountable chassis. The guide assembly is configured to facilitate blind connector mating such as electrical interconnection between a receiving connector on a previously-mounted board and an edge connector on a circuit board supported in a housing of a module that is slid or inserted into the interior space of the enclosure or chassis. The guide assembly (and devices that include a guide assembly) address the two design challenges discussed above of increasing numbers of circuits in devices that need to be connected and of decreasing pitch between the connectors. The guide assembly is configured, with its mechanical features, to decouple the degrees of freedom (DOFs) between the module being inserted into the chassis and the receiving/mating connector on the previously-mounted board. The guide assembly constrains five out of the six DOFs, which effectively ensures proper connector mating.

5. 发明申请

US20180183218A1 RESISTANCE-LIMITED ELECTRICAL INTERCONNECTS 审中-公开
公开(公告)号：US20180183218A1
公开(公告)日：2018-06-28
申请号：US15388904
申请日：2016-12-22
申请人： Hamilton Sundstrand Corporation
发明人： Debabrata Pal , Mark H. Severson
IPC分类号： H02B1/20 , H02B1/24
CPC分类号： H02B1/20 , H02B1/24 , H05K7/1404 , H05K7/1457 , H05K7/1461
摘要： A resistance-limited electrical interface includes a printed wiring board, a bus bar, a U-shaped conductor, and a retainer. The bus bar extends from the printed wiring board. The U-shaped conductor has a first wall and an opposed second wall, the bus bar arranged between the first and second wall to define a conductive joint between the first wall and the bus bar. The retainer is compressively seated between the second wall and bus bar opposite the conductive joint to exert force on the bus bar for retaining the bus bar in the U-shaped conductor and limiting electrical resistance of the conductive joint.

6. 发明授权

US09839116B2 Circuit card assembly with thermal energy removal 有权
公开(公告)号：US09839116B2
公开(公告)日：2017-12-05
申请号：US14787552
申请日：2013-04-29
申请人： GE Intelligent Platforms Embedded Systems, Inc.
发明人： Graham Charles Kirk , Zeshan Jabar Hussain
IPC分类号： H05K7/20 , H05K5/00 , H05K1/14 , H05K1/02 , H05K7/14
CPC分类号： H05K1/0203 , H05K7/1404 , H05K7/20545
摘要： A circuit card assembly includes a heat sink, a locking mechanism, a first thermal path, and a second thermal path. The heat sink couples to a circuit board and has an upper surface and a lower surface. The heat sink has a channel extending downward along the upper surface of the heat sink. The locking mechanism is disposed within the channel and includes a plurality of solid wedges movably arranged within the channel. Movement of the wedges is effective to secure the circuit card assembly to a holder. The first thermal path extends from the circuit board through the heat sink to the lower surface of the heat sink and removes thermal energy from the circuit board. The second thermal path is formed from the circuit board, through the heat sink, and then through the wedges to the holder. The second thermal path removes thermal energy from the circuit board that is greater than a leakage amount.

7. 发明授权

US09730356B2 Lever unit 有权
公开(公告)号：US09730356B2
公开(公告)日：2017-08-08
申请号：US14901346
申请日：2013-06-28
申请人： Hewlett-Packard Development Company, L.P.
发明人： John P Franz , Michael L Sabotta , David A Moore , Tahir Cader , Alan B Doerr
IPC分类号： H05K7/14 , H05K7/20 , G11B33/12
CPC分类号： H05K7/1487 , G11B33/128 , H05K7/1404 , H05K7/1489 , H05K7/20709
摘要： An assembly to connect two electronic components is provided herein. The assembly includes a lever unit with a lever and a base. The lever includes a primary cam member and a secondary cam member connected thereto. The lever also includes a hook member extending therefrom. The base includes a guide structure to engage with a drive pin. Rotation of the lever to move a first electronic component along a y-axis towards, a backplane. The secondary cam member to move the drive pin along the guide structure, and the hook member to engage with a second electronic component and mate the first electronic component and the second electronic component along the second axis.

8. 发明授权

US09466551B1 Heat transferring clamp 有权
标题翻译：传热夹
公开(公告)号：US09466551B1
公开(公告)日：2016-10-11
申请号：US13385235
申请日：2012-02-09
申请人： Daniel T. Reist , Scott D. Garner , Jens E. Weyant , E. Michael Ames
发明人： Daniel T. Reist , Scott D. Garner , Jens E. Weyant , E. Michael Ames
IPC分类号： F28F11/06 , F28D15/00 , H01L23/473 , F28D15/02
CPC分类号： H01L23/473 , F28D15/0241 , F28D15/0275 , F28F2275/08 , H05K7/1404 , H05K7/20672
摘要： The apparatus is a heat transferring clamp with a heat pipe connecting the clamp's stationary base part to each moveable clamping part. A connecting heat pipe section between the heat pipe sections in the base part and each clamping part is flexible enough to permit both the required clamping and unclamping movements of the clamping part. The heat pipes thereby provide a superior heat transfer path between a clamped circuit board or other device and an available heat sink.
摘要翻译：该装置是具有将夹具的固定基部连接到每个可动夹紧部的热管的传热夹。在基座部分和每个夹紧部分的热管部分之间的连接热管部分是足够柔性的，以允许夹紧部件的所需夹紧和松开运动。因此，热管在夹紧的电路板或其他装置与可用的散热器之间提供了优异的传热路径。

9. 发明授权

US09414524B2 Extended heat frame for printed circuit board 有权
标题翻译：用于印刷电路板的扩展加热框架
公开(公告)号：US09414524B2
公开(公告)日：2016-08-09
申请号：US14023521
申请日：2013-09-11
申请人： Artesyn Embedded Computing, Inc.
发明人： George Paul Zemke , Suzanne Marye Wong
IPC分类号： H05K7/20 , G06F1/20 , H05K7/14
CPC分类号： H05K7/2039 , G06F1/206 , H05K7/1404
摘要： A circuit board assembly for installation in a cabinet includes a first standards based size first mounting frame portion having a PCB mounted thereto. A second mounting frame portion is connected to the first mounting frame portion having no portion of the PCB connected thereto. A combination size of the first and second mounting frames defines a larger second standards based size. Multiple heat transfer components may be connected to the first or second mounting frame portion provide a conduction/convection cooling path. The first mounting frame portion may include a first false board edge and the second mounting frame portion includes one or more false board edge(s) positioned laterally and oppositely directed to the first false board edge. The first and second false board edges are slidably received in opposed slots created in a cabinet.
摘要翻译：用于安装在机柜中的电路板组件包括具有安装在其上的PCB的第一标准尺寸的第一安装框架部分。第二安装框架部分连接到第一安装框架部分，其中没有PCB的部分连接到其上。第一和第二安装框架的组合尺寸限定了较大的基于第二标准的尺寸。多个传热部件可以连接到第一或第二安装框架部分，从而提供传导/对流冷却路径。第一安装框架部分可以包括第一假板边缘，并且第二安装框架部分包括一个或多个横向并相对定向于第一假板边缘的假板边缘。第一和第二假板边缘可滑动地接收在机柜中形成的相对的槽中。

10. 发明授权

US09167714B2 Reverse wedgelock device 有权
标题翻译：反向楔锁装置
公开(公告)号：US09167714B2
公开(公告)日：2015-10-20
申请号：US13867931
申请日：2013-04-22
申请人： Raytheon Company
发明人： Jeffrey Paquette , Scott R. Cheyne , Dennis W. Mercier
IPC分类号： H05K7/14 , H05K7/20
CPC分类号： H05K7/1404 , H05K7/20545 , Y10T29/49826
摘要： A reverse wedgelock device with multiple draw blocks disposed about a lead screw passing through the draw blocks, wherein the draw blocks may be compressed together and caused to displace about respective wedge surfaces upon tightening of the screw. Compression and displacement of the draw blocks can function to draw anchors associated with the draw blocks inward, which, when engaged with opposing objects, functions to draw the objects together.
摘要翻译：具有多个牵引块的反向楔形装置，其布置在穿过牵引块的导螺杆周围，其中牵引块可以被压缩在一起，并且在拧紧螺钉时围绕相应的楔形表面移位。拉伸块的压缩和位移可以用于将与拉伸块相关联的锚定件向内拉，其在与相对的物体接合时用于将物体牵引在一起。

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