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1. 发明授权

US07147195B2 Automobile slide adjuster 失效
标题翻译：汽车滑板调节器
公开(公告)号：US07147195B2
公开(公告)日：2006-12-12
申请号：US10941862
申请日：2004-09-16
申请人： Yasuharu Danjo , Yasuo Izumi
发明人： Yasuharu Danjo , Yasuo Izumi
IPC分类号： F16M13/00
CPC分类号： B60N2/073 , B60N2/072 , B60N2/0818 , B60N2/0843
摘要： An automobile slide adjuster includes a lower rail to be secured to a vehicle body and an upper rail slidably mounted on the lower rail. A plurality of rolling elements are disposed between the upper and lower rails at a lower portion thereof. The upper rail has a plurality of upward protrusions formed on an upper portion thereof and also has an elongated opening formed along a lower edge of each of the plurality of upward protrusions. The upward protrusions are held in sliding contact with a portion of the lower rail.
摘要翻译：汽车滑块调节器包括固定到车体的下轨道和可滑动地安装在下轨道上的上轨道。多个滚动元件在其下部设置在上轨道和下轨道之间。上轨道具有形成在其上部的多个向上突出部，并且还具有沿着多个向上突起中的每一个的下边缘形成的细长开口。向上的突起保持与下轨道的一部分滑动接触。

2. 发明授权

US5018936A Electronic parts engaging apparatus 失效
标题翻译：电子零件接合装置
公开(公告)号：US5018936A
公开(公告)日：1991-05-28
申请号：US371973
申请日：1989-06-27
申请人： Yasuo Izumi , Kazumi Ishimoto , Yutaka Makino
发明人： Yasuo Izumi , Kazumi Ishimoto , Yutaka Makino
IPC分类号： H05K13/04
CPC分类号： H05K13/046 , H05K13/0417 , Y10T29/53091 , Y10T29/53178 , Y10T29/53191
摘要： An electronic parts engaging apparatus is equipped with a parts feed portion having a plurality of parts feed devices disposed to feed, for each type of part, parts having marks indicating their separate type. A suction nozzle is composed of a light transmitting material. A recognition device recognizes the parts through the suction nozzle. A memory stores the types of the parts of the respective parts feed devices in the parts feed portion. A control stores in the memory the types of the parts found through the recognition of the marks of the parts of the respective parts feed devices with the recognition device. A periodical washing operation has an effect in that the control operation is simplified.

3. 发明授权

US5017131A Atmosphere furnace 失效
标题翻译：大气炉
公开(公告)号：US5017131A
公开(公告)日：1991-05-21
申请号：US545891
申请日：1990-06-29
申请人： Syoji Sato , Yutaka Makino , Kazumi Ishimoto , Yasuo Izumi
发明人： Syoji Sato , Yutaka Makino , Kazumi Ishimoto , Yasuo Izumi
IPC分类号： B23K1/008 , C23C2/28 , F27B9/02 , F27B9/04 , F27B9/24 , F27D3/00 , F27D7/04 , F27D19/00 , H05K3/34
CPC分类号： F27B9/24 , F27B9/028 , F27B9/04 , F27D2003/0061 , F27D2003/0087 , F27D2007/045 , F27D2019/0018
摘要： An atmosphere furnace including a plurality of divided furnace units, work transfer devices connecting the adjacent divided furnace units and those for the divided furnace units at both ends of the furnace. Each transfer device includes a tubular connecting frame and a work transfer member housed therein and the work transfer member has a work housing space in it. The work transfer member is rotatable, receives at a first position the work from outside or from an adjacent divided furnace unit into its work housing space, and send it out of the furnace or pass it to the adjacent divided furnace unit at a second position. When the work transfer member is at a middle position between the first and the second positions, the work housing space thereof faces an inner surface of the connecting frame so as to be sealed against the both end openings of the frame. Furthermore, it is provided with a channel for receiving the atmosphere from any divided furnace unit or outside space when the transfer member is at the middle position so as to have the work in the work housing space gradually heated or cooled through introduction of the atmosphere.
摘要翻译：包括多个分割炉单元的气氛炉，连接相邻的分割炉单元的工件传送装置和炉两端的分割炉单元。每个传送装置包括容纳在其中的管状连接框架和工件传送构件，并且工件传送构件在其中具有工作容纳空间。工件传送构件是可旋转的，在第一位置将工件从外部或从相邻的分割炉单元接收到其工作容纳空间中，并将其从炉中送出或在第二位置将其传递到相邻的分割炉单元。当工件传送构件处于第一位置和第二位置之间的中间位置时，其工作容纳空间面向连接框架的内表面，以便与框架的两端开口密封。此外，当传送构件处于中间位置时，设置有用于从任何分开的炉单元或外部空间接收气氛的通道，以便通过引入气氛而使作业容纳空间中的工作逐渐加热或冷却。

4. 发明授权

US5003692A Electric component mounting method 失效
标题翻译：电气元件安装方法
公开(公告)号：US5003692A
公开(公告)日：1991-04-02
申请号：US524055
申请日：1990-05-16
申请人： Yasuo Izumi , Kazumi Ishimoto , Yutaka Makino
发明人： Yasuo Izumi , Kazumi Ishimoto , Yutaka Makino
IPC分类号： B23P21/00 , G06T1/00 , H05K13/04 , H05K13/08
CPC分类号： H05K13/0413 , H05K13/08 , Y10T29/49131 , Y10T29/49133 , Y10T29/53178 , Y10T29/53261
摘要： A component mounting method for successively mounting electric components on a printed circuit board, which method comprises the steps of recognizing the position of an electric component retained by a suction nozzle by the effect of a suction force; recognizing the predetermined mounting position on a printed circuit board or any other suitable substrate, at a location spaced a predetermined distance from the printed circuit board; mounting the electric component after the latter has been aligned with the predetermined mounting position on the printed circuit board; and recognizing, through the suction nozzle, the electric component to determine if the electric component has been mounted properly after the suction nozzle has been elevated to a position spaced a predetermined distance upwardly from the printed circuit board. In the event that the latter has been mounted incorrectly, information indicative of an incorrect mounting of the electric component is recorded in a control data.
摘要翻译：一种用于在印刷电路板上连续安装电气部件的部件安装方法，该方法包括以下步骤：通过吸力来识别由吸嘴保持的电气部件的位置; 在与印刷电路板隔开预定距离的位置处识别印刷电路板或任何其它合适的基板上的预定安装位置; 在电气部件已经与印刷电路板上的预定安装位置对准之后安装电气部件; 并且通过吸嘴识别电气部件，以确定在吸嘴已经被升高到与印刷电路板之间向上隔开预定距离的位置之后电气部件是否已正确安装。在后者安装不正确的情况下，表示电气部件安装不正确的信息被记录在控制数据中。

5. 发明申请

US20050056761A1 Automobile slide adjuster 失效
标题翻译：汽车滑板调节器
公开(公告)号：US20050056761A1
公开(公告)日：2005-03-17
申请号：US10941862
申请日：2004-09-16
申请人： Yasuharu Danjo , Yasuo Izumi
发明人： Yasuharu Danjo , Yasuo Izumi
IPC分类号： B60N2/06 , B60N2/07 , B60N2/08 , F16M13/00
CPC分类号： B60N2/073 , B60N2/072 , B60N2/0818 , B60N2/0843
摘要： An automobile slide adjuster includes a lower rail to be secured to a vehicle body and an upper rail slidably mounted on the lower rail. A plurality of rolling elements are disposed between the upper and lower rails at a lower portion thereof. The upper rail has a plurality of upward protrusions formed on an upper portion thereof and also has an elongated opening formed along a lower edge of each of the plurality of upward protrusions. The upward protrusions are held in sliding contact with a portion of the lower rail.
摘要翻译：汽车滑块调节器包括固定到车体的下轨道和可滑动地安装在下轨道上的上轨道。多个滚动元件在其下部设置在上轨道和下轨道之间。上轨道具有形成在其上部的多个向上突出部，并且还具有沿着多个向上突起中的每一个的下边缘形成的细长开口。向上的突起保持与下轨道的一部分滑动接触。

6. 发明授权

US5314175A Wire clamping device and wire clamping method 失效
标题翻译：线夹紧装置和线夹紧方法
公开(公告)号：US5314175A
公开(公告)日：1994-05-24
申请号：US869193
申请日：1992-04-13
申请人： Yasuo Izumi , Nobuya Matsumura , Akihiro Yamamoto , Yutaka Makino
发明人： Yasuo Izumi , Nobuya Matsumura , Akihiro Yamamoto , Yutaka Makino
IPC分类号： B25B5/06 , H01L21/00 , H01L41/09 , B25B1/06
CPC分类号： H01L21/67138 , B25B5/06 , H02N2/043
摘要： A wire clamping device which is used to clamp bonding wire in the wire bonding of electronic components comprising: a fixed arm; a movable arm that is positioned so that the end of the fixed arm faces the and of the movable arm with a suitable gap, the movable arm being capable of bending so that the end of the movable arm approaches the end of the fixed arm; and a piezoelectric element that is attached to the movable arm which bends the movable arm by mechanical deformation of the piezoelectric device in order to clamp wire between the end of the movable arm and the end of the fixed arm. A wire clamping method for clamping bonding wire comprising bending a movable arm toward a fixed arm during wire bonding of electronic components by means of mechanical deformation of a piezoelectric element, the deformation being generated by applying a voltage to the piezoelectric element.
摘要翻译：一种用于在电子部件的引线接合中夹紧接合线的线夹装置，包括：固定臂; 可移动臂被定位成使得固定臂的端部具有适当的间隙面向可动臂和可动臂，可动臂能够弯曲，使得可动臂的端部接近固定臂的端部; 以及压电元件，其附接到可动臂，其通过压电装置的机械变形来弯曲可动臂，以便将可动臂的端部与固定臂的端部之间夹紧线。一种用于夹紧接合线的线夹紧方法，包括通过压电元件的机械变形在电子部件的引线接合期间将可动臂朝向固定臂弯曲，所述变形通过向压电元件施加电压而产生。

7. 发明授权

US5140643A Part mounting apparatus with single viewing camera viewing part from different directions 失效
标题翻译：部件安装装置，具有从不同方向观看部分的单个观看照相机
公开(公告)号：US5140643A
公开(公告)日：1992-08-18
申请号：US634305
申请日：1990-12-27
申请人： Yasuo Izumi , Masanori Yasutake
发明人： Yasuo Izumi , Masanori Yasutake
IPC分类号： H05K13/04 , H05K13/08
CPC分类号： H05K13/0421 , H05K13/0413
摘要： A part mounting apparatus which includes a part holding/transfer device which holds the part at a part supply position for transfer up to a predetermined part mounting position for mounting, a recognizing device for recognizing a shape of the part held by the part holding/transfer device, and an inclined mirror device for inputting into a recognizing device, an image of the shape of the part in a direction perpendicular to a direction of an optical axis of the recognizing device.
摘要翻译：一种部件安装装置，包括：部件保持/传送装置，其将部件保持在用于传送到预定部件安装位置的部件供应位置用于安装;识别装置，用于识别由部件保持/传送保持的部件的形状; 装置，以及用于向识别装置输入与所述识别装置的光轴的方向垂直的方向上的所述部分的形状的图像。

8. 发明授权

US5289966A Method for connecting electronic component with substrate 失效
标题翻译：电子部件与基板的连接方法
公开(公告)号：US5289966A
公开(公告)日：1994-03-01
申请号：US942167
申请日：1992-09-08
申请人： Yasuo Izumi , Syoji Sato , Hiroshi Yamauchi , Ryoji Inutsuka
发明人： Yasuo Izumi , Syoji Sato , Hiroshi Yamauchi , Ryoji Inutsuka
IPC分类号： B23K1/005 , B23K1/20 , H05K3/34 , B23K31/02
CPC分类号： B23K1/0056 , B23K1/203 , H05K3/3415 , H05K3/3494 , B23K2201/36 , H05K2201/10689 , H05K2203/043 , H05K2203/0475 , H05K2203/107 , H05K2203/111 , H05K2203/1476 , Y02P70/613
摘要： A method is provided for electrically connecting a first electronic component which is not resistant to a reflowing temperature and a second electronic component which is resistant to the reflowing temperature to a substrate. The method includes the steps of applying cream solder to a first predetermined portion of the substrate so that the first electronic component is connected therewith and to a second predetermined portion of the substrate so that the second electronic component is connected therewith, mounting the second electronic component on the substrate, heating the second electronic component mounted on the substrate by reflowing so as to solder the second electronic component onto the substrate, forming a pre-soldered portion made of cream solder on the first predetermined portion of the substrate, applying flux to one of the first electronic component and the pre-soldered portion, mounting the first electronic component on the first predetermined portion of the substrate, melting the cream solder of the pre-soldered portion by heating the substrate locally, and soldering the first electronic component onto the substrate. Another method for electrically connecting an unwashable electronic component and a washable electronic component to a substrate includes similar steps to those of the method above.
摘要翻译：提供了一种将不具有回流温度的第一电子部件和耐回流温度的第二电子部件电连接到基板的方法。该方法包括以下步骤：将膏状焊料施加到基板的第一预定部分，使得第一电子元件与其连接并连接到基板的第二预定部分，使得第二电子元件与其连接，将第二电子元件在基板上，通过回流加热安装在基板上的第二电子部件，以将第二电子部件焊接到基板上，在基板的第一预定部分上形成由膏状焊料制成的预焊部分，将焊剂施加到一个将第一电子部件安装在基板的第一预定部分上，通过局部加热基板来熔化预焊部分的焊膏，并将第一电子部件焊接到第一电子部件上基质。将不可洗涤的电子部件和可洗涤电子部件电连接到基板的另一种方法包括与上述方法相似的步骤。

9. 发明授权

US5153707A Film material for manufacturing film carriers having outer lead portions with inner and outer metallic layers 失效
标题翻译：用于制造具有内部和外部金属层的外部引线部分的薄膜载体的薄膜材料
公开(公告)号：US5153707A
公开(公告)日：1992-10-06
申请号：US610046
申请日：1990-11-06
申请人： Yutaka Makino , Kazumi Ishimoto , Yasuo Izumi , Yuji Uesugi
发明人： Yutaka Makino , Kazumi Ishimoto , Yasuo Izumi , Yuji Uesugi
IPC分类号： H01L23/495 , H01L23/498 , H01L23/544 , H05K1/09 , H05K3/02
CPC分类号： H01L23/49572 , H01L23/4985 , H01L23/544 , H05K3/027 , H01L2223/5442 , H01L2223/54473 , H01L2224/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L24/48 , H01L2924/00014 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/1532 , H01L2924/181 , H05K1/09
摘要： A film material for manufacturing film carriers and its manufacturing method wherein the film material common in all may be applied with respect to the various semiconductor chips which are different in the electrode layout, because the inner lead portions for bump connection use which are required to be changed each time the electrode layout of the semiconductor chip changes are not pattern formed, and are kept as the inner lead forming portion with the whole remaining covered with the conductive metallic layer, and, the manufacturing apparatus for etching mask and model and so on have only to be one in type.
摘要翻译：用于制造薄膜载体的薄膜材料及其制造方法，其中可以相对于电极布局不同的各种半导体芯片，可以应用共同的薄膜材料，因为需要使用凸块连接用的内部引线部分半导体芯片的电极布局每次改变都不会形成图案，并且保持为内部引线形成部分，整个仍然被导电金属层覆盖，并且用于蚀刻掩模和模型等的制造装置具有只有一个在类型。

10. 发明授权

US5118556A Film material for film carrier manufacture and a method for manufacturing film carrier 失效
标题翻译：薄膜载体制造用薄膜材料及薄膜载体的制造方法
公开(公告)号：US5118556A
公开(公告)日：1992-06-02
申请号：US593020
申请日：1990-10-03
申请人： Yutaka Makino , Kazumi Ishimoto , Koichi Kumagai , Yasuo Izumi
发明人： Yutaka Makino , Kazumi Ishimoto , Koichi Kumagai , Yasuo Izumi
IPC分类号： H01L23/50 , H01L21/00 , H01L21/60 , H01L23/495 , H01L23/498 , H05K3/02
CPC分类号： H01L21/67132 , H01L23/49572 , H01L23/4985 , H05K3/027 , H01L2224/16225 , H01L2224/16245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01079 , H01L2924/12042 , H01L2924/1532 , H01L2924/181 , Y10S428/901 , Y10T428/24917
摘要： A film material for the manufacture of a film carrier has a lead pattern including an outer lead portion formed independent of the electrode arrangement of a semiconductor chip to be mounted on the film carrier, and an inner lead formation portion a part of which is selectively removable in accordance with the electrode arrangement of the semiconductor chip to be mounted thereon, the inner lead formation portion being contiguous and connected to respective leads of the outer lead portion. A method for manufacturing the film carrier includes the steps of forming a conductive layer of material on a film; forming the lead pattern by etching part of the layer formed on the film into an outer lead portion having a pattern independent of the electrode arrangement of each semiconductor chip to be mounted thereon, and by leaving another part of the layer as it is to form an inner lead formation portion having a pattern which is changeable according to the electrode arrangement of the semiconductor chip to be mounted thereon; and selectively removing part of the inner lead formation portion by laser processing in accordance with the electrode arrangement of the semiconductor chip to be mounted thereon.
摘要翻译：用于制造薄膜载体的薄膜材料具有引线图案，其包括独立于要安装在薄膜载体上的半导体芯片的电极布置而形成的外部引线部分，以及内部引线形成部分，其一部分可选择性地移除根据要安装在其上的半导体芯片的电极布置，内引线形成部分邻接并连接到外引线部分的相应引线。制造薄膜载体的方法包括以下步骤：在薄膜上形成材料的导电层; 通过将形成在膜上的层的一部分蚀刻到具有独立于要安装在其上的每个半导体芯片的电极布置的图案的外引线部分中，并且通过使层的另一部分原样形成来形成引线图案内引线形成部，其具有根据要安装在其上的半导体芯片的电极布置而可改变的图案; 并且根据要安装在其上的半导体芯片的电极布置，通过激光加工选择性地去除内部引线形成部分的一部分。

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