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    • 1. 发明授权
    • Atmosphere furnace
    • 大气炉
    • US5017131A
    • 1991-05-21
    • US545891
    • 1990-06-29
    • Syoji SatoYutaka MakinoKazumi IshimotoYasuo Izumi
    • Syoji SatoYutaka MakinoKazumi IshimotoYasuo Izumi
    • B23K1/008C23C2/28F27B9/02F27B9/04F27B9/24F27D3/00F27D7/04F27D19/00H05K3/34
    • F27B9/24F27B9/028F27B9/04F27D2003/0061F27D2003/0087F27D2007/045F27D2019/0018
    • An atmosphere furnace including a plurality of divided furnace units, work transfer devices connecting the adjacent divided furnace units and those for the divided furnace units at both ends of the furnace. Each transfer device includes a tubular connecting frame and a work transfer member housed therein and the work transfer member has a work housing space in it. The work transfer member is rotatable, receives at a first position the work from outside or from an adjacent divided furnace unit into its work housing space, and send it out of the furnace or pass it to the adjacent divided furnace unit at a second position. When the work transfer member is at a middle position between the first and the second positions, the work housing space thereof faces an inner surface of the connecting frame so as to be sealed against the both end openings of the frame. Furthermore, it is provided with a channel for receiving the atmosphere from any divided furnace unit or outside space when the transfer member is at the middle position so as to have the work in the work housing space gradually heated or cooled through introduction of the atmosphere.
    • 包括多个分割炉单元的气氛炉,连接相邻的分割炉单元的工件传送装置和炉两端的分割炉单元。 每个传送装置包括容纳在其中的管状连接框架和工件传送构件,并且工件传送构件在其中具有工作容纳空间。 工件传送构件是可旋转的,在第一位置将工件从外部或从相邻的分割炉单元接收到其工作容纳空间中,并将其从炉中送出或在第二位置将其传递到相邻的分割炉单元。 当工件传送构件处于第一位置和第二位置之间的中间位置时,其工作容纳空间面向连接框架的内表面,以便与框架的两端开口密封。 此外,当传送构件处于中间位置时,设置有用于从任何分开的炉单元或外部空间接收气氛的通道,以便通过引入气氛而使作业容纳空间中的工作逐渐加热或冷却。
    • 2. 发明授权
    • Method for connecting electronic component with substrate
    • 电子部件与基板的连接方法
    • US5289966A
    • 1994-03-01
    • US942167
    • 1992-09-08
    • Yasuo IzumiSyoji SatoHiroshi YamauchiRyoji Inutsuka
    • Yasuo IzumiSyoji SatoHiroshi YamauchiRyoji Inutsuka
    • B23K1/005B23K1/20H05K3/34B23K31/02
    • B23K1/0056B23K1/203H05K3/3415H05K3/3494B23K2201/36H05K2201/10689H05K2203/043H05K2203/0475H05K2203/107H05K2203/111H05K2203/1476Y02P70/613
    • A method is provided for electrically connecting a first electronic component which is not resistant to a reflowing temperature and a second electronic component which is resistant to the reflowing temperature to a substrate. The method includes the steps of applying cream solder to a first predetermined portion of the substrate so that the first electronic component is connected therewith and to a second predetermined portion of the substrate so that the second electronic component is connected therewith, mounting the second electronic component on the substrate, heating the second electronic component mounted on the substrate by reflowing so as to solder the second electronic component onto the substrate, forming a pre-soldered portion made of cream solder on the first predetermined portion of the substrate, applying flux to one of the first electronic component and the pre-soldered portion, mounting the first electronic component on the first predetermined portion of the substrate, melting the cream solder of the pre-soldered portion by heating the substrate locally, and soldering the first electronic component onto the substrate. Another method for electrically connecting an unwashable electronic component and a washable electronic component to a substrate includes similar steps to those of the method above.
    • 提供了一种将不具有回流温度的第一电子部件和耐回流温度的第二电子部件电连接到基板的方法。 该方法包括以下步骤:将膏状焊料施加到基板的第一预定部分,使得第一电子元件与其连接并连接到基板的第二预定部分,使得第二电子元件与其连接,将第二电子元件 在基板上,通过回流加热安装在基板上的第二电子部件,以将第二电子部件焊接到基板上,在基板的第一预定部分上形成由膏状焊料制成的预焊部分,将焊剂施加到一个 将第一电子部件安装在基板的第一预定部分上,通过局部加热基板来熔化预焊部分的焊膏,并将第一电子部件焊接到第一电子部件上 基质。 将不可洗涤的电子部件和可洗涤电子部件电连接到基板的另一种方法包括与上述方法相似的步骤。
    • 4. 发明授权
    • Semiconductor device
    • 半导体器件
    • US4412237A
    • 1983-10-25
    • US143472
    • 1980-08-29
    • Nobutake MatsumuraRyusuke HoshikawaYoshihide SugiuraHiroaki IchikawaSyoji Sato
    • Nobutake MatsumuraRyusuke HoshikawaYoshihide SugiuraHiroaki IchikawaSyoji Sato
    • H01L21/822G11C5/06G11C11/412G11C11/417G11C11/418H01L21/82H01L27/04H01L27/118H01L29/78H03K3/356H01L27/02
    • H01L27/11807G11C11/412G11C11/417G11C11/418G11C5/063H03K3/356104Y10S257/923
    • Disclosed is a semiconductor device having a large number of basic cells, wherein a plurality of basic cells arranged along rows of a semiconductor substrate form a basic cell array and a plurality of the basic cell arrays are arranged along columns of the substrate, and further including spaces formed between each adjoining column. Each basic cell is comprised of first and second P-channel MIS transistors and first and second N-channel MIS transistors. The gates of both the first P-channel and the first N-channel MIS transistors form a first single common gate, and the gates of both the second P-channel and the second N-channel MIS transistors form a second single common gate. The sources or the drains of both the first P-channel and the second P-channel MIS transistors form a first single common source or drain, and the sources or the drains of both the first N-channel and the second N-channel MIS transistors form a second single common source or drain. Each of the first and second single common gates has two terminal electrodes at both sides of respective basic cell array and a central terminal electrode at the center of the respective basic cell array. Further, each of the basic cells includes a small space extending between both sides of the basic cell array, which space can be utilized as a field for distributing, along a row, interconnecting lines.
    • PCT No.PCT / JP78 / 00048 Sec。 371日期1979年8月29日第 102(e)日期1979年8月29日PCT提交1978年12月11日PCT公布。 出版物WO79 / 00461 日期:1979年7月26日。公开是具有大量基本单元的半导体器件,其中沿着半导体衬底的行排列的多个基本单元形成基本单元阵列,并且多个基本单元阵列沿着列 并且还包括在每个相邻的柱之间形成的空间。 每个基本单元包括第一和第二P沟道MIS晶体管以及第一和第二N沟道MIS晶体管。 第一P沟道和第一N沟道MIS晶体管的栅极形成第一单个公共栅极,并且第二P沟道和第二N沟道MIS晶体管的栅极形成第二单个公共栅极。 第一P沟道和第二P沟道MIS晶体管的源极或漏极形成第一单个公共源极或漏极,并且第一N沟道和第二N沟道MIS晶体管的源极或漏极 形成第二个单一的共同来源或渠道。 第一和第二单个公共门中的每一个在各个基本单元阵列的两侧具有两个端子电极和位于各个基本单元阵列的中心的中心端子电极。 此外,每个基本单元包括在基本单元阵列的两侧之间延伸的小空间,该空间可以用作沿着一行互连线分布的场。
    • 5. 发明授权
    • Screen printing apparatus and screen printing method
    • 丝网印刷设备和丝网印刷方法
    • US06105495A
    • 2000-08-22
    • US180443
    • 1998-11-06
    • Ken TakahashiSyoji SatoHiroaki OnishiKoji MitsushiroTakao Naito
    • Ken TakahashiSyoji SatoHiroaki OnishiKoji MitsushiroTakao Naito
    • B41F15/08B41F15/40B41F15/42H05K3/12H05K3/34B41F15/46
    • B41F15/423H05K3/1216
    • In a screen printing apparatus and method for using a squeegee to press printing paste on a screen while moving the squeegee in the horizontal direction in order to apply the paste to a circuit board for printing, accurate printing with excellent printed shapes is provided by allowing the squeegee to flexibly fit the circuit regardless of its slope, swell, or warp to achieve balanced printing at a low specified pressure. To accomplish this, squeegees (26a and 26b) are elevated by an air cylinder (27) that can be rotated at the longitudinal center of the squeegees (26a and 26b) and that cancels their weight, and are then pressed downward by air cylinders (35 and 36) located symmetrically about the center in order to press the top surface of a screen (23).
    • PCT No.PCT / JP97 / 01782 Sec。 371日期:1998年11月6日 102(e)日期1998年11月6日PCT 1997年5月26日PCT公布。 出版物WO97 / 45264 日期1997年12月4日在丝网印刷装置和方法中,为了将印刷膏施加到印刷电路板上,使用刮板将印刷浆料沿水平方向移动的同时将印刷浆料压在筛网上, 通过允许刮板灵活地装配电路而不管其斜率,膨胀或翘曲,以在低指定压力下实现平衡打印来提供。 为了实现这一点,刮板(26a和26b)被可以在刮板(26a和26b)的纵向中心处旋转并且抵消它们的重量的气缸(27)升高,然后被气缸向下压 35和36)围绕中心对称设置,以便按压屏幕(23)的顶面。
    • 9. 发明授权
    • Printing apparatus and method for inspecting printed materials
    • 用于检查印刷品的印刷装置和方法
    • US5740729A
    • 1998-04-21
    • US536262
    • 1995-09-29
    • Osamu HikitaSyoji SatoToshinori MimuraKazue OkanoueYouichi Nakamura
    • Osamu HikitaSyoji SatoToshinori MimuraKazue OkanoueYouichi Nakamura
    • B41F15/08B41F15/12B41F15/26B41F33/00B41M1/12B41M1/34H05K3/12H05K3/34B41F15/18
    • B41F15/12B41F15/26B41F33/0036B41M1/12H05K3/1216B41M1/34
    • In a printing apparatus and method, printing material is printed on to-be-printed circuit boards in a predetermined pattern and a printing state of the material is inspected. The apparatus includes the following devices. A board supporting device has a rotary body supporting a plurality of board-fixed tables to which the boards are secured, and turns the rotary body together with the board-fixed tables intermittently at predetermined angular intervals so as to stop the board-fixed tables at each of a fixing, recognizing, printing, and inspecting position. A board feed device feeds the boards to the board-fixed tables arranged at the fixing position. A board discharge device discharges the boards from the board-fixed tables arranged at the fixing position. A recognizing device recognizes fixed positions of the boards relative to the board-fixed tables at the recognizing position. A printing device prints the printing material on the boards at the printing position. An inspecting device inspects the printing state of the boards at the inspecting position. The method carries out the board-feeding, position recognizing, printing, printing-state-inspecting, and board-discharging operations by use of the corresponding devices.
    • 在打印设备和方法中,印刷材料以预定图案印刷在印刷电路板上,并检查材料的印刷状态。 该装置包括以下装置。 板支撑装置具有支撑板固定的多个板固定台的旋转体,并以预定的角度间隔间歇地将旋转体与板固定台一起转动,以便将板固定台停止在 每个固定,识别,打印和检查位置。 板馈送装置将板馈送到布置在固定位置的板固定台。 板放电装置将板从布置在固定位置的板固定台排出。 识别装置在识别位置识别板相对于板固定台的固定位置。 打印装置在打印位置将打印材料打印在印刷电路板上。 检查装置在检查位置检查印版的印刷状态。 该方法通过使用相应的设备进行板进给,位置识别,打印,打印状态检查和板放电操作。