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1. 发明申请

US20060111065A1 Electronic circuit and method of manufacturing the same 审中-公开
标题翻译：电子电路及其制造方法
公开(公告)号：US20060111065A1
公开(公告)日：2006-05-25
申请号：US11052785
申请日：2005-02-09
申请人： Yasuhide Kuroda
发明人： Yasuhide Kuroda
IPC分类号： H04B1/46
CPC分类号： H01G4/38 , H01L27/016 , H05K1/0231 , H05K1/0237 , H05K2201/0382 , H05K2201/1028 , H05K2201/10484 , H05K2201/1053 , H05K2201/10636 , H05K2203/0195 , H05K2203/041 , Y02P70/611
摘要： In an electronic circuit capable of eliminating a direct current component while suppressing deterioration of frequency characteristics in a wide frequency band, the electronic circuit includes a first capacitor, which eliminates, when the wide frequency band is divided into a low frequency band and a high frequency band, the direct current component of the low frequency band, and a plurality of second capacitors each disposed to each fine band when the high frequency band is further divided into fine bands to eliminate the direct current components of the fine bands, wherein the first capacitor and the second capacitor are connected in parallel with each other. There is also provided a method of manufacturing the electronic circuit.
摘要翻译：在能够消除直流成分同时抑制宽频带中的频率特性劣化的电子电路中，电子电路包括第一电容器，其将宽频带分为低频带和高频频带，低频带的直流分量，以及多个第二电容器，每个第二电容器，当高频带进一步被划分为细小频带，以消除精细频带的直流分量时，每个精细频带都设置在其中，其中第一电容器并且第二电容器彼此并联连接。还提供了一种制造电子电路的方法。

2. 发明授权

US09117788B2 Heat sink device and method of repairing semiconductor device 有权
标题翻译：散热装置及半导体装置修理方法
公开(公告)号：US09117788B2
公开(公告)日：2015-08-25
申请号：US13184723
申请日：2011-07-18
申请人： Tsuyoshi Yamamoto , Naoaki Nakamura , Rie Takada , Kenichiro Tsubone , Yasuhide Kuroda , Harumi Yagi
发明人： Tsuyoshi Yamamoto , Naoaki Nakamura , Rie Takada , Kenichiro Tsubone , Yasuhide Kuroda , Harumi Yagi
IPC分类号： H01T23/00 , H01L23/36
CPC分类号： H01L23/36 , F28F3/02 , F28F2280/00 , H01L21/4871 , H01L23/42 , H01L23/433 , H01L2224/16225 , H01L2224/32014 , H01L2224/73253 , Y10T29/49721
摘要： A method of repairing a semiconductor device includes turning a press member to apply pressure on an electronic component which is mounted on a substrate. A heat sink which is provided on the electronic component via a bonding layer is thus displaced with respect to the electronic component in a transverse direction. The heat sink is removed from the electronic component by shearing the bonding layer with the press member.
摘要翻译：一种修复半导体器件的方法包括转动按压部件以对安装在基板上的电子部件施加压力。因此，通过接合层设置在电子部件上的散热器相对于电子部件在横向上位移。通过用压力构件剪切结合层，从电子部件去除散热器。

3. 发明申请

US20050074243A1 Optical module 失效
标题翻译：光模块
公开(公告)号：US20050074243A1
公开(公告)日：2005-04-07
申请号：US10980790
申请日：2004-11-04
申请人： Yasuhide Kuroda , Masakazu Kishi , Yoshinori Nakane , Satoru Yamada , Kenichiro Tsubone , Yuji Miyaki , Shigeichi Izumi , Kazuhiro Suzuki
发明人： Yasuhide Kuroda , Masakazu Kishi , Yoshinori Nakane , Satoru Yamada , Kenichiro Tsubone , Yuji Miyaki , Shigeichi Izumi , Kazuhiro Suzuki
IPC分类号： H05K9/00 , G02B6/42 , H01L23/02 , H01L25/00 , H01L31/02 , H05K1/02 , H05K1/14 , H05K3/30 , H05K3/34 , H04B10/00
CPC分类号： H05K1/144 , G02B6/4201 , G02B6/4277 , H01L2224/48091 , H01L2224/49175 , H01L2924/16195 , H01L2924/3011 , H01L2924/30111 , H01L2924/3025 , H05K1/0243 , H05K1/141 , H05K1/145 , H05K3/308 , H05K3/3442 , H05K3/3447 , H05K2201/045 , H05K2201/09809 , H05K2201/10121 , H05K2201/10446 , H01L2924/00014 , H01L2924/00
摘要： An optical module which can achieve miniaturization, high performance and cost reduction is, provided. The optical module includes a photoelectric component, a high-speed signal processing part which processes a high-speed signal photoelectrically converted by the photoelectric component, and a low-speed signal processing part which processes a low-speed signal. The high-speed signal processing part and the low-speed signal processing part are overlapped with each other in a vertical direction and electrically connected to each other.
摘要翻译：提供了可以实现小型化，高性能和降低成本的光学模块。光模块包括光电元件，处理由光电元件光电转换的高速信号的高速信号处理部分和处理低速信号的低速信号处理部分。高速信号处理部分和低速信号处理部分在垂直方向上彼此重叠并且彼此电连接。

4. 发明授权

US06282098B1 Electronic circuit module, electronic circuit module connecting structure and connecting member, and method for connecting the same 失效
标题翻译：电子电路模块，电子电路模块连接结构和连接构件及其连接方法
公开(公告)号：US06282098B1
公开(公告)日：2001-08-28
申请号：US09270842
申请日：1999-03-18
申请人： Makoto Totani , Yasuhide Kuroda , Masaki Ono , Takayoshi Tanemura , Tetsuya Kiyonaga
发明人： Makoto Totani , Yasuhide Kuroda , Masaki Ono , Takayoshi Tanemura , Tetsuya Kiyonaga
IPC分类号： H05K114
CPC分类号： H05K1/142 , H01L25/105 , H01L2224/48091 , H01L2224/48227 , H01L2225/1005 , H01L2924/01079 , H01L2924/01327 , H01L2924/15153 , H01L2924/15159 , H01L2924/15165 , H01L2924/16195 , H01L2924/3011 , Y10S439/928 , H01L2924/00014 , H01L2924/00
摘要： An electronic circuit module has an electronic circuit module main body and two signal pedestals, one on each side of the main body. The first signal pedestal is formed at a level higher than the second signal pedestal by an amount equal to the vertical thickness of the second signal pedestal. Signal lines are formed on a bottom surface of the first signal pedestal and on a top surface of the second signal pedestal. When connected to adjacent electronic circuit modules, the first signal pedestal of the electronic circuit module overlaps a second signal pedestal of one adjacent electronic circuit module, and the second signal pedestal underlaps a first signal pedestal of another adjacent electronic circuit module to electrically connect electronic circuit modules in multiple stages, improving signal connections and reducing the size of the electronic circuit module package.
摘要翻译：电子电路模块具有电子电路模块主体和两个信号基座，一个在主体的每一侧。第一信号基座以比第二信号基座的垂直厚度大的量形成在高于第二信号基座的电平上。信号线形成在第一信号基座的底表面上和第二信号基座的顶表面上。当连接到相邻的电子电路模块时，电子电路模块的第一个信号基座与一个相邻的电子电路模块的第二个信号基座重叠，而第二个信号基座叠加另一个相邻电子电路模块的第一个信号基座，以电连接电子电路模块在多个阶段，改善信号连接和减小电子电路模块封装的尺寸。

5. 发明授权

US07527501B2 Coaxial connector, connector assembly, printed circuit board and electronic apparatus 失效
标题翻译：同轴连接器，连接器组件，印刷电路板和电子设备
公开(公告)号：US07527501B2
公开(公告)日：2009-05-05
申请号：US11525902
申请日：2006-09-25
申请人： Yasuhide Kuroda , Takatoshi Yagisawa
发明人： Yasuhide Kuroda , Takatoshi Yagisawa
IPC分类号： H01R12/00
CPC分类号： H01P5/085 , H01R12/63 , H01R24/50 , H01R2103/00 , H05K1/0243 , H05K1/189 , H05K2201/09809 , H05K2201/10189 , H05K2201/10446
摘要： A coaxial connector is configured to be connected to a flexible printed circuit board on which a signal line is formed. An inner conductor is configured to be connected to the signal line. An outer conductor surrounds the inner conductor and serves as a connector body. At least one slit is provided to the outer conductor so that a portion of the flexible printed circuit board is inserted therein.
摘要翻译：同轴连接器被配置为连接到其上形成有信号线的柔性印刷电路板。内导体被配置为连接到信号线。外导体围绕内导体并用作连接体。至少一个狭缝设置到外部导体，使得柔性印刷电路板的一部分插入其中。

6. 发明申请

US20080225500A1 Printed circuit board unit and printed wiring board 审中-公开
标题翻译：印刷电路板单元和印刷线路板
公开(公告)号：US20080225500A1
公开(公告)日：2008-09-18
申请号：US12073369
申请日：2008-03-04
申请人： Yasuhide Kuroda , Tetsuji Ishikawa
发明人： Yasuhide Kuroda , Tetsuji Ishikawa
IPC分类号： H05K7/12
CPC分类号： H05K3/3442 , H05K1/111 , H05K2201/09381 , H05K2201/10636 , Y02P70/611 , Y02P70/613
摘要： An electronic component has a pair of electrically-conductive terminals. Electrically-conductive pads are opposed to each other on the surface of a substrate at the inner edges defined along parallel first reference lines. Solder is placed on the electrically-conductive pads for bonding the electrically-conductive terminals to the electrically-conductive pads, respectively. The electrically-conductive pad includes protruding sections formed continuous with a main section having the side edges along parallel second reference lines intersecting with the first reference lines. The protruding sections protrude outside the second reference lines along corresponding one of the first reference line. The surface tensions of the melted solder on the main section and the protruding sections are balanced with each other. The electronic component is thus prevented from standing up. The electronic component is prevented from suffering from tombstone phenomenon.
摘要翻译：电子部件具有一对导电端子。导电焊盘在沿着平行的第一参考线限定的内边缘处在基板的表面上彼此相对。焊料放置在导电焊盘上，用于将导电端子分别连接到导电焊盘。导电垫包括与主部分连续形成的突出部分，该主部分具有沿与第一参考线交叉的平行的第二参考线的侧边缘。突出部分沿着第一参考线中的相应一个突出到第二参考线的外侧。主体部分和突出部分上熔化的焊料的表面张力彼此平衡。因此防止电子部件站起来。防止电子部件遭受墓碑现象。

7. 发明申请

US20070164843A1 Coil package and bias tee package 失效
标题翻译：线圈封装和偏置三通封装
公开(公告)号：US20070164843A1
公开(公告)日：2007-07-19
申请号：US11366625
申请日：2006-03-03
申请人： Takatoshi Yagisawa , Tadashi Ikeuchi , Yasuhide Kuroda , Tszshing Cheung
发明人： Takatoshi Yagisawa , Tadashi Ikeuchi , Yasuhide Kuroda , Tszshing Cheung
IPC分类号： H01F27/02
CPC分类号： H01F5/00 , H01F27/027 , H01F2005/006 , H01Q1/36 , H01Q19/09 , H05K1/0243
摘要： A coil package which makes it easy to handle a high-frequency cone/pyramid-shaped coil and enhance frequency characteristics without degrading the characteristics of the coil. The cone/pyramid-shaped coil has a conical or pyramidal shape formed by wiring a conductor wire around an outer peripheral surface of a core such that the winding diameter of the coil progressively decreases from one end to the other end of the coil. The coil and a dielectric substrate are integrated with each other by forming a hole for inserting a tip portion of the coil in the dielectric substrate, making the bottom of the hole and a back surface of the dielectric substrate electrically continuous by a via, placing the coil in the hole by directing a small-diameter side of the cone/pyramid-shaped coil to the hole, electrically connecting the bottom of the hole and a tip-side lead wire extending from the coil to each other, and connecting an electrode on a large-diameter side of the coil to an electrode on the dielectric substrate.
摘要翻译：一种线圈封装，使其易于处理高频锥/棱锥形线圈并增强频率特性，而不会降低线圈的特性。锥形/棱锥形线圈具有锥形或棱锥形状，其通过将导体线布置在芯的外周表面上而形成，使得线圈的卷绕直径从线圈的一端逐渐减小到另一端。线圈和电介质基板通过形成用于将线圈的尖端部分插入电介质基板的孔而彼此一体化，使得孔的底部和电介质基板的后表面通过通孔电连续，通过将锥形/锥体形的线圈的小直径侧引导到孔中，将孔的底部电连接到彼此的线圈和从线圈延伸的尖端侧引线，并将电极线圈的大直径侧到电介质基板上的电极。

8. 发明授权

US4790368A Method of manufacturing thin metal sheet directly from molten metal and apparatus for manufacturing same 失效
标题翻译：直接从熔融金属制造薄金属片的方法及其制造方法
公开(公告)号：US4790368A
公开(公告)日：1988-12-13
申请号：US89913
申请日：1987-08-24
申请人： Takaji Kusakawa , Kazuo Ebato , Takeya Tohge , Masato Noda , Yasuhide Kuroda
发明人： Takaji Kusakawa , Kazuo Ebato , Takeya Tohge , Masato Noda , Yasuhide Kuroda
IPC分类号： B22D11/06 , B22D11/10
CPC分类号： B22D11/0622 , B22D11/064
摘要： A wide thin metal sheet having a smooth surface may be manufactured directly from molten metal. A lower end of a nozzle installed vertically at the bottom of a molten metal vessel is held in contact with an inclined plate made of a refractory material, molten metal is discharged in a fan-shape from a notch formed in the peripheral wall of the nozzle end, the discharged molten metal being rendered into a constant shape laminar flow having a uniform flow rate distribution on the inclined surface as it flows down the inclined plate. The constant shape laminar flow is supplied to a molten metal pool between a pair of rollers of internally water-cooled type without any disturbance on the surface and in the inside. The metal solidified in the neighborhood of a portion of the gap between the two rollers is discharged from an open-at-the-bottom space defined between the two rollers.
摘要翻译：可以直接从熔融金属制造具有光滑表面的宽金属片。垂直设置在熔融金属容器底部的喷嘴的下端与由耐火材料制成的倾斜板保持接触，熔融金属从形成在喷嘴周壁的凹口中以扇形排出结束，排出的熔融金属在倾斜面上流动时，在倾斜表面上呈现具有均匀流量分布的恒定形状的层流。恒定形状的层流被供给到内部水冷式的一对辊之间的熔融金属池中，在表面和内部没有任何干扰。在两个辊之间的间隙的一部分附近固化的金属从限定在两个辊之间的开放的底部空间排出。

9. 发明授权

US07443279B2 Coil package and bias tee package 失效
标题翻译：线圈封装和偏置三通封装
公开(公告)号：US07443279B2
公开(公告)日：2008-10-28
申请号：US11366625
申请日：2006-03-03
申请人： Takatoshi Yagisawa , Tadashi Ikeuchi , Yasuhide Kuroda , Tszshing Cheung
发明人： Takatoshi Yagisawa , Tadashi Ikeuchi , Yasuhide Kuroda , Tszshing Cheung
IPC分类号： H01F27/28 , H03H7/00
CPC分类号： H01F5/00 , H01F27/027 , H01F2005/006 , H01Q1/36 , H01Q19/09 , H05K1/0243
摘要： A coil package which makes it easy to handle a high-frequency cone/pyramid-shaped coil and enhance frequency characteristics without degrading the characteristics of the coil. The cone/pyramid-shaped coil has a conical or pyramidal shape formed by wiring a conductor wire around an outer peripheral surface of a core such that the winding diameter of the coil progressively decreases from one end to the other end of the coil. The coil and a dielectric substrate are integrated with each other by forming a hole for inserting a tip portion of the coil in the dielectric substrate, making the bottom of the hole and a back surface of the dielectric substrate electrically continuous by a via, placing the coil in the hole by directing a small-diameter side of the cone/pyramid-shaped coil to the hole, electrically connecting the bottom of the hole and a tip-side lead wire extending from the coil to each other, and connecting an electrode on a large-diameter side of the coil to an electrode on the dielectric substrate.
摘要翻译：一种线圈封装，使其易于处理高频锥/棱锥形线圈并增强频率特性，而不会降低线圈的特性。锥形/棱锥形线圈具有锥形或棱锥形状，其通过将导体线布置在芯的外周表面上而形成，使得线圈的卷绕直径从线圈的一端逐渐减小到另一端。线圈和电介质基板通过形成用于将线圈的尖端部分插入电介质基板的孔而彼此一体化，使得孔的底部和电介质基板的后表面通过通孔电连续，通过将锥形/锥体形的线圈的小直径侧引导到孔中，将孔的底部电连接到彼此的线圈和从线圈延伸的尖端侧引线，并将电极线圈的大直径侧到电介质基板上的电极。

10. 发明授权

US07360439B2 Sample resistance measurement device 有权
标题翻译：采样电阻测量装置
公开(公告)号：US07360439B2
公开(公告)日：2008-04-22
申请号：US11496520
申请日：2006-08-01
申请人： Yasuhide Kuroda , Kenichiro Tsubone
发明人： Yasuhide Kuroda , Kenichiro Tsubone
IPC分类号： G01B7/16
CPC分类号： G01M7/025 , G01R31/048 , G01R31/2817 , H05K2203/162
摘要： In a circuit, as the bridge resistance of one side of a Wheatstone bridge circuit, a distortion gauge (fixed reference resistance) of which variation caused by environmental conditions is suppressed and a sample having a resistance component ΔR varied by the environmental conditions are connected in series. A constant bridge input voltage Ei is applied from a constant-voltage power supply to the Wheatstone bridge circuit, a bridge output voltage Eo corresponding to resistance variation of the sample is input to a dynamic distortion amplifier, and a carrier wave signal of a predetermined frequency is output. A measured resistance computing unit samples peak levels of the carrier wave signal output from the dynamic distortion amplifier so as to detect the bridge output voltage Eo, and calculates the resistance of the sample based on the detected bridge output voltage.
摘要翻译：在电路中，作为惠斯通电桥电路的一侧的桥接电阻，抑制了由环境条件引起的变化的变形量规（固定参考电阻），并且将具有由环境条件变化的电阻分量ΔRR的样品连接在系列。从恒压电源向惠斯登电桥电路施加恒定桥输入电压Ei，将与采样电阻变化对应的桥输出电压Eo输入到动态失真放大器，将预定频率的载波信号被输出。测量电阻计算单元对从动态失真放大器输出的载波信号的峰值电平进行采样，以检测桥输出电压Eo，并根据检测到的桥输出电压来计算采样电阻。

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