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1. 发明授权

US09052333B2 Sensor capable of measuring acceleration, angular velocity, and DC acceleration 有权
标题翻译：能够测量加速度，角速度和直流加速度的传感器
公开(公告)号：US09052333B2
公开(公告)日：2015-06-09
申请号：US13592198
申请日：2012-08-22
申请人： Jung Tae Park , Seung Heon Han , Jong Woon Kim , Heung Woo Park , Jung Won Lee , Jung Eun Noh , Won Kyu Jeung , Sung Jun Lee
发明人： Jung Tae Park , Seung Heon Han , Jong Woon Kim , Heung Woo Park , Jung Won Lee , Jung Eun Noh , Won Kyu Jeung , Sung Jun Lee
IPC分类号： G01P15/11 , G01P15/08 , G01P15/12 , G01C19/56 , G01P15/09 , G01P15/097
CPC分类号： G01P15/12 , G01C19/56 , G01P15/09 , G01P15/097 , G01P2015/084
摘要： Disclosed herein is an inertial sensor including: a membrane; a mass body provided under the membrane; a plurality of patterned magnets provided under the mass body; and a magnetoresistive element provided to be spaced apart from the mass body and measuring static DC acceleration acting on the mass body through resistance changed according to magnetic fields of the plurality of patterned magnets. The plurality of patterned magnets and the magnetoresistive element are included, thereby making it possible to measure static DC acceleration (particularly, gravity acceleration) that is difficult to measure using an existing to piezoelectric element.
摘要翻译：本文公开了一种惯性传感器，包括：膜; 设置在膜下面的质量体; 设置在所述质量体下方的多个图案化磁体; 以及设置成与质量体间隔开的磁阻元件，并且通过根据多个图案化磁体的磁场而改变的电阻测量作用在质量体上的静态直流加速度。包括多个图案化磁体和磁阻元件，从而可以测量使用现有的压电元件难以测量的静态直流加速度（特别是重力加速度）。

2. 发明申请

US20130081465A1 INERTIAL SENSOR AND ANGULAR VELOCITY DETECTION METHOD USING THE SAME 有权
标题翻译：惯性传感器和使用其的角速度检测方法
公开(公告)号：US20130081465A1
公开(公告)日：2013-04-04
申请号：US13591335
申请日：2012-08-22
申请人： Jong Woon Kim , Liwei Lin , Minyao Mao , Won Kyu Jeung
发明人： Jong Woon Kim , Liwei Lin , Minyao Mao , Won Kyu Jeung
IPC分类号： G01C19/56
CPC分类号： G01C19/574
摘要： Disclosed herein is an inertial sensor. The inertial sensor includes: a plurality of driving masses; support bodies supporting the driving masses so as to freely move in a state in which the driving masses float; a connection bridge connecting the plurality of driving masses and connecting the plurality of driving masses with the support bodies; and an electrode pattern part including driving electrodes simultaneously driving the driving masses and sensing electrode detecting axial Coriolis force of each of the driving masses.
摘要翻译：这里公开了惯性传感器。惯性传感器包括：多个驱动质量块; 支撑驱动质量的支撑体，以便在驱动质量浮动的状态下自由移动; 连接所述多个驱动块并将所述多个驱动块与所述支撑体连接的连接桥; 以及电极图案部，其包括驱动电极，同时驱动驱动质量，感测电极检测每个驱动质量块的轴向科里奥利力。

3. 发明申请

US20130068022A1 MICRO ELECTRO MECHANICAL SYSTEMS COMPONENT 有权
标题翻译：微电子机械系统组件
公开(公告)号：US20130068022A1
公开(公告)日：2013-03-21
申请号：US13324918
申请日：2011-12-13
申请人： WON KYU JEUNG , JONG WOON KIM , HEUNG WOO PARK
发明人： WON KYU JEUNG , JONG WOON KIM , HEUNG WOO PARK
IPC分类号： G01P15/097 , H03B5/30 , G01L11/00
CPC分类号： G01C19/56 , G01L9/0047 , G01L9/0048 , G01P15/08 , G01P15/14 , G01P2015/084 , G01P2015/0871 , H03B5/30 , H03H9/2405
摘要： Disclosed herein is a MEMS component. The MEMS component according to the exemplary embodiment of the present invention includes: a plate-shaped membrane 110; a post 130 disposed under an edge 115 of the membrane 110; a stopper 140 disposed under the membrane 110 and disposed more inwardly than the post 130 so as to form a space 143 between the stopper 140 and the post 130; and a cap 150 disposed under the post 130 so as to cover the post 130, whereby the influence of disturbance or noise occurring from external environments or interference from surrounding sensors can be interrupted by using a predetermined region 145 of the membrane 110 disposed above the space 143.
摘要翻译：这里公开了一种MEMS部件。根据本发明的示例性实施例的MEMS部件包括：板状膜110; 设置在膜110的边缘115下方的柱130; 止挡件140，其设置在膜110的下方并且比柱130更靠内侧设置，以便在止动件140和柱130之间形成空间143; 以及设置在柱130下方以覆盖柱130的盖150，由此可以通过使用设置在空间上方的膜110的预定区域145来中断来自外部环境的发生的干扰或噪声的影响或来自周围的传感器的干扰的影响 143。

4. 发明申请

US20120272734A1 Inertial Sensor 有权
标题翻译：惯性传感器
公开(公告)号：US20120272734A1
公开(公告)日：2012-11-01
申请号：US13227305
申请日：2011-09-07
申请人： Won Kyu Jeung , Ho Seop Jeong
发明人： Won Kyu Jeung , Ho Seop Jeong
IPC分类号： G01P15/00
CPC分类号： G01C19/5755 , G01P15/0802 , G01P15/09 , G01P2015/0837
摘要： Disclosed herein is an inertial sensor. An inertial sensor 100 according to a preferred embodiment of the present invention is configured to include a plate-shaped membrane 110 on which a hole 200 penetrating in a thickness direction is formed, a mass body 120 disposed on a bottom of a central portion 113 of the membrane 110, and a post 130 disposed on a bottom of an edge 115 of the membrane 110 to support the membrane 110 and surrounding the mass body 120. By the configuration, the preferred embodiment of the present invention reduces damping force due to viscosity of air at the time of vibration by forming the hole 200 on the membrane 110 to increase displacement or amplitude of the mass body 120, thereby increasing sensitivity of the inertial sensor 100.
摘要翻译：这里公开了惯性传感器。根据本发明的优选实施例的惯性传感器100被构造成包括在其上形成有沿厚度方向穿透的孔200的板状膜110，设置在中心部113的底部的质量体120 膜110和设置在膜110的边缘115的底部上的柱130，以支撑膜110并围绕质量体120.通过这种构造，本发明的优选实施例减少了由于粘度而引起的阻尼力通过在膜110上形成孔200来振动时的空气，以增加质量体120的位移或振幅，由此增加惯性传感器100的灵敏度。

5. 发明申请

US20110146404A1 INERTIAL SENSOR AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：惯性传感器及其制造方法
公开(公告)号：US20110146404A1
公开(公告)日：2011-06-23
申请号：US12716140
申请日：2010-03-02
申请人： Won Kyu JEUNG , Jong Woon Kim
发明人： Won Kyu JEUNG , Jong Woon Kim
IPC分类号： G01P15/09 , H01L41/22
CPC分类号： G01P15/18 , G01C19/56 , G01C25/005 , G01P15/0922 , G01P2015/084 , H01L41/1132 , H01L41/1138 , Y10T29/42
摘要： Disclosed herein is an inertial sensor, which includes a diaphragm having a piezoelectric element or a piezoresistive element formed on one surface thereof, a mass element integrated with the center of the other surface of the diaphragm in which the distal end of the mass element has a larger width than the width of the proximal end in contact with the diaphragm, and a supporter formed along the edge of the other surface of the diaphragm, so that the use of the mass element having the above shape results in decreased spring constant and increased distance from the center of the diaphragm to the center of the mass element, thereby simultaneously realizing a reduction in the size of the inertial sensor and an increase in performance thereof. A method of manufacturing the inertial sensor is also provided.
摘要翻译：本文公开了一种惯性传感器，其包括具有在其一个表面上形成的压电元件或压阻元件的隔膜，质量元件与隔膜的另一表面的中心一体化，质量元件的远端具有比与隔膜接触的近端的宽度大的宽度以及沿着隔膜的另一个表面的边缘形成的支撑件，使得使用具有上述形状的质量元件导致弹簧常数降低和距离增加从隔膜的中心到质量元件的中心，从而同时实现惯性传感器的尺寸的减小和其性能的提高。还提供了制造惯性传感器的方法。

6. 发明申请

US20080304821A1 Camera module package and method of manufacturing the same 审中-公开
标题翻译：相机模块包装及其制造方法相同
公开(公告)号：US20080304821A1
公开(公告)日：2008-12-11
申请号：US12149751
申请日：2008-05-07
申请人： Won Kyu Jeung , Seog Moon Choi , Jingli Yuan , Chang Hyun Lim , Dae Jun Kim
发明人： Won Kyu Jeung , Seog Moon Choi , Jingli Yuan , Chang Hyun Lim , Dae Jun Kim
IPC分类号： G03B17/00 , H01L21/00
CPC分类号： H01L27/14618 , H01L27/14627 , H01L27/14683 , H01L2224/48091 , H04N5/2253 , H04N5/2254 , H04N5/2257 , H01L2924/00014
摘要： The present invention relates to a camera module package having flexibility and a method of manufacturing the same. Provided is the camera module package according to the invention including a silicon wafer mounted with the image sensor in the center of a top surface thereof and provided with pads both sides of the image sensor, a lens unit opened to form a convex lens in a mounting portion of the image sensor in an upper part of the wafer, and a flexible board tightly joined to a bottom surface of the wafer and electrically connected to the pads by an internal pattern. The camera module package can be thinly manufactured and since the camera module package has flexibility, the camera module package can be easily attached to a bendable substrate and to the inside an IT apparatus.
摘要翻译：本发明涉及一种具有灵活性的相机模块封装及其制造方法。提供了根据本发明的相机模块包装，其包括安装有图像传感器的硅晶片在其顶表面的中心并且设置有图像传感器两侧的焊盘，透镜单元被打开以在安装中形成凸透镜图像传感器的一部分在晶片的上部，以及柔性板，其紧密接合到晶片的底表面并且通过内部图案电连接到焊盘。相机模块封装可以被薄制造，并且由于相机模块封装具有灵活性，所以相机模块封装可以容易地附接到可弯曲的基板和IT设备的内部。

7. 发明申请

US20080296577A1 Camera module package 审中-公开
标题翻译：相机模块包
公开(公告)号：US20080296577A1
公开(公告)日：2008-12-04
申请号：US12155268
申请日：2008-05-30
申请人： Jingli Yuan , Won Kyu Jeung , Dae Jun Kim , Chang Hyun Lim , Jae Cheon Doh
发明人： Jingli Yuan , Won Kyu Jeung , Dae Jun Kim , Chang Hyun Lim , Jae Cheon Doh
IPC分类号： H01L31/00 , H01L21/02
CPC分类号： H01L27/14618 , H01L27/14687 , H01L31/0203 , H01L31/02325 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/10253 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： There is provided a camera module package including: a substrate having an image sensor disposed on one surface thereof and a pad electrically connected to the image sensor; a protective cap adhered onto the substrate by an adhesive surrounding the image sensor to seal the image sensor, the protective cap transmitting light; and a supporting part surrounding the protective cap, the supporting part adhering and supporting at least one lens formed corresponding to the image sensor. The camera module package is reduced in thickness and size, and minimized in an error of a focal length between the lens and the image sensor, thereby achieving accuracy and high reliability.
摘要翻译：提供了一种照相机模块包装，包括：具有设置在其一个表面上的图像传感器的基板和与图像传感器电连接的焊盘; 保护盖通过围绕图像传感器的粘合剂附着在基板上，以密封图像传感器，保护盖透射光; 以及围绕保护盖的支撑部分，支撑部分粘附并支撑形成对应于图像传感器的至少一个透镜。相机模块包装的厚度和尺寸减小，并且在透镜和图像传感器之间的焦距误差最小化，从而实现精度和高可靠性。

8. 发明申请

US20130036818A1 INERTIAL SENSOR AND METHOD OF MANUFACTURING THE SAME 有权
公开(公告)号：US20130036818A1
公开(公告)日：2013-02-14
申请号：US13275397
申请日：2011-10-18
申请人： Jong Woon Kim , Sung Jun Lee , Won Kyu Jeung , Min Kyu Choi , Heung Woo Park
发明人： Jong Woon Kim , Sung Jun Lee , Won Kyu Jeung , Min Kyu Choi , Heung Woo Park
IPC分类号： G01C19/00 , C23F1/00 , B29C65/48
CPC分类号： G01C25/00 , B32B37/0076 , B32B37/02 , B32B37/12 , B32B37/18 , B32B38/10 , B32B2457/00 , C23F1/02 , G01C19/5755 , G01C19/5769 , G01P15/08 , G01P15/0802 , G01P15/135 , G01P2015/084 , Y10T156/1064
摘要： Disclosed herein are an inertial sensor and a method of manufacturing the same. The inertial sensor 100 according to a preferred embodiment of the present invention is configured to include a plate-shaped membrane 110, a mass body 120 disposed under a central portion 113 of the membrane 110, a post 130 disposed under an edge 115 of the membrane 110 so as to support the membrane 110, and a bottom cap 150 of which the edge 153 is provided with the first cavity 155 into which an adhesive 140 is introduced, wherein the adhesive 140 bonds an edge 153 to a bottom surface of the post, whereby the edge 153 of the bottom cap 150 is provided with the first cavity 155 to introduce the adhesive 140 into the first cavity 155, thereby preventing the adhesive 140 from being permeated into the post 130.

9. 发明申请

US20120267825A1 METHOD OF MANUFACTURING INERTIAL SENSOR 审中-公开
标题翻译：制造传感器的方法
公开(公告)号：US20120267825A1
公开(公告)日：2012-10-25
申请号：US13184564
申请日：2011-07-17
申请人： Sung Jun LEE , Won Kyu JEUNG
发明人： Sung Jun LEE , Won Kyu JEUNG
IPC分类号： B29C70/00
CPC分类号： G01C19/56 , B81B2201/025 , B81C1/00182 , B81C2201/0108 , B81C2201/0187 , G01P15/0802 , G01P15/09
摘要： The method of manufacturing an inertial sensor includes: (A) disposing a first mold 120 and a second mold 125 on both surfaces of a predetermined region R in a plate-shaped membrane 110, (B) forming a mass body 130, a post 140, and an upper cap 150 through a plating process or a filling process, (C) disposing a third mold 160 on an exposed surface of the first mold 120 and the mass body 130, and (D) forming a lower cap 170 through the plating process or the filling process. Since the mass body 130 is made of metal by a plating process or a filling process, the density of the mass body 130 may be increased and the mass body 130 may be formed to have a structure of a high aspect ratio, thereby improving the sensitivity of the inertial sensor 100.
摘要翻译：惯性传感器的制造方法包括：（A）在板状膜110中的规定区域R的两面上设置第一模具120和第二模具125，（B）形成质量体130，柱140 ，以及通过电镀处理或填充处理的上盖150，（C）在第一模具120和质量体130的暴露表面上设置第三模具160，以及（D）通过电镀形成下盖170 过程或填充过程。由于质量体130通过电镀处理或填充处理由金属制成，因此可以增加质量体130的密度，并且可以将质量体130形成为具有高纵横比的结构，从而提高灵敏度的惯性传感器100。

10. 发明申请

US20090308640A1 Wafer level package and method of manufacturing the same 审中-公开
标题翻译：晶圆级封装及其制造方法
公开(公告)号：US20090308640A1
公开(公告)日：2009-12-17
申请号：US12232253
申请日：2008-09-12
申请人： Won Kyu Jeung , Yi Sung
发明人： Won Kyu Jeung , Yi Sung
IPC分类号： H05K1/03 , H05K3/36
CPC分类号： H05K3/4629 , H01L23/3114 , H01L23/481 , H01L23/49827 , H01L2924/0002 , H05K1/0306 , H05K3/462 , H05K3/4623 , H05K2201/0376 , H05K2201/0949 , H05K2201/10378 , Y10T29/49126 , H01L2924/00
摘要： Provided is a wafer level package including a first substrate that has circuit patterns provided on the top surface thereof and first vias formed therein, the first vias being electrically connected to the circuit patterns; and a second substrate that is bonded to the bottom surface of the first substrate through anodic bonding and has second vias formed therein.
摘要翻译：提供了一种晶片级封装，其包括具有设置在其顶表面上的电路图案的第一基板和形成在其中的第一通孔，第一通孔电连接到电路图案; 以及第二基板，其通过阳极接合而结合到第一基板的底表面，并且具有形成在其中的第二通孔。

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