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    • 4. 发明申请
    • Semiconductor product and method for forming a semiconductor product
    • 用于形成半导体产品的半导体产品和方法
    • US20060286757A1
    • 2006-12-21
    • US11153261
    • 2005-06-15
    • John PowerWolfram Langheinrich
    • John PowerWolfram Langheinrich
    • H01L29/76H01L21/336
    • H01L29/66636H01L27/11568H01L29/7834
    • The invention provides a semiconductor product (25) and a method for forming the semiconductor product (25), the semiconductor product (25) comprising a transistor (1) having first (11) and second source/drain regions (12) being arranged at bottom surfaces (B) of recesses (R) in a substrate (2). Due to the depth (d) of the recesses (R) a vertical offset (29) between the source/drain regions (11, 12) and a gate dielectric (4) is achieved. The vertical offset (29) allows reducing a lateral offset (28) between the source/drain regions (11, 12) and the gate dielectric (4). Thereby, the substrate surface area required for a transistor is reduced. In particular in high voltage areas of semiconductor products like memory devices, substrate area is used more efficiently.
    • 本发明提供半导体产品(25)和形成半导体产品(25)的方法,所述半导体产品(25)包括具有第一(11)和第二源/漏区(12)的晶体管(1) 衬底(2)中凹部(R)的底表面(B)。 由于凹陷(R)的深度(d),实现了源极/漏极区域(11,12)和栅极电介质(4)之间的垂直偏移(29)。 垂直偏移(29)允许减小源极/漏极区域(11,12)和栅极电介质(4)之间的横向偏移(28)。 因此,晶体管所需的衬底表面积减小。 特别是在诸如存储器件的半导体产品的高电压区域中,更有效地使用衬底区域。
    • 5. 发明申请
    • Layer arrangement and memory arrangement
    • 层布置和存储器布置
    • US20060008959A1
    • 2006-01-12
    • US10514168
    • 2003-05-15
    • Peter HagemeyerWolfram Langheinrich
    • Peter HagemeyerWolfram Langheinrich
    • H01L21/336H01L21/8234
    • H01L27/11568H01L27/115H01L27/11526H01L27/11539
    • The disclosed embodiments relate to a method for the production of a layer arrangement, a layer arrangement and a memory arrangement. According to one aspect at least one respectively laterally defined first layer sequence is embodied on a first surface area of a substrate and at least one respectively laterally defined second layer sequence is embodied on a second surface area of the substrate in order to produce a layer arrangement. A first side wall having a first thickness is respectively produced from a first electrically insulating material on at least one partial area of the side walls of the first and second layer sequences. A second side wall layer having a second thickness is respectively produced from a second electrically insulating material on at least one partial area of the first side wall layers and the second side wall layers are removed from the first layer sequences.
    • 所公开的实施例涉及用于生产层布置,层布置和存储器布置的方法。 根据一个方面,至少一个分别横向限定的第一层序列被体现在衬底的第一表面区域上,并且至少一个分别横向限定的第二层序列被实施在衬底的第二表面区域上,以便产生层布置 。 具有第一厚度的第一侧壁分别由第一和第二层序列的侧壁的至少一个部分区域上的第一电绝缘材料制成。 在第一侧壁层的至少一个部分区域上分别由第二电绝缘材料制造具有第二厚度的第二侧壁层,并且从第一层序列中去除第二侧壁层。
    • 7. 发明授权
    • Method for fabricating a layer arrangement, layer arrangement and memory arrangement
    • 用于制造层布置,层布置和存储器布置的方法
    • US07713810B2
    • 2010-05-11
    • US10514168
    • 2003-05-15
    • Peter HagemeyerWolfram Langheinrich
    • Peter HagemeyerWolfram Langheinrich
    • H01L21/8238
    • H01L27/11568H01L27/115H01L27/11526H01L27/11539
    • The disclosed embodiments relate to a method for the production of a layer arrangement, a layer arrangement and a memory arrangement. According to one aspect at least one respectively laterally defined first layer sequence is embodied on a first surface area of a substrate and at least one respectively laterally defined second layer sequence is embodied on a second surface area of the substrate in order to produce a layer arrangement. A first side wall having a first thickness is respectively produced from a first electrically insulating material on at least one partial area of the side walls of the first and second layer sequences. A second side wall layer having a second thickness is respectively produced from a second electrically insulating material on at least one partial area of the first side wall layers and the second side wall layers are removed from the first layer sequences.
    • 所公开的实施例涉及用于生产层布置,层布置和存储器布置的方法。 根据一个方面,至少一个分别横向限定的第一层序列被体现在衬底的第一表面区域上,并且至少一个分别横向限定的第二层序列被实施在衬底的第二表面区域上,以便产生层布置 。 具有第一厚度的第一侧壁分别由第一和第二层序列的侧壁的至少一个部分区域上的第一电绝缘材料制成。 在第一侧壁层的至少一个部分区域上分别由第二电绝缘材料制造具有第二厚度的第二侧壁层,并且从第一层序列中去除第二侧壁层。
    • 10. 发明授权
    • Memory cell arrangement, method for controlling a memory cell, memory array and electronic device
    • 存储单元布置,用于控制存储单元的方法,存储器阵列和电子设备
    • US08320191B2
    • 2012-11-27
    • US12049132
    • 2008-03-14
    • Robert StrenzWolfram LangheinrichMayk RoehrichRobert Wiesner
    • Robert StrenzWolfram LangheinrichMayk RoehrichRobert Wiesner
    • G11C16/04
    • G11C16/0425G11C16/10H01L29/66825H01L29/7881
    • In an embodiment of the invention, a memory cell arrangement includes a substrate and at least one memory cell including a charge storing memory cell structure and a select structure. The memory cell arrangement further includes a first doping well, a second doping well and a third doping well arranged within the substrate, wherein the charge storing memory cell structure is arranged in or above the first doping well, the first doping well is arranged within the second doping well, and the second doping well is arranged within the third doping well. The memory cell arrangement further includes a control circuit coupled with the memory cell and configured to control the memory cell such that the charge storing memory cell structure is programmed or erased by charging or discharging the charge storing memory cell structure via at least the first doping well.
    • 在本发明的一个实施例中,存储单元布置包括衬底和包括电荷存储存储单元结构和选择结构的至少一个存储单元。 存储单元布置还包括第一掺杂阱,第二掺杂阱和布置在衬底内的第三掺杂阱,其中电荷存储存储单元结构布置在第一掺杂阱中或上方,第一掺杂阱布置在 第二掺杂阱,并且第二掺杂阱被布置在第三掺杂阱内。 存储单元布置还包括与存储单元耦合并被配置为控制存储单元的控制电路,使得通过至少第一掺杂阱对电荷存储存储单元结构进行充电或放电来对电荷存储存储单元结构进行编程或擦除 。