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1. 发明授权

US11996772B2 Voltage control method 有权
公开(公告)号：US11996772B2
公开(公告)日：2024-05-28
申请号：US17562047
申请日：2021-12-27
申请人： Szu-Chieh Su , Wei-Chin Tseng , Chih-Hsien Wang , His-Ping Tsai , Wen-Chih Chen , Guei-Cheng Hu
发明人： Szu-Chieh Su , Wei-Chin Tseng , Chih-Hsien Wang , His-Ping Tsai , Wen-Chih Chen , Guei-Cheng Hu
IPC分类号： H02M3/156 , H02M3/335
CPC分类号： H02M3/156 , H02M3/33507
摘要： The present invention provides a voltage control method for controlling a power supply. The voltage control method comprises the following steps: obtaining a present output voltage value associated with a present gain value; obtaining a predetermined output voltage value associated with a predetermined duty ratio; calculating a target gain value, corresponding to the predetermined duty ratio, according to a gain value formula; performing a weight calculation on the present gain value and the target gain value for generating a buffer gain value; and setting an output voltage command according to the buffer gain value. Wherein the buffer gain value is between the present gain value and the target gain value.

2. 发明申请

US20110082666A1 Numerical Engineering Model System And Accessing Method Thereof 审中-公开
标题翻译：数值工程模型系统及其访问方法
公开(公告)号：US20110082666A1
公开(公告)日：2011-04-07
申请号：US12572269
申请日：2009-10-02
申请人： Wen-Chih Chen , Szu-Hsien Ho , Ping-Hsing Ho , Chih-Wei Cheng
发明人： Wen-Chih Chen , Szu-Hsien Ho , Ping-Hsing Ho , Chih-Wei Cheng
IPC分类号： G06F17/50
CPC分类号： G06F17/50 , G06F2217/04
摘要： A numerical engineering model system is installed in a computer server and remotely operated by a local device via a network, which includes a user interface showing an operating page and receiving the numerical parameters, an analyzing module having at least one engineering model presented as the numerical parameters and a corresponding picture, a database storing the inputted numerical parameters and the picture, an engineering software means processing the inputted numerical parameters, and building, simulating and analyzing a 2D/3D model, and then storing the 2D/3D model, a simulating result and an analyzing result in the database. It is convenient for the users to remotely operate the system via any computer with network function. It simplifies the design procedures and reduces the design cost and design time because the engineering model is presented as numerical parameters and the corresponding picture. Furthermore, it is easy to understand and operate by common users without engineering knowledge.
摘要翻译：数字工程模型系统安装在计算机服务器中，并且经由网络由本地设备远程操作，其包括显示操作页面和接收数值参数的用户界面，分析模块具有至少一个工程模型作为数字参数和相应的图片，存储输入的数字参数和图片的数据库，工程软件意味着处理输入的数值参数，构建，模拟和分析2D / 3D模型，然后存储2D / 3D模型，模拟结果和数据库中的分析结果。用户可以通过具有网络功能的任何计算机远程操作系统。它简化了设计过程，降低了设计成本和设计时间，因为工程模型是以数值参数和相应的图片表示的。此外，在没有工程知识的情况下，普通用户很容易理解和操作。

3. 发明授权

US07690263B2 Strain sensor and a method of making the same 有权
标题翻译：应变传感器及其制作方法
公开(公告)号：US07690263B2
公开(公告)日：2010-04-06
申请号：US11603863
申请日：2006-11-24
申请人： Shien-Uang Jen , Wen-Chih Chen , Yuan-Tsung Chen , Yeong-Der Yao
发明人： Shien-Uang Jen , Wen-Chih Chen , Yuan-Tsung Chen , Yeong-Der Yao
IPC分类号： G01L1/00
CPC分类号： H01C17/075 , G01L1/125 , G01L1/2287 , H01C10/10 , Y10T29/49103
摘要： A strain sensor is provided including a substrate, and a sensing layer, including cobalt, provided on the substrate. A first electrode is coupled to the sensing layer, and a tunnel layer including aluminum oxide is provided on the sensing layer. In addition, a pinned layer, also including cobalt, is provided on the tunnel layer. An exchange biasing layer is provided on the pinned layer, and a second electrode is coupled to the exchange biasing layer. The strain sensor is configured such that, over a range of values of strain applied to the sensor, a resistance of the sensor is a linear function of the strain. A related method is also disclosed.
摘要翻译：提供了一种应变传感器，包括设置在基板上的基板和包括钴的感测层。第一电极耦合到感测层，并且在感测层上提供包括氧化铝的隧道层。此外，在隧道层上设置了还包括钴的钉扎层。交换偏压层设置在钉扎层上，第二电极耦合到交换偏置层。应变传感器构造成使得在施加到传感器的应变值的范围内，传感器的电阻是应变的线性函数。还公开了相关方法。

4. 发明授权

US07623303B2 Solid tunable micro optical device and method 有权
标题翻译：实心微调光学器件及方法
公开(公告)号：US07623303B2
公开(公告)日：2009-11-24
申请号：US11877421
申请日：2007-10-23
申请人： Weileun Fang , Sz-Yuan Lee , Hsi-Wen Tung , Wen-Chih Chen
发明人： Weileun Fang , Sz-Yuan Lee , Hsi-Wen Tung , Wen-Chih Chen
IPC分类号： G02B1/04 , G02B13/00 , G02B3/14
CPC分类号： G02B26/0866
摘要： A solid tunable micro optical device for an micro-optical system is provided. The sold tunable micro optical device includes a first annular piece, a micro-lens with a spherical surface configured on the first annular piece, and a deforming device coupled to the first annular piece for deforming the micro-lens.
摘要翻译：提供了一种用于微光学系统的固体可调谐微型光学器件。所销售的可调谐微型光学装置包括第一环形件，具有构造在第一环形件上的球形表面的微透镜，以及联接到第一环形件的变形装置，用于使微透镜变形。

5. 发明申请

US20090206478A1 FLIP CHIP DEVICE AND MANUFACTURING METHOD THEREOF 有权
标题翻译： FLIP芯片设备及其制造方法
公开(公告)号：US20090206478A1
公开(公告)日：2009-08-20
申请号：US12429237
申请日：2009-04-24
申请人： Wen-Chih Chen , Sheng-Shu Yang
发明人： Wen-Chih Chen , Sheng-Shu Yang
IPC分类号： H01L23/48 , H01L21/60
CPC分类号： H01L24/13 , H01L23/3121 , H01L24/17 , H01L24/28 , H01L24/29 , H01L24/83 , H01L24/90 , H01L2224/13099 , H01L2224/1319 , H01L2224/13644 , H01L2224/16 , H01L2224/83136 , H01L2224/83192 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01022 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/0781 , H01L2924/09701 , H01L2924/10329 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H01L2924/3511 , H01L2924/01031 , H01L2924/00014 , H01L2924/00
摘要： A flip chip device made using LCD-COG (liquid crystal display-chip on glass) technique. The flip chip device comprises a substrate, at least one chip having active area with a plurality of compliant bumps thereon. The compliant bumps are centrally disposed in the center of the chip for electrically connecting the chip and the substrate. An adhesive is daubed on a joint area of the substrate and the chips for jointing the substrate and the chips. By limiting the position of the compliant bumps so that they are centrally disposed on the chips, the thermal warpage of the substrate is reduced.
摘要翻译：一种使用LCD-COG（玻璃液晶显示芯片）技术制造的倒装芯片器件。所述倒装芯片器件包括衬底，至少一个具有有多个柔性凸起的有源区的芯片。顺应性凸块居中设置在芯片的中心，用于电连接芯片和基板。将粘合剂涂覆在基底的接合区域和用于连接基底和芯片的芯片上。通过限制顺应性凸块的位置使得它们居中地设置在芯片上，减小了基板的热翘曲。

6. 发明授权

US07473015B1 Combination lampshade 失效
标题翻译：组合灯罩
公开(公告)号：US07473015B1
公开(公告)日：2009-01-06
申请号：US11510933
申请日：2006-08-28
申请人： Wen-Chih Chen
发明人： Wen-Chih Chen
IPC分类号： F21V15/00
CPC分类号： F21V17/10 , F21S8/06 , F21V1/00 , F21V1/12 , F21V1/16 , F21V17/007
摘要： A combination lampshade includes a center hub, a plurality of lampshade elements that are respectively abutted against one another by fastening respective pins into respective pin holes and secured together by swivel hooks at each lampshade element, and an annular retainer fastened to the center hub to secure the lampshade elements around the center hub.
摘要翻译：组合灯罩包括中心毂，多个灯罩元件，其通过将相应的销固定到相应的销孔中并且通过在每个灯罩元件处的旋转钩固定在一起而分别抵靠彼此，并且固定到中心毂的环形保持器以固定中心轮毂周围的灯罩元件。

7. 发明申请

US20070220087A1 System for the sharing of electronic peripheral equipments 审中-公开
标题翻译：电子周边设备共享系统
公开(公告)号：US20070220087A1
公开(公告)日：2007-09-20
申请号：US11408961
申请日：2006-04-24
申请人： Chi-Tung Chang , Wen-Chih Chen
发明人： Chi-Tung Chang , Wen-Chih Chen
IPC分类号： G06F15/16
CPC分类号： G06F3/038 , G06F3/023
摘要： A system for the sharing of electronic peripheral equipments, wherein the system allows various industry standard electronic devices to share at least one electronic peripheral equipment. The aforesaid system comprises: a main server and a peripherals sharing interface that is installed in the main server, wherein the peripherals sharing interface has at least one signal input port and one signal output port, and the signal input port comprises at least a video input port, a mouse port and a keyboard port.
摘要翻译：一种用于共享电子周边设备的系统，其中系统允许各种工业标准电子设备共享至少一个电子外围设备。上述系统包括：安装在主服务器中的主服务器和外围设备共享接口，其中所述外围设备共享接口具有至少一个信号输入端口和一个信号输出端口，并且所述信号输入端口至少包括视频输入端端口，鼠标端口以及键盘端口。

8. 发明申请

US20060125111A1 Flip chip device 审中-公开
标题翻译：倒装芯片设备
公开(公告)号：US20060125111A1
公开(公告)日：2006-06-15
申请号：US11094198
申请日：2005-03-31
申请人： Wen-Chih Chen , Sheng-Shu Yang
发明人： Wen-Chih Chen , Sheng-Shu Yang
IPC分类号： H01L23/48
CPC分类号： H01L24/12 , H01L24/17 , H01L24/29 , H01L24/83 , H01L24/90 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05666 , H01L2224/05684 , H01L2224/13099 , H01L2224/16 , H01L2224/73204 , H01L2224/83136 , H01L2224/838 , H01L2924/00014 , H01L2924/01022 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/07802 , H01L2924/0781 , H01L2924/09701 , H01L2924/10329 , H01L2924/14 , H01L2924/15787 , H01L2924/3511 , H01L2924/01031 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A flip chip device made using LCD-COG (liquid crystal display-chip on glass) technique. The flip chip device comprises a substrate, a plurality of chips having surfaces with a plurality of compliant bumps thereon. The compliant bumps are centrally disposed in the center of the chips for electrically connecting the chips and the substrate. An adhesive is daubed on a joint area of the substrate and the chips for jointing the substrate and the chips. By changing the position of the compliant bumps so that they are centrally disposed on the chips without changing the electrical characteristics and the wiring arrangement of the chips, costs are lowered, reliability is increased and the glass substrate is less easily bent.
摘要翻译：一种使用LCD-COG（玻璃液晶显示芯片）技术制造的倒装芯片器件。倒装芯片器件包括衬底，多个芯片，其上具有多个柔性凸块的表面。顺应性凸块居中设置在芯片的中心，用于电连接芯片和基板。将粘合剂涂覆在基底的接合区域和用于连接基底和芯片的芯片上。通过改变顺应性凸块的位置使得它们在芯片上居中设置，而不改变芯片的电特性和布线布置，成本降低，可靠性提高，玻璃基板难以弯曲。

9. 发明授权

US06996306B2 Electrostatically operated micro-optical devices and method for manufacturing thereof 有权
标题翻译：静电操作的微光学器件及其制造方法
公开(公告)号：US06996306B2
公开(公告)日：2006-02-07
申请号：US10646927
申请日：2003-08-25
申请人： Chih-Chung Chen , Chengkuo Lee , Yen-Jyh Lai , Wen-Chih Chen , Ming-Hung Tsai
发明人： Chih-Chung Chen , Chengkuo Lee , Yen-Jyh Lai , Wen-Chih Chen , Ming-Hung Tsai
IPC分类号： G02B6/26
CPC分类号： G02B6/357 , G02B6/3514 , G02B6/3546 , G02B6/3552 , G02B6/358 , G02B6/3584 , G02B6/3594
摘要： Electrostatically operated micro-optical devices and method of manufacturing such devices is disclosed. In a preferred embodiment, the micro-optical devices using electrostatic comb drive actuators having new spring designs to overcome side instability and exhibit enlarged displacement, having new designs of comb finger electrode shapes to generate larger force output, and having new clip type latch mechanism to control the corresponding device at certain states in an analog manner without electrical power consumption. Based on the proposed optical path and device configurations, integration and assembly of a plurality of reflective micro-mirrors in conjunction with proposed new comb drive actuators is very promising way to provide micro-optical devices to get good optical performance and suitable for multi-channel applications. We also disclose several process techniques to manufacture the micro-optical devices with said electrostatic comb drive actuator in a mass production manner with higher yield.
摘要翻译：公开了静电操作的微光学器件及其制造方法。在优选实施例中，使用具有新弹簧设计的静电梳状驱动致动器的微型光学装置克服侧面不稳定性并展现出放大的位移，具有梳状电极形状的新设计以产生较大的力输出，并且具有新的夹式锁定机构以模拟方式在某些状态下控制相应的设备，而无需电力消耗。基于所提出的光路和器件配置，结合提出的新梳状驱动致动器的多个反射式微反射镜的集成和组装是提供微光学器件以获得良好的光学性能并且适合于多通道的非常有希望的方式应用程序。我们还公开了以大量生产方式以更高的产量制造具有所述静电梳驱动致动器的微光学装置的几种工艺技术。

10. 发明申请

US20050098901A1 Bonding structure with compliant bumps 失效
标题翻译：粘结结构符合凸起
公开(公告)号：US20050098901A1
公开(公告)日：2005-05-12
申请号：US10829115
申请日：2004-04-20
申请人： Shyh-Ming Chang , Yuan-Chang Huang , Wen-Chih Chen , Sheng-Shu Yang
发明人： Shyh-Ming Chang , Yuan-Chang Huang , Wen-Chih Chen , Sheng-Shu Yang
IPC分类号： H01L21/60 , H01L23/485 , H01L23/498 , H05K3/30 , H05K3/32 , H01L23/48
CPC分类号： H05K3/325 , H01L23/49816 , H01L24/12 , H01L24/29 , H01L24/81 , H01L24/83 , H01L2224/05022 , H01L2224/051 , H01L2224/05572 , H01L2224/056 , H01L2224/10135 , H01L2224/13016 , H01L2224/131 , H01L2224/1319 , H01L2224/1357 , H01L2224/1411 , H01L2224/16225 , H01L2224/2919 , H01L2224/73204 , H01L2224/81136 , H01L2224/81139 , H01L2224/81801 , H01L2224/81903 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2224/83851 , H01L2924/00013 , H01L2924/01013 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/0781 , H01L2924/10253 , H01L2924/14 , H01L2924/3025 , H05K3/305 , H05K2201/0133 , H05K2201/0367 , H05K2201/10674 , H05K2201/2036 , H05K2203/1189 , H01L2924/00014 , H01L2224/13099 , H01L2924/3512 , H01L2924/00
摘要： The invention provides a bonding structure with compliant bumps, and also includes a stopper structure and a protection layer. Compliant bumps include at least a polymer bump, a metal layer and a surface conductive layer. Both the stopper structure and protection layer are formed with polymer bumps and metal layer. Compliant bumps provide bonding pad and conductive channel. Stoppers are used to prevent compliant bumps from crushing for overpressure in bonding process. The protection layer provides functions of grounding and shielding. The stoppers can be outside or connected with the compliant bumps. The protection layer is lower then the stopper structure and compliant bumps. It can be separated or connected with stoppers.
摘要翻译：本发明提供一种具有柔性凸块的接合结构，并且还包括止动结构和保护层。合适的凸块包括至少聚合物凸块，金属层和表面导电层。阻挡结构和保护层均由聚合物凸块和金属层形成。符合凸块提供焊盘和导电通道。止动器用于防止在接合过程中顺应性的颠簸破碎超压。保护层提供接地和屏蔽功能。止动器可以在外部或与顺应性凸块连接。保护层低于止动器结构和顺应性凸块。它可以与塞子分离或连接。

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