专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08823179B2 Electronic device package and method for fabricating the same 有权
标题翻译：电子器件封装及其制造方法
公开(公告)号：US08823179B2
公开(公告)日：2014-09-02
申请号：US12667383
申请日：2008-06-13
申请人： Chia-Lun Tsai , Wen-Cheng Chien , Po-Han Lee , Wei-Ming Chen , Chien-Hung Liu , Ying-Nan Wen
发明人： Chia-Lun Tsai , Wen-Cheng Chien , Po-Han Lee , Wei-Ming Chen , Chien-Hung Liu , Ying-Nan Wen
IPC分类号： H01L23/48 , H01L27/146 , H01L21/768 , H01L23/00
CPC分类号： H01L23/481 , H01L21/76898 , H01L24/12 , H01L27/14618 , H01L27/14683 , H01L2224/05001 , H01L2224/05024 , H01L2224/05026 , H01L2224/05548 , H01L2224/05624 , H01L2224/05639 , H01L2224/05655 , H01L2924/00014 , H01L2924/01021 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/1461 , H01L2924/3025 , H01L2924/00 , H01L2224/05099
摘要： An embodiment of the present invention provides an electronic device package, which includes a chip having a first surface and an opposite second surface and a trench extending into a body of the chip along a direction from the second surface to the first surface, wherein a bottom portion of the trench includes at least two contact holes.
摘要翻译：本发明的实施例提供了一种电子器件封装，其包括具有第一表面和相对的第二表面的芯片以及沿着从第二表面到第一表面的方向延伸到芯片的主体中的沟槽，其中底部沟槽的一部分包括至少两个接触孔。

2. 发明授权

US08449801B2 Composition and process for preparing NIR shielding masterbatch and NIR shielding masterbatch and application thereof 有权
标题翻译：制备NIR屏蔽母粒和NIR屏蔽母料的组成和工艺及其应用
公开(公告)号：US08449801B2
公开(公告)日：2013-05-28
申请号：US12851583
申请日：2010-08-06
申请人： Ying-Hsiu Hsiao , Sheng-Jen Lin , Wei-Ming Chen , Wei-Peng Lin
发明人： Ying-Hsiu Hsiao , Sheng-Jen Lin , Wei-Ming Chen , Wei-Peng Lin
IPC分类号： B29B9/06
CPC分类号： G02B1/04 , C08J5/00 , D01F1/106
摘要： Disclosed herein is a method for preparing a near infrared shielding masterbatch. The method includes the steps of preparing and compounding a composition, and then pelletizing the compounded composition. The composition includes at least one metallic ionic compound powder in an amount of about 1-25 wt %, a cross-linking agent in an amount of about 0.1-5 wt %, a thermoplastic polymer in an amount of about 67-98.7 wt %, an initiator in an amount of about 0.1-1 wt %, and a dispersing agent in an amount of about 0.1-2 wt %.
摘要翻译：本文公开了一种制备近红外屏蔽母料的方法。该方法包括制备和混合组合物，然后将复合组合物造粒的步骤。该组合物包含至少一种量为约1-25重量％的金属离子化合物粉末，约0.1-5重量％的交联剂，约67-98.7重量％的热塑性聚合物，，约0.1-1重量％的引发剂和约0.1-2重量％的分散剂。

3. 发明授权

US08372902B2 Non-dripping flame retarding masterbatch, composition and process for preparing the same and flame retarding article containing the same 有权
标题翻译：不滴滴阻燃母料，其制备方法及含有该阻燃剂的阻燃制品
公开(公告)号：US08372902B2
公开(公告)日：2013-02-12
申请号：US12648083
申请日：2009-12-28
申请人： Sheng-Jen Lin , Wei-Ming Chen , Nai-Yun Liang , Wei-Peng Lin
发明人： Sheng-Jen Lin , Wei-Ming Chen , Nai-Yun Liang , Wei-Peng Lin
IPC分类号： C08G18/77
CPC分类号： C08K5/0025 , C08J3/226 , C08J2427/00 , C08J2467/00 , C08J2477/00 , C08K3/32 , C08K5/0066 , C08L23/12 , C08L23/10 , C08L67/02 , C08L27/06 , C08L77/00 , C08L2666/02
摘要： Disclosed herein is a composition for preparing a non-dripping flame retarding masterbatch. The flame retarding masterbatch includes a fire retardant in an amount of about 0.1-15.0 wt %, a crosslinking agent in an amount of about 0.1-1.5 wt %, a thermoplastic polymer in an amount of about 76.5-99.5 wt %, a crosslinking initiator in an amount of about 0.01-2.0 wt %, and a dispersing agent in an amount of about 0.1-5.0 wt % in the composition.
摘要翻译：本文公开了一种用于制备不滴加阻燃母料的组合物。阻燃母料包括约0.1-15.0重量％的阻燃剂，约0.1-1.5重量％的交联剂，约76.5-99.5重量％的热塑性聚合物，交联引发剂的量为约0.01-2.0重量％，分散剂的量为组合物中约0.1-5.0重量％。

4. 发明申请

US20130032939A1 CHIP PACKAGE STRUCTURE 有权
标题翻译：芯片包装结构
公开(公告)号：US20130032939A1
公开(公告)日：2013-02-07
申请号：US13481881
申请日：2012-05-28
申请人： Wei-Ming Chen , Chi-Chia Huang
发明人： Wei-Ming Chen , Chi-Chia Huang
IPC分类号： H01L23/498
CPC分类号： H01L23/4985 , H01L21/563 , H01L23/49894 , H01L23/552 , H01L23/60 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/81 , H01L2224/16225 , H01L2224/16227 , H01L2224/26175 , H01L2224/32225 , H01L2224/73204 , H01L2224/81203 , H01L2224/81805 , H01L2924/00014 , H01L2924/01322 , H01L2924/3511 , H01L2924/00 , H01L2224/0401
摘要： A chip package structure includes a flexible substrate having a chip mounting region, a plurality of leads disposed on the flexible substrate, an insulating layer and a chip. Each lead includes a body portion and an inner lead portion connected to each other. The body portion is located outside the chip mounting region and has a thickness greater than that of the inner lead portion. The insulating layer is disposed on the inner lead portions. The chip has an active surface on which a plurality of bumps and a seal ring adjacent to the chip edges are disposed. The chip is mounted within the chip mounting region and electrically connects the flexible substrate by connecting the inner lead portions of the leads with the bumps. The insulating layer is corresponding to the seal ring in position when the chip is electrically connected to the flexible substrate.
摘要翻译：芯片封装结构包括具有芯片安装区域的柔性衬底，设置在柔性衬底上的多个引线，绝缘层和芯片。每个引线包括彼此连接的主体部分和内部引线部分。主体部分位于芯片安装区域的外侧，其厚度大于内部引线部分的厚度。绝缘层设置在内引线部分上。芯片具有活性表面，多个凸起和与芯片边缘相邻的密封环设置在该表面上。芯片安装在芯片安装区域内，通过将引线的内引线部分与凸块连接来电连接柔性基板。当芯片电连接到柔性基板时，绝缘层对应于密封环就位。

5. 发明申请

US20130007669A1 SYSTEM AND METHOD FOR EDITING INTERACTIVE THREE-DIMENSION MULTIMEDIA, AND ONLINE EDITING AND EXCHANGING ARCHITECTURE AND METHOD THEREOF 有权
标题翻译：用于编辑交互式三维多媒体的系统和方法，以及在线编辑和交换架构及其方法
公开(公告)号：US20130007669A1
公开(公告)日：2013-01-03
申请号：US13221090
申请日：2011-08-30
申请人： Yu-Ling Lu , Chi-Jui Lien , Chien-Ju Li , Wei-Ming Chen
发明人： Yu-Ling Lu , Chi-Jui Lien , Chien-Ju Li , Wei-Ming Chen
IPC分类号： G06F3/048
CPC分类号： G09B5/065 , A63F2300/632 , G06T19/00 , G06T2200/24 , G11B27/034
摘要： A system and method are provided to edit interactive three-dimensional multimedia. A user interface of the system is provided with an event level template that includes event series levels with multiple event developing points. Through the user interface, multiple interactive events related to a first character of the event developing point are edited. Through a three-dimensional engine, interactive relevances are built up between interactive events and multiple materials inside one or more database. When the interactive three-dimensional multimedia with multiple materials is output, the interactive events corresponding to the event developing points are performed according to a user command. An online editing and exchanging method integrated with the system and method is also provided to share pre-edited templates on an exchange server; each of the pre-edited templates is extracted from an interactive three-dimensional multimedia pre-edited by the system and method.
摘要翻译：提供了一种编辑交互式三维多媒体的系统和方法。系统的用户界面提供了一个事件级别模板，其中包括具有多个事件开发点的事件级别级别。通过用户界面编辑与事件开发点的第一个字符相关的多个交互式事件。通过三维引擎，在一个或多个数据库中的交互式事件和多种材料之间建立交互式相关性。当输出具有多种材料的交互式三维多媒体时，根据用户命令执行与事件发展点对应的交互式事件。还提供了与系统和方法集成的在线编辑和交换方法，用于在交换服务器上共享预编辑的模板; 从由系统和方法预编辑的交互式三维多媒体中提取每个预编辑的模板。

6. 发明授权

US08310050B2 Electronic device package and fabrication method thereof 有权
标题翻译：电子器件封装及其制造方法
公开(公告)号：US08310050B2
公开(公告)日：2012-11-13
申请号：US13024902
申请日：2011-02-10
申请人： Wei-Ming Chen , Shu-Ming Chang
发明人： Wei-Ming Chen , Shu-Ming Chang
IPC分类号： H01L23/48
CPC分类号： H01L23/49811 , H01L23/3128 , H01L23/481 , H01L23/49816 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/29 , H01L24/82 , H01L24/97 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/211 , H01L2224/24246 , H01L2224/29339 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73267 , H01L2224/82 , H01L2224/97 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/014 , H01L2924/14 , H01L2924/1461 , H01L2924/15311 , H01L2924/00 , H01L2224/83
摘要： A chip package is disclosed. The package includes a carrier substrate, at least two semiconductor chips, a fill material layer, a protective layer, and a plurality of conductive bumps. The carrier substrate includes a grounding region. The semiconductor chips are disposed overlying the grounding region of the carrier substrate. Each semiconductor chip includes at least one signal pad and includes at least one grounding pad electrically connected to the grounding region. The fill material layer is formed overlying the carrier substrate and covers the semiconductor chips. The protective layer covers the fill material layer. The plurality of conductive bumps is disposed overlying the protective layer and is electrically connected to the semiconductor chips. A fabrication method of the chip package is also disclosed.
摘要翻译：公开了一种芯片封装。封装包括载体衬底，至少两个半导体芯片，填充材料层，保护层和多个导电凸块。载体基板包括接地区域。半导体芯片设置在载体基板的接地区域上。每个半导体芯片包括至少一个信号焊盘，并且包括电连接到接地区域的至少一个接地焊盘。填充材料层形成在载体衬底上并覆盖半导体芯片。保护层覆盖填充层。多个导电凸块设置在保护层的上方并与半导体芯片电连接。还公开了芯片封装的制造方法。

7. 发明申请

US20120085089A1 CHANGEABLE DAMPING WAVE POWER CAPTURING DEVICE DRIVEN BY BIDIRECTIONAL SCREW ROD 有权
标题翻译：可变阻尼波浪功率捕获装置由双向螺丝刀驱动
公开(公告)号：US20120085089A1
公开(公告)日：2012-04-12
申请号：US12980837
申请日：2010-12-29
申请人： YIN-LING KUO , Chih-Wei Yen , Wei-Ming Chen
发明人： YIN-LING KUO , Chih-Wei Yen , Wei-Ming Chen
IPC分类号： F03B13/18
CPC分类号： F03B13/14 , F05B2260/4031 , F05B2260/96 , Y02E10/38
摘要： A changeable damping wave power capturing device driven by bidirectional screw rod is provided, which uses the ball screw device to capture the wave power and prevents the energy lost caused by complex mechanism. In addition, bidirectional reciprocating rectilinear motion is changed to unidirectional rotation by the ratchet wheel device, and then the rotating energy is imported to the generating set. Besides, the wave power capturing device driven by bidirectional screw rod uses the control device to detect wave energy and choose different generator, the control device could change the damping value and improve the efficiency that transforming wave energy.
摘要翻译：提供由双向螺杆驱动的可变阻尼波功率捕获装置，其使用滚珠丝杠装置捕获波浪功率并防止由复杂机构引起的能量损失。此外，双向往复直线运动由棘轮装置改变为单向旋转，然后将旋转能量导入发电机组。此外，由双向螺杆驱动的波浪捕获装置利用控制装置检测波浪能量并选择不同的发电机，控制装置可以改变阻尼值，提高转换波能量的效率。

8. 发明申请

US20120037191A1 CLEANING SEQUENCE FOR OXIDE QUALITY MONITORING SHORT-LOOP SEMICONDUCTOR WAFER 审中-公开
标题翻译：氧化物质量监测短周期半导体波形清洁序列
公开(公告)号：US20120037191A1
公开(公告)日：2012-02-16
申请号：US12857104
申请日：2010-08-16
申请人： Liang Chun Sung , Jhong Zhong Chen , Kai Yao Chang , Yuan Pu Liao , Chia Jung Yang , Wei Ming Chen
发明人： Liang Chun Sung , Jhong Zhong Chen , Kai Yao Chang , Yuan Pu Liao , Chia Jung Yang , Wei Ming Chen
IPC分类号： B08B3/00
CPC分类号： H01L21/0206
摘要： Disclosed herein are methods for novel cleaning processes for inline quality monitoring short-loop semiconductor wafers. In one embodiment, an exemplary process may comprise immersing the short-loop wafer in an SC-2 aqueous solution comprising hydrochloric acid and hydrogen peroxide at a temperature of about 60° C., and for a time period of about 600 seconds, and then rinsing the wafer with deionized water to remove residual SC-2 solution immediately following immersing the wafer in the SC-2 solution. This exemplary method may then comprise immersing the short-loop wafer in an SC-1 aqueous solution comprising ammonia and hydrogen peroxide immediately after rinsing the wafer to remove residual SC-2 solution, and then rinsing the wafer with deionized water to remove residual SC-1 solution immediately following immersing the wafer in the SC-1 solution. In such a method, however, the wafer is immersed in an HF aqueous solution comprising hydrofluoric acid immediately prior to immersing the wafer in the SC-2 solution, or immediately after immersing the wafer in the SC-1 solution.
摘要翻译：本文公开了用于在线质量监测短循环半导体晶片的新型清洁方法的方法。在一个实施方案中，示例性方法可以包括将短环晶片浸入包含盐酸和过氧化氢的SC-2水溶液中，温度约为60℃，时间约为600秒，然后在将晶片浸入SC-2溶液后立即用去离子水冲洗晶片以去除残留的SC-2溶液。该示例性方法可以包括在冲洗晶片之后立即将短环晶片浸入包含氨和过氧化氢的SC-1水溶液中以除去残留的SC-2溶液，然后用去离子水冲洗晶片以除去残留的SC- 在将晶片浸入SC-1溶液后立即进行。然而，在这种方法中，在将晶片浸入SC-2溶液之前或将晶片浸入SC-1溶液之后，立即将晶片浸入包含氢氟酸的HF水溶液中。

9. 发明申请

US20110301258A1 Non-Dripping Flame Retarding Masterbatch, Composition and Process for Preparing the Same and Flame Retarding Article Containing the Same 有权
标题翻译：非滴漏阻燃母料，其制备方法及其制备方法及其阻燃物品
公开(公告)号：US20110301258A1
公开(公告)日：2011-12-08
申请号：US13209480
申请日：2011-08-15
申请人： Sheng-Jen Lin , Wei-Ming Chen , Nai-Yun Liang , Wei-Peng Lin
发明人： Sheng-Jen Lin , Wei-Ming Chen , Nai-Yun Liang , Wei-Peng Lin
IPC分类号： C08J3/28 , B29B9/12 , C08K5/52
CPC分类号： C08K5/0025 , C08J3/226 , C08J2427/00 , C08J2467/00 , C08J2477/00 , C08K3/32 , C08K5/0066 , C08L23/12 , C08L23/10 , C08L67/02 , C08L27/06 , C08L77/00 , C08L2666/02
摘要： Disclosed herein are methods for preparing non-dripping flame retarding masterbatches and filamentous non-dripping flame retarding materials. First, an admixture including a flame retardant, a crosslinking agent, a thermoplastic polymer, and a dispersing agent is prepared, and then a crosslinking initiator is added into the admixture to form a composition which is then compounded and pelletized to obtain the non-dripping flame retarding masterbatch. The resultant non-dripping flame retarding masterbatch is suitable for use in a spinning process to obtain filamentous non-dripping flame retarding materials.
摘要翻译：本文公开了制备不滴落阻燃母料和丝状非滴落阻燃材料的方法。首先，制备包含阻燃剂，交联剂，热塑性聚合物和分散剂的混合物，然后将交联引发剂加入到混合物中以形成组合物，然后将其混合并造粒以获得不滴加阻燃母料所得的非滴落阻燃母料适合用于纺丝工艺中以获得丝状非滴落阻燃材料。

10. 发明申请

US20110140267A1 ELECTRONIC DEVICE PACKAGE AND METHOD FOR FABRICATING THE SAME 有权
标题翻译：电子设备包装及其制造方法
公开(公告)号：US20110140267A1
公开(公告)日：2011-06-16
申请号：US12849089
申请日：2010-08-03
申请人： Chia-Lun TSAI , Ching-Yu Ni , Tien-Hao Huang , Chia-Ming Cheng , Wen-Cheng Chien , Nan-Chun Lin , Wei-Ming Chen , Shu-Ming Chang , Bai-Yao Lou
发明人： Chia-Lun TSAI , Ching-Yu Ni , Tien-Hao Huang , Chia-Ming Cheng , Wen-Cheng Chien , Nan-Chun Lin , Wei-Ming Chen , Shu-Ming Chang , Bai-Yao Lou
IPC分类号： H01L23/498 , H01L21/60
CPC分类号： H01L24/20 , H01L23/13 , H01L23/3121 , H01L23/3128 , H01L23/49816 , H01L23/5389 , H01L23/544 , H01L24/19 , H01L2223/54426 , H01L2223/54473 , H01L2223/54486 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/32225 , H01L2224/73267 , H01L2224/83132 , H01L2224/92 , H01L2224/92244 , H01L2924/01005 , H01L2924/01013 , H01L2924/01021 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/014 , H01L2924/14 , H01L2924/1461 , H01L2924/15153 , H01L2924/15165 , H01L2924/15184 , H01L2224/83 , H01L2224/82 , H01L2924/00
摘要： The invention provides an electronic device package and a method for fabricating the same. The electronic device package includes a carrier wafer. An electronic device chip with a plurality of conductive pads thereon is disposed over the carrier wafer. An isolation laminating layer includes a lower first isolation layer, which covers the carrier wafer and the electronic device chip, and an upper second isolation layer. The isolation laminating layer has a plurality of openings to expose the conductive pads. A plurality of redistribution patterns is conformably formed on the isolation laminating layer and in the openings. The redistribution patterns are electrically connected to the conductive pads, respectively. A plurality of conductive bumps is respectively formed on the redistribution patterns, electrically connected to the conductive pads.
摘要翻译：本发明提供一种电子器件封装及其制造方法。电子器件封装包括载体晶片。具有多个导电焊盘的电子器件芯片设置在载体晶片上。隔离层压层包括覆盖载体晶片和电子器件芯片的下部第一隔离层和上部第二隔离层。隔离层压层具有多个开口以露出导电垫。在隔离层压层和开口中顺应地形成多个再分配图案。再分布图案分别电连接到导电焊盘。多个导电凸块分别形成在再分布图案上，电连接到导电焊盘。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式