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1. 发明申请

US20190361497A1 ELECTRONIC APPARATUS AND ENGAGING MECHANISM 审中-公开
公开(公告)号：US20190361497A1
公开(公告)日：2019-11-28
申请号：US16045768
申请日：2018-07-26
申请人： Wei-Che Yang , Wei-Pin Chuang , Hsin-Yang Wang , Wei-Jen Lin , Mu-Chih Yu
发明人： Wei-Che Yang , Wei-Pin Chuang , Hsin-Yang Wang , Wei-Jen Lin , Mu-Chih Yu
IPC分类号： G06F1/16 , E05D7/10
摘要： An electronic apparatus includes an electronic device and a base. The electronic device has an engaging portion with at least two engaging concaves. The base has an engaging mechanism which includes a main body, at least one second engaging bump and a linkage structure. The main body has a first engaging bump. The second engaging bump is movably disposed on the main body and is adapted to move between an engaging position and a releasing position. The electronic device combines with the base such that the first engaging bump and the second engaging bump are engaged with the two engaging concaves. The linkage structure on the main body is connected to the second engaging bump. The electronic device rotates relative to the base to push the linkage structure that drives the second engaging bump from the engaging position to the releasing position to disengage from the engaging portion.

2. 发明申请

US20190128037A1 RESCUING AND POSITIONING ASSEMBLY 审中-公开
公开(公告)号：US20190128037A1
公开(公告)日：2019-05-02
申请号：US15794018
申请日：2017-10-26
申请人： Wei Che Kuo
发明人： Wei Che Kuo
IPC分类号： E05F5/08 , E05F3/22 , E05F1/12
摘要： A door with a buffer device including a door frame; at least one door plate pivotally installed to a lateral side of the door frame, or two lateral sides of door frame, or the door plate; at least buffer device installed to a lateral side of the door plate. When the door plate is closed, the movable press plate will compress by the door frame so that the elastomers are compressed; as a result, in closing the door plate, the movable press plate will resist against the door frame or the door plate and the elastomers provide buffer force therebetween; when the door plate is closed, the movable press plate will tightly press the door frame or the door plate so that the door plate is completely attached to the door frame.

3. 发明申请

US20140175983A1 LED lamp 有权
标题翻译：点灯
公开(公告)号：US20140175983A1
公开(公告)日：2014-06-26
申请号：US14195865
申请日：2014-03-04
申请人： Wei-Che Hsieh
发明人： Wei-Che Hsieh
IPC分类号： H05B33/08
CPC分类号： H05B33/0809 , H05B33/0827 , Y02B20/341
摘要： A lamp is provided with a full-wave rectifier for convert AC to DC; a SPD electrically connected to the full-wave rectifier for protecting the lamp from voltage spikes; series connected LEDs electrically connected to the SPD; a microprocessor electrically connected to the SPD; series connected MOSFET start circuits electrically to the microprocessor, the MOSFET start circuits configured to switch electronic signals; and resistors each electrically interconnected the LED and the MOSFET start circuit. In response to a normal DC supplied from the SPD, the microprocessor creates a PWM signal to activate the MOSFET start circuits which in turn initiate operations of the LEDs via the resistors respectively. In response to an abnormal DC having voltage spikes supplied from the SPD, the microprocessor deactivates the MOSFET start circuits which in turn direct the DC through the resistors rather than supply the DC to the LEDs via the resistors respectively.
摘要翻译：一个灯具有一个用于转换AC到DC的全波整流器; SPD电连接到全波整流器，用于保护灯不受电压尖峰影响; 串联连接的LED电连接到SPD; 电连接到SPD的微处理器; 串联MOSFET启动电路与微处理器电连接，MOSFET启动电路配置为切换电子信号; 以及电阻器，每个电连接LED和MOSFET启动电路。响应于从SPD提供的正常DC，微处理器创建PWM信号以激活MOSFET启动电路，而这又启动了经由电阻器的LED的操作。响应于具有从SPD提供的电压尖峰的异常DC，微处理器去激活MOSFET起始电路，其继而通过电阻器引导DC，而不是分别经由电阻器将DC提供给LED。

4. 发明授权

US08712760B2 Method and mobile device for awareness of language ability 有权
标题翻译：方法和移动设备的语言能力意识
公开(公告)号：US08712760B2
公开(公告)日：2014-04-29
申请号：US12981042
申请日：2010-12-29
申请人： Chi-Chun Hsia , Yu-Hsien Chiu , Wei-Che Chuang , Kuo-Yuan Li
发明人： Chi-Chun Hsia , Yu-Hsien Chiu , Wei-Che Chuang , Kuo-Yuan Li
IPC分类号： G06F17/27 , G10L15/01
CPC分类号： G16H50/30 , G06F19/00
摘要： A method and mobile device for awareness of language ability are provided. “Repeated pattern index”-related properties, such as, a vocabulary usage amount, a vocabulary type, or a ratio, a time point, a time length or repeated contents of a repeated voice segment, and “community interaction index”-related properties, such as, a number of persons who speak with a user, a conversation time length, or whether the user talks alone during each time interval, are extracted according to voice data collected by a voice collection element worn on the user. Then, a language ability of the user is further calculated, so as to provide evaluation of the language ability of a dementia patient for reference.
摘要翻译：提供了一种提高语言能力意识的方法和移动设备。 “重复模式索引”相关属性，例如词汇使用量，词汇类型或比例，时间点，重复语音段的时间长度或重复内容，以及“社区交互指数”相关属性根据用户使用的语音收集元件收集的语音数据，提取与用户对话的多个人，会话时间长度，或者是否在每个时间间隔期间单独对话。然后，进一步计算用户的语言能力，以评估痴呆患者的语言能力以供参考。

5. 发明申请

US20130107190A1 Method of Preparing Composite Optical Retarder 失效
标题翻译：复合阻光剂的制备方法
公开(公告)号：US20130107190A1
公开(公告)日：2013-05-02
申请号：US13368559
申请日：2012-02-08
申请人： Da-Ren CHIOU , Tzu-Ying CHEN , Wei-Che HUNG , De-Ling HSU , Chiu-Fang CHEN
发明人： Da-Ren CHIOU , Tzu-Ying CHEN , Wei-Che HUNG , De-Ling HSU , Chiu-Fang CHEN
IPC分类号： G02F1/13 , B29C65/14
CPC分类号： B29D11/0074 , B32B33/00 , B32B2307/40 , G02B5/3016 , G02F1/133788
摘要： A method of preparing a composite optical retarder is provided. A first and a second liquid crystal coating materials are respectively disposed on opposite surfaces of a photoalignment film to respectively form a first and a second optical retarders. The composite optical retarder having the photoalignment film sandwiched by the first and the second optical retarders is thus obtained.
摘要翻译：提供一种制备复合光学延迟器的方法。第一和第二液晶涂层材料分别设置在光取向膜的相对表面上，以分别形成第一和第二光学延迟器。由此获得具有被第一和第二光学延迟器夹持的光
取向膜的复合光学延迟器。

6. 发明授权

US08367553B2 Method for manufacturing through-silicon via 有权
标题翻译：硅通孔制造方法
公开(公告)号：US08367553B2
公开(公告)日：2013-02-05
申请号：US12962055
申请日：2010-12-07
申请人： Wei-Che Tsao , Wen-Chin Lin
发明人： Wei-Che Tsao , Wen-Chin Lin
IPC分类号： H01L21/306
CPC分类号： H01L21/76898 , H01L21/7684
摘要： A method for manufacturing TSVs comprises following steps: A stack structure having a substrate, an ILD layer and a dielectric stop layer is provided, in which an opening penetrating through the ILD layer and the dialectic stop layer and further extending into the substrate is formed. After an insulator layer and a metal barrier are formed on the stack structure, a top metal layer is formed on the stack structure to fulfill the opening. A first planarization process stopping on the metal barrier is conducted, wherein the first planarization process has a polishing rate for removing the metal barrier less than that for removing the top metal layer. A second planarization process stopping on the dielectric stop layer is conducted, wherein the second planarization process has a polishing rate for removing the insulator layer greater than that for removing the dielectric stop layer. The dielectric stop layer is than removed.
摘要翻译：制造TSV的方法包括以下步骤：提供具有基板，ILD层和电介质停止层的堆叠结构，其中形成穿透ILD层和辩证阻止层并进一步延伸到基板中的开口。在堆叠结构上形成绝缘体层和金属屏障之后，在堆叠结构上形成顶部金属层以实现开口。进行停止在金属屏障上的第一平面化处理，其中第一平面化工艺具有除去金属屏障的抛光速率小于除去顶部金属层的抛光速率。进行停止在电介质停止层上的第二平坦化工艺，其中第二平坦化工艺具有用于除去绝缘体层的抛光速率大于去除电介质停止层的抛光速率。电介质停止层除去。

7. 发明申请

US20130011938A1 METHOD FOR MANUFACTURING THROUGH-SILICON VIA 有权
标题翻译：通过硅制造方法
公开(公告)号：US20130011938A1
公开(公告)日：2013-01-10
申请号：US13176790
申请日：2011-07-06
申请人： Wei-Che TSAO , Chia-Lin Hsu , Jen-Chieh Lin , Teng-Chun Tsai , Hsin-Kuo Hsu , Ya-Hsueh Hsieh , Ren-Peng Huang , Chih-Hsien Chen , Wen-Chin Lin , Yung-Lun Hsieh
发明人： Wei-Che TSAO , Chia-Lin Hsu , Jen-Chieh Lin , Teng-Chun Tsai , Hsin-Kuo Hsu , Ya-Hsueh Hsieh , Ren-Peng Huang , Chih-Hsien Chen , Wen-Chin Lin , Yung-Lun Hsieh
IPC分类号： H01L21/66 , H01L21/306 , H01L21/304
CPC分类号： H01L21/31053 , H01L21/3212 , H01L21/76898 , H01L22/12 , H01L22/26 , H01L2924/0002 , H01L2924/00
摘要： A method for manufacturing TSVs, wherein the method comprises several steps as follows: A stack structure having a substrate and an ILD layer (inter layer dielectric layer) is provided, in which an opening penetrating through the ILD layer and further extending into the substrate is formed. After an insulator layer and a metal barrier layer are formed on the stack structure and the sidewalls of the opening, a top metal layer is then formed on the stack structure to fulfill the opening. A first planarization process stopping on the barrier layer is conducted to remove a portion of the top metal layer. A second planarization process stopping on the ILD layer is subsequently conducted to remove a portion of the metal barrier layer, a portion of the insulator layer and a portion of the top metal layer, wherein the second planarization process has a polishing endpoint determined by a light interferometry or a motor current.
摘要翻译：一种制造TSV的方法，其中该方法包括以下几个步骤：提供具有基板和ILD层（层间电介质层）的堆叠结构，其中穿透ILD层并进一步延伸到基板中的开口是形成。在堆叠结构和开口的侧壁上形成绝缘体层和金属阻挡层之后，在堆叠结构上形成顶部金属层以实现开口。进行停止在阻挡层上的第一平面化处理以去除顶部金属层的一部分。随后进行停止在ILD层上的第二平坦化处理以去除金属阻挡层的一部分，绝缘体层的一部分和顶部金属层的一部分，其中第二平坦化工艺具有由光线确定的抛光终点干涉测量或电机电流。

8. 发明申请

US20130009741A1 INTEGRATED CIRCUIT TRANSFORMER 有权
标题翻译：集成电路变压器
公开(公告)号：US20130009741A1
公开(公告)日：2013-01-10
申请号：US13474677
申请日：2012-05-17
申请人： Cheng-Chou HUNG , Cheng-Jyi CHANG , Tung-Hsing LEE , Wei-Che HUANG
发明人： Cheng-Chou HUNG , Cheng-Jyi CHANG , Tung-Hsing LEE , Wei-Che HUANG
IPC分类号： H01F27/28
CPC分类号： H01F19/04 , H01F27/2804 , H01L23/5227 , H01L2924/0002 , H01L2924/00
摘要： The invention provides an integrated circuit transformer disposed on a substrate. The integrated circuit transformer includes a first coiled metal pattern disposed on the substrate, comprising an inner loop segment and an outer loop segment. A second coiled metal pattern is disposed on the substrate, laterally between the inner loop segment and the outer loop segment. A dielectric layer is disposed on the first coiled metal pattern and the second coiled metal pattern. A first via is formed through the dielectric layer, electrically connecting to one of the first and second coiled metal patterns. A first redistribution pattern is disposed on the dielectric layer, electrically connecting to and extending along the first via, wherein the first redistribution pattern covers at least a portion of the first coiled metal pattern and at least a portion of the second coiled metal pattern.
摘要翻译：本发明提供一种设置在基板上的集成电路变压器。集成电路变压器包括设置在基板上的第一卷绕金属图案，包括内环段和外环段。第二卷绕金属图案设置在衬底上，横向在内环段和外环段之间。电介质层设置在第一卷绕金属图案和第二卷绕金属图案上。通过介电层形成第一通孔，电连接到第一和第二卷绕金属图案之一。第一再分配图案设置在电介质层上，电连接并沿着第一通孔延伸，其中第一再分配图案覆盖第一卷绕金属图案的至少一部分和第二卷绕金属图案的至少一部分。

9. 发明授权

US08346021B2 Content adaptive scaler based on a farrow structure 有权
标题翻译：基于分娩结构的内容自适应缩放器
公开(公告)号：US08346021B2
公开(公告)日：2013-01-01
申请号：US12505626
申请日：2009-07-20
申请人： Lin Li , Tianjiang Li , Wei Che , Huide Li
发明人： Lin Li , Tianjiang Li , Wei Che , Huide Li
IPC分类号： G06K9/40 , G06K9/32 , G09G5/00
CPC分类号： G09G5/005 , G09G2340/0407
摘要： Embodiments of the present invention are directed to an image processing system. The image processing system may comprise a content detection module having an input to receive a sequence of input pixels and configured to generate an adjustable parameter based on detected differences between adjacent pairs of input pixels, and a digital filter having an input for the sequence of input pixels and a control input coupled to an output of the content detection module. The digital filter may adjust filtering coefficients according to the parameter.
摘要翻译：本发明的实施例涉及一种图像处理系统。图像处理系统可以包括内容检测模块，其具有用于接收输入像素序列的输入，并且被配置为基于检测到的相邻输入像素对之间的差异产生可调参数，以及数字滤波器，其具有用于输入序列的输入像素和耦合到内容检测模块的输出的控制输入。数字滤波器可以根据参数调整滤波系数。

10. 发明授权

US08283683B2 Chip-bonding light emitting diode chip 有权
标题翻译：芯片贴片发光二极管芯片
公开(公告)号：US08283683B2
公开(公告)日：2012-10-09
申请号：US12629030
申请日：2009-12-01
申请人： Chang-Da Tsai , Wei-Che Wu , Chia-Liang Hsu , Ching-Shih Ma
发明人： Chang-Da Tsai , Wei-Che Wu , Chia-Liang Hsu , Ching-Shih Ma
IPC分类号： H01L33/00
CPC分类号： H01L33/0079 , H01L33/30 , H01L33/385 , H01L33/40 , H01L33/405 , H01L33/483 , H01L2224/48247 , H01L2224/48257 , H01L2224/49107 , H01L2924/181 , H01L2924/00012
摘要： A light emitting diode chip includes a permanent substrate having a holding space formed on the permanent substrate; an insulating layer and a metal layer sequentially formed on the permanent substrate and the holding spacer; a die having a eutectic layer and a light-emitting region and bonded to the metal layer within the holding space via the eutectic layer coupling to the metal layer; a filler structure filled between the holding space and the die; and an electrode formed on the die and in contact with the light-emitting region.
摘要翻译：发光二极管芯片包括永久性基板，其具有形成在永久基板上的保持空间; 绝缘层和顺序地形成在永久性基板和保持间隔物上的金属层; 具有共晶层和发光区域的管芯，并通过耦合到金属层的共晶层与保持空间内的金属层接合; 填充在所述保持空间和所述模具之间的填充结构; 以及形成在管芯上并与发光区域接触的电极。

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