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    • 3. 发明授权
    • Semi-conductor chip having interdigitated gate runners with gate bonding
pads
    • 半导体芯片具有带栅极焊盘的交错栅极流道
    • US5497013A
    • 1996-03-05
    • US276464
    • 1994-07-18
    • Victor A. K. Temple
    • Victor A. K. Temple
    • H01L23/051H01L23/482H01L29/423H01L29/78H01L23/48H01L29/44H01L29/52H01L29/60
    • H01L29/7802H01L23/051H01L23/4824H01L24/06H01L29/4238H01L2924/01079H01L2924/12042H01L2924/1301H01L2924/1305H01L2924/13055H01L2924/13091H01L2924/3011
    • A semiconductor chip having a cellular topography and a method of packaging a cellular semiconductor chip, includes plural interdigitated metal gate runners that overlie and contact selected gate electrodes on the chip surface, each of the gate runners having an integral widened area to enable a package-carried gate electrode contact foil to be bonded thereto. The gate runner widened areas are relatively small and have little impact on chip active area. The plural gate runners have portions that underlie a package-carried power electrode contact foil and that are separated therefrom by a nonbondable, insulating layer. The gate runners may be deposited on the chip in the same step and from the name material am the power electrode. The portion of the power electrode on the chip surface that underlies the package-carried gate electrode contact foil is separated therefrom and available for use as active area of the chip, Package lid-to-chip alignment tolerances may be relaxed as they are not dictated by alignment of the lid-carried gate contact foil with the gate electrode on the chip.
    • 具有细胞形貌的半导体芯片和封装蜂窝半导体芯片的方法包括多个叉指的金属栅极流道,其覆盖并接触芯片表面上的选定的栅电极,每个栅极流道具有整体加宽的区域, 携带的栅电极接触箔与其键合。 闸口加宽区域相对较小,对芯片活动区域影响不大。 多个栅极流道具有位于封装携带的电极接触箔的下方的部分,并且通过非粘结的绝缘层与其分离。 栅极流道可以以相同的步骤和来自电源电极的名称材料沉积在芯片上。 芯片表面上位于封装载体栅极电极接触箔下方的功率电极部分与芯片分离,可用作芯片的有源区域,封装盖到芯片对准公差可能会因为未被规定而放宽 通过将盖带电的栅极接触箔与芯片上的栅电极对准。