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    • 2. 发明申请
    • COATING/DEVELOPING APPARATUS AND OPERATION METHOD THEREOF
    • 涂装/开发设备及其操作方法
    • US20090021704A1
    • 2009-01-22
    • US12166470
    • 2008-07-02
    • Tomohiro KANEKOAkira Miyata
    • Tomohiro KANEKOAkira Miyata
    • G03B27/32
    • G03B27/32
    • A coating/developing apparatus has a carrier block including a first transfer device, a process block including processing modules, an examination block including examination modules and a second transfer device, and first to forth stages. A controller executes a first operation mode preset to transfer substrates from the process block and carrier block into the examination block in parallel. The first operation mode includes transferring substrates processed by the process block to the third or fourth stage through or not through an examination module by the second transfer device, transferring substrates to be only examined from a carrier in the carrier block to the second stage by the first transfer device, and transferring these substrates from the second stage to an examination modules by the second transfer device, and transferring substrates thus examined from the examination block to the third or fourth stage by the second transfer device.
    • 涂覆/显影装置具有载体块,其包括第一转印装置,包括处理模块的处理块,包括检查模块和第二转印装置的检查块以及第一至第四级。 控制器执行预设的第一操作模式以将基板从处理块和载体块并行地传送到检查块中。 第一操作模式包括通过第二传送装置将通过或不通过检查模块将由处理块处理的衬底转移到第三或第四阶段,将仅被检查的衬底从载体块中的载体传送到第二级,由 第一转印装置,并且通过第二转印装置将这些基板从第二阶段转印到检查模块,以及通过第二转印装置将从检查块转移到第三或第四阶段的基板。
    • 3. 发明申请
    • COATING/DEVELOPING APPARATUS AND SUBSTRATE TRANSFER METHOD
    • 涂层/开发设备和基板传输方法
    • US20080117390A1
    • 2008-05-22
    • US11877324
    • 2007-10-23
    • Tomohiro KANEKOAkira MIYATA
    • Tomohiro KANEKOAkira MIYATA
    • G03B27/52
    • G03F7/7075H01L21/67225H01L21/67276Y10S414/135
    • In a coating/developing apparatus, a process section includes post-exposure baking units each having a waiting position and configured to perform a baking process on a substrate. An interface section transfer mechanism includes a first transfer mechanism configured to transfer the substrate to and from the process section and to load the substrate into the post-exposure baking units, and a second transfer mechanism configured to transfer the substrate to and from the light exposure apparatus. An interface section includes a relay position configured to place thereon the substrate transferred by the second transfer mechanism, and to allow the first transfer mechanism to receive the substrate therefrom. A control section is arranged to set the substrate on standby at the relay position and the waiting position, to make a time period constant among substrates from an end of the light exposure process to a start of a post-exposure baking process.
    • 在涂布/显影装置中,处理部分包括具有等待位置并被配置为在基板上进行烘烤处理的后曝光烘焙单元。 接口部分传送机构包括第一传送机构,其被配置为将基板传送到处理部分并从处理部分传送基板并将基板装载到后曝光烘烤单元中;以及第二传送机构,其被配置为将基板传送到曝光和从曝光 仪器。 接口部分包括被配置为放置在其上由第二传送机构传送的基板并且允许第一传送机构从其接收基板的中继位置。 控制部被配置为将基板设置在继电器位置和待机位置的待机状态,使得从曝光过程结束到曝光后烘烤处理开始之间的基板之间的时间段恒定。
    • 4. 发明申请
    • Substrate transporting and processing apparatus, fault management method for substrate transport and processing apparatus, and storage medium storing fault management program
    • 基板运输和处理装置,基板运输和处理装置的故障管理方法以及存储故障管理程序的存储介质
    • US20070219660A1
    • 2007-09-20
    • US11600905
    • 2006-11-17
    • Tomohiro KanekoAkira Miyata
    • Tomohiro KanekoAkira Miyata
    • G06F19/00
    • H01L21/67271H01L21/67745
    • Disclosed is a countermeasure to be taken when a fault occurs in one of process modules 11-17 or a transport module 20 that makes it impossible to transport substrates to a process module positioned downstream of a post-exposure baking module 15 in accordance with a predetermined transport schedule in a post-exposure substrate transport path that starts from an exposure apparatus 5 and goes through the post-exposure baking (PEB) module 15, a developing module 12, and a post-development baking module 15. In this instance, part of post-exposure processes to a post-exposure baking process are continuously performed to the exposed substrates and the wafers W having been subjected to the PEB process are loaded into a buffer module 32 and temporarily stored in the buffer module 32 until the fault is cleared. This prevents increase in the time period from an exposure process completion to the post-exposure baking process even when the fault occurs, thereby avoiding defective line width the circuit pattern of a resist, particularly a chemically amplified resist.
    • 公开了当在处理模块11-17中的一个发生故障时发生的对策或者使得不可能根据预定的方式将基板输送到位于后曝光烘焙模块15下游的处理模块的传送模块20 从曝光装置5开始并经过曝光后烘烤(PEB)模块15,显影模块12和后期显影烘烤模块15的曝光后基板传送路径中的传送时间表。 在这种情况下,对暴露的基板连续地进行对曝光后烘烤处理的后曝光处理的一部分,并且已经经过PEB处理的晶片W被加载到缓冲模块32中并临时存储在缓冲模块32中 直到故障清除。 即使发生故障,也能够防止从曝光处理完成到曝光后烘烤处理的时间段的增加,从而避免了抗蚀剂,特别是化学放大抗蚀剂的电路图案的有缺陷的线宽。
    • 7. 发明申请
    • COATING AND DEVELOPING APPARATUS, OPERATING METHOD FOR SAME, AND STORAGE MEDIUM FOR THE METHOD
    • 涂料和开发设备,其操作方法和存储介质的方法
    • US20080299502A1
    • 2008-12-04
    • US12128437
    • 2008-05-28
    • Tomonori SHINKouji OKAMURATomohiro KANEKOAkira MIYATASyuzo FUJIMARU
    • Tomonori SHINKouji OKAMURATomohiro KANEKOAkira MIYATASyuzo FUJIMARU
    • G03F7/20G03B27/52
    • H01L21/67225H01L21/67276
    • In a coating and developing apparatus applied to liquid-immersion light exposure, substrates without an appropriately formed protective film can be recovered without adversely affecting normal-substrate processing efficiency, and in addition, removal of protective films can be simplified. In the coating and developing apparatus of the present invention, abnormal substrates not appropriately surface-coated with a protective film during liquid-immersion light exposure are queued in a queuing module, instead of being loaded into an exposure unit, and after the immediately preceding substrate has been unloaded from the exposure unit and loaded into a designated module, for example, a pre-developing second heating module, each abnormal substrate is loaded into the designated module in order to prevent so-called “scheduled transfer” from being affected, and a protective-film removing unit is also controlled to process the abnormal substrate.
    • 在适用于液浸式曝光的涂布显影装置中,可以回收没有适当形成的保护膜的基板,而不会不利地影响正常的基板处理效率,另外可以简化保护膜的去除。 在本发明的涂布和显影装置中,在液浸式曝光期间不被适当表面涂覆有保护膜的异常基板排队在排队模块中,而不是装载到曝光单元中,并且在紧接在前面的基板 已经从曝光单元卸载并加载到指定的模块中,例如预先显影的第二加热模块中,每个异常基板被装载到指定模块中,以防止所谓的“计划传送”受到影响,并且 还控制保护膜去除单元以处理异常衬底。
    • 8. 发明申请
    • COATING AND DEVELOPING SYSTEM, METHOD OF CONTROLLING COATING AND DEVELOPING SYSTEM AND STORAGE MEDIUM
    • 涂料与开发系统,涂料和发展体系与储存介质的控制方法
    • US20070250202A1
    • 2007-10-25
    • US11734088
    • 2007-04-11
    • Tomohiro KanekoAkira Miyata
    • Tomohiro KanekoAkira Miyata
    • G06F19/00B05C11/00
    • H01L21/67745H01L21/67276
    • A coating and developing system includes a cassette station, a processing station and an inspection station interposed between the cassette station and the processing station. Time for which a substrate is held uselessly in the inspection module is reduced. A substrate carrying means disposed in the inspection module places priority to transferring a substrate between the cassette station and the processing station, and transfers a substrate to an inspection module in a part of a cycle time in which a substrate carrying means disposed in the processing station carries out one carrying cycle. It is permitted to carry out a substrate from the inspection module in a skip carrying mode, in which a substrate specified by a larger ordinal numeral is carried ahead of a substrate specified by a smaller ordinal numeral. It is inhibited to carry a substrate to the inspection module in the skip carrying mode.
    • 涂装和显影系统包括一个盒式磁带站,一个处理站和一个插入在磁带站和处理站之间的检查站。 基板在检查模块中无用的时间减少了。 设置在检查模块中的基板承载装置优先地将基板传送到盒站和处理站之间,并且在循环时间的一部分中将基板传送到检查模块,其中设置在处理站中的基板承载装置 执行一个携带循环。 允许以跳过方式从检查模块执行基板,其中由较小的数字指定的基板在由较小的数字指定的基板的前面进行。 在跳过运行模式下,禁止将基板运送到检查模块。
    • 9. 发明申请
    • Substrate processing system and substrate processing method
    • 基板加工系统和基板加工方法
    • US20060287200A1
    • 2006-12-21
    • US11436700
    • 2006-05-19
    • Tomohiro KanekoAkira Miyata
    • Tomohiro KanekoAkira Miyata
    • C04B35/45
    • G03F7/7075G03F7/70533H01L21/67155H01L21/67173H01L21/67184H01L21/67196H01L21/67253H01L21/67276
    • A substrate processing system 100 and a substrate processing method process a plurality of substrates in a single-substrate processing mode by the cooperative operation of a first processing system and a second processing system. The substrate processing system 100 suppresses increase in cost and footprint and the reduction of yield and throughput. The substrate processing system 100 includes a first processing system 50 for processing substrates in a single-substrate processing mode and a second processing system 60 for processing substrates in a single-substrate processing mode. The second processing system 60 processes a substrate processed by a first process by the first processing system 50 by a second process, and the first processing system processes the substrate processed by the second process by the second processing system 60 by a third process. The first processing system 50 includes a first control means 30 for controlling a substrate carrying operation. The second processing system 60 includes a second control means 40. The first control means 30 (or the second control means 40) obtains information about processing time needed by the second processing system 60 (the first processing system 50) and controls a substrate carrying operation for carrying substrates between the first processing system 50 and the second processing system 60 on the basis of the obtained information.
    • 基板处理系统100和基板处理方法通过第一处理系统和第二处理系统的协作操作以单基板处理模式处理多个基板。 基板处理系统100抑制成本和占地面积的增加以及产量和产量的降低。 基板处理系统100包括用于以单基板处理模式处理基板的第一处理系统50和用于以单基板处理模式处理基板的第二处理系统60。 第二处理系统60通过第二处理处理由第一处理系统50进行的第一处理的基板,第一处理系统通过第三处理由第二处理系统60处理由第二处理处理的基板。 第一处理系统50包括用于控制基板承载操作的第一控制装置30。 第二处理系统60包括第二控制装置40.第一控制装置30(或第二控制装置40)获得关于第二处理系统60(第一处理系统50)所需的处理时间的信息,并控制基板承载操作 用于基于获得的信息在第一处理系统50和第二处理系统60之间承载基板。