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    • 2. 发明授权
    • Method of manufacturing charge transfer device
    • 制造电荷转移装置的方法
    • US5401679A
    • 1995-03-28
    • US018389
    • 1993-02-17
    • Takashi Fukusho
    • Takashi Fukusho
    • H01L29/762H01L21/339H01L21/265H01L21/70H01L27/00
    • H01L29/66954
    • To manufacture a charge transfer device, a first insulating film is deposited on a surface of a semiconductor substrate as a charge transfer region for transferring charge packets therein in one direction. Then, a plurality of first transfer electrodes are deposited on the first insulating film, the first transfer electrodes being spaced from each other, and a portion of each of the first transfer electrodes is removed to shape each of the first transfer electrodes into a staircase configuration. Thereafter, a first impurity is ion-implanted into the surface of the semiconductor substrate to create an impurity-diffused region therein which includes first and second different-potential subregions underneath each of the first transfer electrodes and a different-potential subregion underneath each of areas of the first insulating film between the first transfer electrodes. After the first impurity is ion-implanted, a mask is deposited on portions of the areas of the first insulating film and on side portions of the first transfer electrodes, and a second impurity is ion-implanted into the surface of the semiconductor substrate to divide the different-potential subregion underneath each of the areas into third and fourth different-potential subregions.
    • 为了制造电荷转移装置,第一绝缘膜沉积在半导体衬底的表面上,作为用于在一个方向上转印电荷包的电荷转移区域。 然后,在第一绝缘膜上沉积多个第一转印电极,第一转印电极彼此间隔开,并且去除每个第一转印电极的一部分以使每个第一转印电极成为阶梯结构 。 此后,将第一杂质离子注入到半导体衬底的表面中以在其中产生杂质扩散区域,其中包括在每个第一转移电极下方的第一和第二不同电势子区域以及每个区域之下的不同电位子区域 的第一传输电极之间的第一绝缘膜。 在离子注入第一杂质之后,在第一绝缘膜的部分区域和第一转移电极的侧面上沉积掩模,并且将第二杂质离子注入到半导体衬底的表面中以分开 每个区域之下的不同潜力分区域分为第三和第四个不同的潜在次区域。
    • 4. 发明授权
    • Solid-state image pickup device in-layer lens with antireflection film with intermediate index of refraction
    • 具有中等折射率的抗反射膜的固态图像拾取装置层内透镜
    • US06614479B1
    • 2003-09-02
    • US09161669
    • 1998-09-29
    • Takashi FukushoAtsushi Asai
    • Takashi FukushoAtsushi Asai
    • H04N314
    • H01L27/14627H01L27/1462H01L27/14621H01L27/14625H01L31/02162H01L31/02325H01L31/02327
    • In a solid-state image pickup device including a light receiving sensor portion in a surface layer portion of a substrate, an in-layer lens disposed above the light receiving sensor portion, a color filter disposed on the in-layer lens, and an interlayer film disposed below the in-layer lens, an antireflection film is formed between the in-layer lens and the color filter, the antireflection film being formed of material having a refractive index which is an intermediate value between the refractive index of the in-layer lens and the refractive index of the color filter. Further, another antireflection film is formed between the in-layer lens and the interlayer film, the other antireflection film being formed of material having a refractive index which is an intermediate value between the refractive index of the in-layer lens and the refractive index of the interlayer film.
    • 在包括基板的表面层部分中的光接收传感器部分的固态图像拾取装置中,设置在光接收传感器部分上方的层内透镜,设置在层内透镜上的滤色器和中间层 设置在层内透镜下方的膜,在层间透镜和滤色器之间形成防反射膜,抗反射膜由折射率为介于层间透镜的折射率之间的中间值的材料形成 透镜和滤色器的折射率。 此外,在层间透镜和层间膜之间形成另一防反射膜,另一防反射膜由折射率为层内透镜的折射率与折射率之间的中间值的材料形成 中间膜。
    • 5. 发明授权
    • CCD having transfer electrodes of 3 layers
    • CCD具有3层的传输电极
    • US5393997A
    • 1995-02-28
    • US264257
    • 1994-06-22
    • Takashi FukushoIsao HirotaMotoyuki Koike
    • Takashi FukushoIsao HirotaMotoyuki Koike
    • H01L27/14H01L29/423H01L29/78H01L31/00
    • H01L29/42396
    • A solid state imager device comprises a plurality of pixels arranged in rows and columns, each of the pixels consisting of a light sensing element and a vertical transfer portion adjacent to the light sensing element, the vertical transfer portion having three gate portions such as a first, a second and a third gate portions insulated each other, the third gate portion located in the center of the three gate portions, a plurality of rows of base portions disposed in the horizontal direction and connecting the respective gate portions, a vertical wiring device disposed over the gate portions through an insulating layer, the vertical wiring device including, a first wiring film connecting the first gate portions, a second wiring film connecting the second gate portions, a third wiring film connecting the third gate portions which is connected to the odd row of the base portions, a fourth wiring film connecting the third gate portions which is connected to the even rows of the base portions, a read out pulse device for supplying a read out voltage pulse to the third and fourth wiring films, and a transfer pulse device for supplying a transfer voltage pulse to the three gate portions so as to transfer signal charges in the vertical direction.
    • 固态成像装置包括排列成行和列的多个像素,每个像素由光感测元件和与光感测元件相邻的垂直传送部分组成,垂直传送部分具有三个门部分,例如第一 ,第二栅极部分和第三栅极部分彼此绝缘,位于三个栅极部分的中心的第三栅极部分,沿水平方向设置并连接各个栅极部分的多排基底部分,垂直布线装置设置 通过绝缘层在栅极部分之上,垂直布线装置包括:连接第一栅极部分的第一布线膜,连接第二栅极部分的第二布线膜,连接第三栅极部分的第三布线膜,其连接到奇数 连接基座部分的偶数行的第四布线膜 ns,用于向第三和第四布线膜提供读出电压脉冲的读出脉冲装置,以及用于向三个栅极部分提供转印电压脉冲以在垂直方向上传送信号电荷的转印脉冲装置。
    • 7. 发明授权
    • Method of manufacturing solid-state image sensing device
    • 制造固态摄像装置的方法
    • US06569703B1
    • 2003-05-27
    • US09116120
    • 1998-07-16
    • Takashi Fukusho
    • Takashi Fukusho
    • H01L2100
    • H01L27/14685H01L27/148
    • A method of manufacturing a solid-state image sensing device in which a light-sensitive sensor part for photoelectric transfer is formed on the surface of a substrate and a light shielding film for preventing light from being incident on the substrate except the light-sensitive sensor part is formed is provided. First, a transfer electrode is formed on the substrate via an insulating film and after an interlayer insulating film for covering the transfer electrode is further formed, a planarized film for covering the interlayer insulating film is formed. Next, only the location of the planarized film to be a light shielding area for forming a light shielding film is selectively etched, a concave portion is formed and a groove deep enough to reach the vicinity of the surface of the substrate is formed by etching the planarized film over the periphery of the light-sensitive sensor part and near the side of the transfer electrode. Afterward, the material of a light shielding film is embedded in the concave portion and inside the groove and a light shielding film is formed. The provision of the solid-state image sensing device and the manufacturing method in which the efficiency of condensing beams to the light-sensitive sensor part is enhanced and the sensitivity is enhanced is thus desired.
    • 一种制造固态摄像装置的方法,其中在基板的表面上形成用于光电转移的感光传感器部分和用于防止光入射到基板之外的光敏传感器的光屏蔽膜 提供了一部分形成。 首先,通过绝缘膜在基板上形成转印电极,在形成用于覆盖转印电极的层间绝缘膜之后,形成用于覆盖层间绝缘膜的平坦化膜。 接下来,仅选择性地蚀刻作为用于形成遮光膜的遮光区域的平坦化膜的位置,形成凹部,通过蚀刻形成深度足以到达基板表面附近的槽 在感光传感器部分的周边上并且靠近转印电极侧的平坦化膜。 之后,将遮光膜的材料嵌入到凹部和槽内,形成遮光膜。 因此期望提供固态图像感测装置和其中使光束到光敏传感器部分的聚光效率提高并且提高灵敏度的制造方法。