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    • 1. 发明申请
    • THERMOELECTRIC ELEMENT
    • 热电元件
    • US20120305046A1
    • 2012-12-06
    • US13588896
    • 2012-08-17
    • Takashi ASATANIFujimi Kimura
    • Takashi ASATANIFujimi Kimura
    • H01L35/04
    • H01L35/32
    • A thermoelectric element has a first substrate at a high temperature side, a second substrate at a low temperature side facing the first substrate, a thermoelectric material placed on the second substrate via a silicon layer, a first electrode formed on the first substrate, and a second electrode formed on the silicon layer. The thermoelectric element has a stress releasing section which is formed between the first electrode and the thermoelectric material, and which includes a plurality of columnar portions. The stress releasing section suppresses defects such as cracks that might be produced in the thermoelectric element due to a stress generated in the thermoelectric element.
    • 热电元件具有高温侧的第一基板,面向第一基板的低温侧的第二基板,经由硅层配置在第二基板上的热电材料,形成在第一基板上的第一电极和 形成在硅层上的第二电极。 热电元件具有形成在第一电极和热电材料之间并且包括多个柱状部分的应力释放部分。 应力释放部分抑制由于在热电元件中产生的应力而可能在热电元件中产生的诸如裂纹的缺陷。
    • 2. 发明授权
    • Thin film magnetic head assembly and method of manufacturing the same
    • 薄膜磁头组件及其制造方法
    • US06631056B1
    • 2003-10-07
    • US09584267
    • 2000-06-01
    • Takashi AsataniFujimi KimuraJunichi Sato
    • Takashi AsataniFujimi KimuraJunichi Sato
    • G11B540
    • B82Y25/00B82Y10/00G11B5/3103G11B5/3133G11B5/3163G11B5/3166G11B5/3173G11B5/3903G11B5/40G11B2005/3996
    • On a wafer-like substrate 1, there are formed a number of thin film magnetic head elements in matrix, each of which is formed to include a first shield film 3 formed on the wafer-like substrate 1, a first insulating film 71 formed on the first shield film, a magnetoresistive element 9 and first and second electrode films 11, 13 connected to respective ends of the magnetoresistive element formed on the first insulating film, a second shield film 5 formed to cover the magnetoresistive element and first and second electrode films 11, 13, a second insulating film 72 formed on the second shield film, and a conductive film 191 electrically connected to the first electrode film 11 and second shield film 5 and having a middle portion which is separated from a side edge of the second shield film 5 by a distance &Dgr;G2 viewed in a film stacking direction. Since the first electrode film 11 and second shield film 5 become equipotential, no voltage is applied across the first and second insulating films 71, 72 and dielectric breakdown does not occur. By cutting the middle portion of the conductive film 191, property of the magnetoresistive element can be measured. Since the middle portion of the conductive film 191 situates outside the second shield film 5, a generation of conductive material debris upon cutting can be prevented, and a cut surface of the first electrode film 11 and second shield film 5 are not short-circuited.
    • 在晶片状基板1上形成多个矩阵状的薄膜磁头元件,每个薄膜磁头元件形成为包括形成在晶片状基板1上的第一屏蔽膜3,形成在第一绝缘膜71上的第一绝缘膜71 第一屏蔽膜,磁阻元件9和连接到形成在第一绝缘膜上的磁阻元件的各端的第一和第二电极膜11,13,形成为覆盖磁阻元件的第二屏蔽膜5和第一和第二电极膜 形成在第二屏蔽膜上的第二绝缘膜72和与第一电极膜11和第二屏蔽膜5电连接并具有与第二屏蔽层的侧边缘分离的中间部分的导电膜191 胶片5在胶片层叠方向上观看距离DeltaG2。 由于第一电极膜11和第二屏蔽膜5变为等电位,因此在第一绝缘膜71和第二绝缘膜72之间不施加电压,并且不会发生电介质击穿。 通过切割导电膜191的中间部分,可以测量磁阻元件的性质。 由于导电膜191的中间部分位于第二屏蔽膜5的外部,因此可以防止在切割时产生导电材料碎屑,并且第一电极膜11和第二屏蔽膜5的切割面不会短路。
    • 4. 发明申请
    • Magnetic storage device and method for producing the same
    • 磁存储装置及其制造方法
    • US20080006890A1
    • 2008-01-10
    • US11810835
    • 2007-06-06
    • Susumu HarataniTohru OikawaTakashi Asatani
    • Susumu HarataniTohru OikawaTakashi Asatani
    • H01L29/82
    • H01L27/226G11C11/16H01L43/08
    • In the magnetic storage device, magnetization characteristics during write cycles are homogenized, and write cycles are carried out efficiently. In the magnetic storage device, the soft magnetic body is formed so as to cover the line either totally or partially, and the anti-ferromagnetic layer is formed on the outer surface of this soft magnetic body. Furthermore, the magneto-resistive element is disposed in the vicinity of the line. Suppose the case where the exchange coupling energy at the interface between the soft magnetic body and the anti-ferromagnetic layer is J (erg/cm2), the saturation magnetization of the soft magnetic body is Ms (emu/cc), and the coercive force of the soft magnetic body is Hc (Oe). Then, the thickness t (cm) of the soft magnetic body is selected to be such that t
    • 在磁存储装置中,写入周期期间的磁化特性被均匀化,并且有效地执行写入周期。 在磁存储装置中,软磁体被形成为完全或部分地覆盖线,并且在该软磁体的外表面上形成反铁磁层。 此外,磁阻元件设置在线的附近。 假设在软磁体与反铁磁体层之间的界面处的交换耦合能为J(erg / cm 2)的情况下,软磁体的饱和磁化强度为Ms(emu / cc),软磁体的矫顽力为Hc(Oe)。 然后,软磁体的厚度t(cm)被选择为使得t
    • 5. 发明授权
    • Thin film thermoelectric element including stress releasing elements
    • 薄膜热电元件包括​​应力释放元件
    • US08269097B2
    • 2012-09-18
    • US11526677
    • 2006-09-26
    • Takashi AsataniFujimi Kimura
    • Takashi AsataniFujimi Kimura
    • H01L35/00
    • H01L35/32
    • A thermoelectric element has a first substrate at a high temperature side, a second substrate at a low temperature side facing the first substrate, a thermoelectric material placed on the second substrate via a silicon layer, a first electrode formed on the first substrate, and a second electrode formed on the silicon layer. The thermoelectric element has a stress releasing section which is formed between the first electrode and the thermoelectric material, and which includes a plurality of columnar portions. The stress releasing section suppresses defects such as cracks that might be produced in the thermoelectric element due to a stress generated in the thermoelectric element.
    • 热电元件具有高温侧的第一基板,面向第一基板的低温侧的第二基板,经由硅层配置在第二基板上的热电材料,形成在第一基板上的第一电极和 形成在硅层上的第二电极。 热电元件具有形成在第一电极和热电材料之间的应力释放部分,并且包括多个柱状部分。 应力释放部分抑制由于在热电元件中产生的应力而可能在热电元件中产生的诸如裂纹的缺陷。
    • 6. 发明授权
    • Thermoelectric element
    • 热电元件
    • US08692104B2
    • 2014-04-08
    • US13588896
    • 2012-08-17
    • Takashi AsataniFujimi Kimura
    • Takashi AsataniFujimi Kimura
    • H01L35/32
    • H01L35/32
    • A thermoelectric element has a first substrate at a high temperature side, a second substrate at a low temperature side facing the first substrate, a thermoelectric material placed on the second substrate via a silicon layer, a first electrode formed on the first substrate, and a second electrode formed on the silicon layer. The thermoelectric element has a stress releasing section which is formed between the first electrode and the thermoelectric material, and which includes a plurality of columnar portions. The stress releasing section suppresses defects such as cracks that might be produced in the thermoelectric element due to a stress generated in the thermoelectric element.
    • 热电元件具有高温侧的第一基板,面向第一基板的低温侧的第二基板,经由硅层配置在第二基板上的热电材料,形成在第一基板上的第一电极和 形成在硅层上的第二电极。 热电元件具有形成在第一电极和热电材料之间并且包括多个柱状部分的应力释放部分。 应力释放部分抑制由于在热电元件中产生的应力而可能在热电元件中产生的诸如裂纹的缺陷。
    • 10. 发明申请
    • Thermoelectric element
    • 热电元件
    • US20070068566A1
    • 2007-03-29
    • US11526677
    • 2006-09-26
    • Takashi AsataniFujimi Kimura
    • Takashi AsataniFujimi Kimura
    • H01L35/02
    • H01L35/32
    • A thermoelectric element has a first substrate at a high temperature side, a second substrate at a low temperature side facing the first substrate, a thermoelectric material placed on the second substrate via a silicon layer, a first electrode formed on the first substrate, and a second electrode formed on the silicon layer. The thermoelectric element has a stress releasing section which is formed between the first electrode and the thermoelectric material, and which includes a plurality of columnar portions. The stress releasing section suppresses defects such as cracks that might be produced in the thermoelectric element due to a stress generated in the thermoelectric element.
    • 热电元件具有高温侧的第一基板,面向第一基板的低温侧的第二基板,经由硅层配置在第二基板上的热电材料,形成在第一基板上的第一电极和 形成在硅层上的第二电极。 热电元件具有形成在第一电极和热电材料之间并且包括多个柱状部分的应力释放部分。 应力释放部分抑制由于在热电元件中产生的应力而可能在热电元件中产生的诸如裂纹的缺陷。