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1. 发明授权

US07071090B2 Semiconductor element having protruded bump electrodes 失效
标题翻译：具有凸起电极的半导体元件
公开(公告)号：US07071090B2
公开(公告)日：2006-07-04
申请号：US11073714
申请日：2005-03-08
申请人： Kazushi Higashi , Norihito Tsukahara , Takahiro Yonezawa , Yoshihiko Yagi , Yoshifumi Kitayama , Hiroyuki Otani
发明人： Kazushi Higashi , Norihito Tsukahara , Takahiro Yonezawa , Yoshihiko Yagi , Yoshifumi Kitayama , Hiroyuki Otani
IPC分类号： H01L21/44
CPC分类号： H01L24/78 , H01L24/11 , H01L24/13 , H01L2224/11003 , H01L2224/1134 , H01L2224/11822 , H01L2224/13017 , H01L2224/13018 , H01L2224/13019 , H01L2224/13082 , H01L2224/131 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/1329 , H01L2224/133 , H01L2224/16225 , H01L2224/45015 , H01L2224/451 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/78303 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , Y10T29/49179 , Y10T29/49181 , H01L2224/13099 , H01L2224/48 , H01L2924/00 , H01L2924/20752 , H01L2924/00015 , H01L2924/00012 , H01L2224/05599 , H01L2224/85399
摘要： A method of forming a bump electrode on an IC electrode includes the steps of forming a ball bond on an IC electrode by a wire bonding apparatus, moving a bonding capillary upward, moving the bonding capillary sideways and then downward, bonding an Au wire to the ball bond portion, and cutting the Au wire. The Au wire is prevented from coming in contact with portions around the ball bond portion other than the ball bond portion by presetting a descent position of the bonding capillary to a position higher than a position in which the ball bond is formed.
摘要翻译：在IC电极上形成突起电极的方法包括以下步骤：通过引线接合装置在IC电极上形成球接合，向上移动接合毛细管，向上移动接合毛细管然后向下移动接合毛细管，将Au线接合到球接合部分，并切割Au线。通过将接合毛细管的下降位置预设为高于形成球形接合位置的位置，可防止Au线与球接合部分以外的球接合部分周围接触。

2. 发明授权

US06680221B2 Bare chip mounting method and bare chip mounting system 失效
标题翻译：裸芯片安装方法和裸芯片安装系统
公开(公告)号：US06680221B2
公开(公告)日：2004-01-20
申请号：US10267668
申请日：2002-10-10
申请人： Tetsuya Tokunaga , Takahiro Yonezawa , Hiroyuki Kiyomura , Tatsuo Sasaoka , Satoshi Horie
发明人： Tetsuya Tokunaga , Takahiro Yonezawa , Hiroyuki Kiyomura , Tatsuo Sasaoka , Satoshi Horie
IPC分类号： H01L2144
CPC分类号： H01L24/81 , H01L21/6836 , H01L24/11 , H01L24/75 , H01L2221/68327 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/45144 , H01L2224/75 , H01L2224/81801 , H01L2924/01004 , H01L2924/01033 , H01L2924/01039 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/00014 , H01L2924/00
摘要： A bare chip mounting method includes: a dicing step for dividing a semiconductor wafer into individual IC chips while the semiconductor wafer is being attached to a carrier; a washing step for washing the diced semiconductor wafer; a bump-bonding for carrying the washed semiconductor wafer to an assembly process while the semiconductor wafer is being attached to the carrier so as to form a bump on an electrode pad of the wafer; and a mounting step for mounting each of the IC chips, on which the bump is formed, onto a circuit formation body.
摘要翻译：裸芯片安装方法包括：切割步骤，用于在将半导体晶片附着到载体上的同时将半导体晶片分成单独的IC芯片; 用于洗涤切割的半导体晶片的洗涤步骤; 用于在将半导体晶片附着到载体上时将用于将洗涤的半导体晶片携带到组装过程的凸块接合，以在晶片的电极焊盘上形成凸块; 以及安装步骤，用于将形成有凸块的每个IC芯片安装到电路形成体上。

3. 发明授权

US06619535B1 Working method for holding a work object by suction 失效
标题翻译：通过抽吸夹持工作对象的工作方法
公开(公告)号：US06619535B1
公开(公告)日：2003-09-16
申请号：US09830508
申请日：2001-04-27
申请人： Makoto Imanishi , Takahiro Yonezawa , Shinji Kanayama , Ryoichiro Katano , Takaharu Mae
发明人： Makoto Imanishi , Takahiro Yonezawa , Shinji Kanayama , Ryoichiro Katano , Takaharu Mae
IPC分类号： B23K3102
CPC分类号： H01L21/6838 , H01L21/68 , H01L24/78 , H01L2224/05599 , H01L2224/451 , H01L2224/45144 , H01L2224/78 , H01L2224/78301 , H01L2224/85399 , H01L2924/00014 , H01L2924/14 , H01L2924/00 , H01L2924/00015 , H01L2224/45015 , H01L2924/207
摘要： Provided is a construction including a stage having a suction hole for sucking an electronic component and fixing the same in position and position regulating suction hole for sucking an electronic component when the electronic component is regulated in position, a position regulating pawl for positioning the electronic component on the stage and a position regulating suction force control section capable of controlling a position regulating suction force when the electronic component is regulated in position on the stage.
摘要翻译：本发明提供一种结构，其特征在于，包括具有用于吸引电子部件的吸引孔并将其固定在适当位置的台阶的结构，以及当电子部件被调节就位时，用于吸引电子部件的位置调节用吸孔; 以及位置调整用吸引力控制部，其能够控制在电子部件被调节到台上的位置时调节吸引力的位置。

4. 发明授权

US06481616B2 Bump bonding device and bump bonding method 失效
标题翻译：凸块接合装置和凸块接合方法
公开(公告)号：US06481616B2
公开(公告)日：2002-11-19
申请号：US09978872
申请日：2001-10-17
申请人： Makoto Imanishi , Akihiro Yamamoto , Hiroyuki Otani , Shinzo Eguchi , Takahiro Yonezawa , Kazushi Higashi , Koichi Yoshida , Kouji Hirotani
发明人： Makoto Imanishi , Akihiro Yamamoto , Hiroyuki Otani , Shinzo Eguchi , Takahiro Yonezawa , Kazushi Higashi , Koichi Yoshida , Kouji Hirotani
IPC分类号： B23K3102
CPC分类号： H01L21/68 , H01L21/321 , H01L24/11 , H01L24/81 , H01L2224/13099 , H01L2224/45144 , H01L2224/81205 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/00
摘要： To eliminate breakage of electronic parts or defective bonding, and enhance reliability of electronic parts, in regulation of electronic parts in bump bonding device. A bump bonding device comprising a stage 1 for mounting and heating an electronic part, and a position regulating device including a rotatable regulating plate 2 having a side for positioning the electronic part, a plate 4 having a side for positioning the electronic part in collaboration with the regulating plate, and a regulating spring 5 for applying a regulating force to the regulating plate in order to press the electronic part to the plate 4.
摘要翻译：为了消除电子零件的破损或接合不良，提高电子零件的可靠性，在凸块焊接装置中调节电子部件。一种凸块接合装置，包括用于安装和加热电子部件的台架1和包括具有用于定位电子部件的侧面的可旋转调节板2的位置调节装置，具有用于与电子部件配合的侧面的板4 调节板和用于向调节板施加调节力以便将电子部件按压到板4的调节弹簧5。

5. 发明授权

US5457874A Mounting apparatus of electronic component 失效
标题翻译：电子元件安装装置
公开(公告)号：US5457874A
公开(公告)日：1995-10-17
申请号：US174359
申请日：1993-12-28
申请人： Takahiro Yonezawa , Wataru Hirai , Muneyoshi Fujiwara , Kunio Sakurai , Naohiko Chimura , Hiroshi Ohta
发明人： Takahiro Yonezawa , Wataru Hirai , Muneyoshi Fujiwara , Kunio Sakurai , Naohiko Chimura , Hiroshi Ohta
IPC分类号： B23P21/00 , H05K13/00 , H05K13/04 , B23P19/04 , H05K3/32
CPC分类号： H05K13/0408 , Y10S29/044 , Y10T29/53178 , Y10T29/53183 , Y10T29/53191
摘要： A mounting apparatus for mounting electronic components, includes a component feeding section wherein plural component feeding units accommodating plural components and sequentially supplying components to a predetermined component take-out position are arranged on a moving table along a moving direction, a positioning mechanism of a mounting member to which one component is to be mounted, and a mounting device for holding one component at a predetermined position in the feeding section and mounting the component onto the mounting member. The mounting device includes a movable member which is vertically movable and has a gas groove which is formed at an inside part of the movable member, and a rotary member which is rotatable around a vertical axis of the movable member and has at its inside part a gas groove which is formed at an inside part of the rotary member and is communicated with the groove of the movable member so as to transmit gas between the grooves during operation. The mounting device also includes a pressure gas transmitting member having positive and negative pressure holes of gas passages formed at its inside, and a gas switching member having a gas groove communicating with a suction passage of a suction member for sucking the component. The switching member is movable to selectively switch between states where the suction passage is communicated with the positive pressure hole and the negative pressure hole, respectively.
摘要翻译：一种用于安装电子部件的安装装置，包括：部件供给部，其中容纳多个部件的多个部件供给单元和向预定部件取出位置顺序供给部件沿着移动方向配置在移动台上，安装部要安装一个部件的部件和用于将一个部件保持在进给部分中的预定位置并将部件安装到安装部件上的安装装置。安装装置包括可移动部件，其可垂直移动并且具有形成在可动部件的内侧部分的气体槽，以及能够围绕可动部件的垂直轴线旋转的旋转部件，其内侧部分气槽，其形成在旋转构件的内部，并与可动构件的槽连通，以便在操作期间在槽之间传递气体。安装装置还包括具有在其内部形成的气体通道的正和负压孔的压力气体传递构件，以及气体切换构件，其具有与抽吸构件的吸入通道连通的气体槽。切换构件可移动以选择性地在吸入通道与正压孔和负压孔连通的状态之间切换。

6. 发明授权

US06474538B1 Bonding apparatus and bonding method 失效
标题翻译：接合装置和接合方法
公开(公告)号：US06474538B1
公开(公告)日：2002-11-05
申请号：US09691247
申请日：2000-10-19
申请人： Takahiro Yonezawa , Akihiro Yamamoto , Hiroyuki Kiyomura , Tetsuya Tokunaga , Tatsuo Sasaoka , Masahiko Hashimoto
发明人： Takahiro Yonezawa , Akihiro Yamamoto , Hiroyuki Kiyomura , Tetsuya Tokunaga , Tatsuo Sasaoka , Masahiko Hashimoto
IPC分类号： B23K3102
CPC分类号： H01L24/85 , H01L24/45 , H01L24/78 , H01L2224/45015 , H01L2224/45144 , H01L2224/78268 , H01L2224/78301 , H01L2224/85045 , H01L2224/85205 , H01L2924/00014 , H01L2924/01033 , H01L2924/01039 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2224/48 , H01L2924/00 , H01L2924/20759 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/00015
摘要： A higher speed moving device moves a capillary at high speed. A low inertial moving and pressing device moves and presses the capillary with low inertia. The high speed motion, and the moving and pressing motion with the low inertia are carried out independently of each other. Thus, an inertia at the low inertial moving and pressing device is reduced, whereby an impact force when a melt ball is driven by the low inertial moving and pressing device into contact with an electrode of a semiconductor integrated circuit is restricted, thus enabling stable formation for minute bumps. On the other hand, operations other than pressing the melt ball to the electrode and joining the melt ball are conducted by driving the capillary by the higher speed moving device, so that productivity is improved.
摘要翻译：高速移动装置高速移动毛细管。低惯性移动和挤压装置以低惯性运动并按压毛细管。高速运动以及具有低惯量的移动和按压运动彼此独立地进行。因此，在低惯性运动和加压装置处的惯性减小，由此熔融球被低惯性运动和加压装置驱动与半导体集成电路的电极接触的冲击力受到限制，从而能够稳定地形成微小的颠簸。另一方面，通过用高速移动装置驱动毛细管来进行将熔融球压入电极并接合熔融球的操作，从而提高生产率。

7. 发明授权

US6017812A Bump bonding method and bump bonding apparatus 失效
标题翻译：凸块接合方法和凸块接合装置
公开(公告)号：US6017812A
公开(公告)日：2000-01-25
申请号：US119974
申请日：1998-07-21
申请人： Takahiro Yonezawa , Osamu Nakao , Shinji Kanayama , Akihiro Yamamoto , Makoto Imanishi , Koichi Yoshida
发明人： Takahiro Yonezawa , Osamu Nakao , Shinji Kanayama , Akihiro Yamamoto , Makoto Imanishi , Koichi Yoshida
IPC分类号： H01L21/60 , H01L21/607 , H01L23/485 , H01L21/44
CPC分类号： H01L24/13 , H01L24/11 , H01L2224/1134 , H01L2224/13144 , H01L2224/45144 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01039 , H01L2924/01067 , H01L2924/01079 , H01L2924/01082 , H01L2924/14
摘要： The present invention provides a bump bonding method that can prevent bumps from being inappropriately shaped. The bump bonding method comprises forming a gold ball (16) at the tip of a gold wire (1) that is inserted through a capillary (3), lowering the capillary (3) while using a displacement detection sensor to detect the vertical displacement of the capillary (3), detecting the position of that portion of an IC (11) in which an electrode is formed, based on the displacement of the capillary (3) detected by the displacement detection sensor when the gold ball (16) abuts the IC (11), pressing he gold ball (16) against the electrode forming portion to form a bump pedestal (17), elevating the capillary (3) a specified amount while moving it in the horizontal direction a specified amount, setting the height S of a position at which the capillary (3) is stopped based on the height H1 of the bump pedestal (17) detected by the displacement detection sensor, again lowering the capillary (3) down to the stop position height S to join the gold wire (1) to the bump pedestal (17), and then lifting the gold wire (1) to break the joint between the bump pedestal (17) and the gold wire (1).
摘要翻译：本发明提供一种能够防止凸块不适当地形成的凸块接合方法。凸点接合方法包括在金线（1）的尖端处形成金球（16），该金球插入通过毛细管（3），同时使用位移检测传感器来降低毛细管（3），以检测垂直位移所述毛细管（3）基于当所述金球（16）邻接所述位置检测传感器时检测到的所述毛细管（3）的位移，检测形成有电极的所述IC（11）的所述部分的位置 IC（11），将金球（16）压在电极形成部分上以形成凸起基座（17），在毛细管（3）沿水平方向移动一定量的同时将毛细管（3）提高一定量，将高度S 基于由位移检测传感器检测到的凸起基座（17）的高度H1停止毛细管（3）的位置，再次将毛细管（3）降低到停止位置高度S，从而将金线（1）到凸台（17），然后抬起g 旧电线（1），以破坏凸块基座（17）和金线（1）之间的接合部。

8. 发明授权

US5899140A Bump levelling method and bump levelling apparatus 失效
标题翻译：凸块调平方法和凸块调平装置
公开(公告)号：US5899140A
公开(公告)日：1999-05-04
申请号：US985204
申请日：1997-12-04
申请人： Akihiro Yamamoto , Makoto Imanishi , Takahiro Yonezawa , Shinzo Eguchi , Osamu Nakao
发明人： Akihiro Yamamoto , Makoto Imanishi , Takahiro Yonezawa , Shinzo Eguchi , Osamu Nakao
IPC分类号： H01L21/60 , H01L21/00 , B30B15/14
CPC分类号： H01L21/67092
摘要： A bump leveling method and a bump leveling apparatus in which the leveled height of bumps can be made constant and meet the change in thickness of an IC chip. A pressing force under which one bump is deformed to a prescribed height is measured. Thus, the pressing force under which a plurality of bumps can be deformed and leveled can be set. A load cell detects that a prescribed pressing force is exerted on the bumps and this pressing force is maintained, so that the plurality of bumps can be leveled up to the same prescribed height.
摘要翻译：可以使凸块的调平高度恒定并满足IC芯片的厚度变化的凸块调平方法和凸块调平装置。测量一个凸块变形到规定高度的压力。因此，可以设定多个凸块能够变形和平整的按压力。称重传感器检测到凸起上施加了规定的按压力，并且保持该按压力，使得多个凸块能够达到相同的规定高度。

9. 发明授权

US5686353A Semiconductor device and manufacturing method thereof 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US5686353A
公开(公告)日：1997-11-11
申请号：US576160
申请日：1995-12-21
申请人： Yoshihiko Yagi , Kazushi Higashi , Norihito Tsukahara , Koichi Kumagai , Takahiro Yonezawa
发明人： Yoshihiko Yagi , Kazushi Higashi , Norihito Tsukahara , Koichi Kumagai , Takahiro Yonezawa
IPC分类号： H01L21/60 , H01L23/485 , H01L21/44
CPC分类号： H01L24/12 , H01L24/11 , H01L24/16 , H01L2224/0401 , H01L2224/05568 , H01L2224/05573 , H01L2224/0603 , H01L2224/1134 , H01L2224/11822 , H01L2224/131 , H01L2224/13144 , H01L2224/1403 , H01L2224/16 , H01L2224/45144 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14
摘要： An electrode terminal (5) provided on a surface of a semiconductor chip (4) has a square shape in plane view. Further, the projecting apex portion (8a) of a bump (8) provided on the electrode terminal (5) orients to a corner portion (5a) of the electrode terminal (5). Hereupon, a gold ball (2a) formed by melting the lower end portion of a gold wire (2) supplied through a capillary (1) is joined to the electrode terminal (5), and then the capillary (1) is moved in the direction of a diagonal line of the square electrode (5). Thus, the main portion of the gold wire (2) is separated from the gold ball (2a) so that the bump (8) is formed.
摘要翻译：设置在半导体芯片（4）的表面上的电极端子（5）在平面图中具有正方形形状。此外，设置在电极端子（5）上的突起（8）的突出顶部（8a）定向到电极端子（5）的角部（5a）。因此，通过熔化通过毛细管（1）供给的金线（2）的下端部形成的金球（2a）与电极端子（5）接合，然后将毛细管（1）移动到方形电极（5）的对角线方向。因此，金线（2）的主要部分与金球（2a）分离，从而形成凸块（8）。

10. 发明授权

US06902101B2 Bump bonding method apparatus 失效
标题翻译：凸块接合方法装置
公开(公告)号：US06902101B2
公开(公告)日：2005-06-07
申请号：US10294614
申请日：2002-11-15
申请人： Satoshi Horie , Takahiro Yonezawa , Hiroyuki Kiyomura , Tetsuya Tokunaga , Tatsuo Sasaoka
发明人： Satoshi Horie , Takahiro Yonezawa , Hiroyuki Kiyomura , Tetsuya Tokunaga , Tatsuo Sasaoka
IPC分类号： B23K20/00 , H01L21/60 , H01L21/607 , B23K31/00 , B23K31/02 , B23K37/00
CPC分类号： B23K20/007 , H01L24/11 , H01L24/12 , H01L24/45 , H01L2224/05568 , H01L2224/05571 , H01L2224/05573 , H01L2224/05624 , H01L2224/1134 , H01L2224/13144 , H01L2224/45015 , H01L2224/45144 , H01L2224/78301 , H01L2224/85045 , H01L2224/85205 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01039 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/20306 , H01L2924/20307 , H01L2924/20308 , H01L2924/20309 , H01L2224/13099 , H01L2924/00 , H01L2224/48 , H01L2924/20752
摘要： In a bump bonding technique for forming a bump on an IC, including forming a ball at the tip of a gold wire protruding from a capillary, and providing a metal-to-metal joint by applying ultrasonic vibration from a ultrasonic head through the capillary while pressing the ball against a pad portion on the IC, the metal-to-metal joint is provided by applying the ultrasonic vibration at a frequency in a range of 130 to 320 kHz, more preferably in a range of 170 to 270 kHz, and most preferably at a frequency of 230±10 kHz at room temperatures and atmospheric pressure. Consequently, a bump is formed on an IC having a low heat resistance temperature in a satisfactory joint condition, and a bump is formed with good positional accuracy without giving the influence of heat to the surroundings.
摘要翻译：在用于在IC上形成凸块的凸块接合技术中，包括在从毛细管突出的金线的尖端处形成球，并且通过从超声波头通过毛细管施加超声波振动来提供金属对金属接头，同时将球压在IC上的焊盘部分上，通过以130至320kHz的范围内，更优选在170至270kHz的范围内施加超声波振动来提供金属对金属接头，并且大多数优选在室温和大气压下以230±10kHz的频率进行。因此，在良好的接合状态下，在具有低耐热温度的IC上形成凸块，并且在没有给周围环境造成热的影响的情况下形成具有良好位置精度的凸块。

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