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1. 发明授权

US06680221B2 Bare chip mounting method and bare chip mounting system 失效
标题翻译：裸芯片安装方法和裸芯片安装系统
公开(公告)号：US06680221B2
公开(公告)日：2004-01-20
申请号：US10267668
申请日：2002-10-10
申请人： Tetsuya Tokunaga , Takahiro Yonezawa , Hiroyuki Kiyomura , Tatsuo Sasaoka , Satoshi Horie
发明人： Tetsuya Tokunaga , Takahiro Yonezawa , Hiroyuki Kiyomura , Tatsuo Sasaoka , Satoshi Horie
IPC分类号： H01L2144
CPC分类号： H01L24/81 , H01L21/6836 , H01L24/11 , H01L24/75 , H01L2221/68327 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/45144 , H01L2224/75 , H01L2224/81801 , H01L2924/01004 , H01L2924/01033 , H01L2924/01039 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/00014 , H01L2924/00
摘要： A bare chip mounting method includes: a dicing step for dividing a semiconductor wafer into individual IC chips while the semiconductor wafer is being attached to a carrier; a washing step for washing the diced semiconductor wafer; a bump-bonding for carrying the washed semiconductor wafer to an assembly process while the semiconductor wafer is being attached to the carrier so as to form a bump on an electrode pad of the wafer; and a mounting step for mounting each of the IC chips, on which the bump is formed, onto a circuit formation body.
摘要翻译：裸芯片安装方法包括：切割步骤，用于在将半导体晶片附着到载体上的同时将半导体晶片分成单独的IC芯片; 用于洗涤切割的半导体晶片的洗涤步骤; 用于在将半导体晶片附着到载体上时将用于将洗涤的半导体晶片携带到组装过程的凸块接合，以在晶片的电极焊盘上形成凸块; 以及安装步骤，用于将形成有凸块的每个IC芯片安装到电路形成体上。

2. 发明授权

US06902101B2 Bump bonding method apparatus 失效
标题翻译：凸块接合方法装置
公开(公告)号：US06902101B2
公开(公告)日：2005-06-07
申请号：US10294614
申请日：2002-11-15
申请人： Satoshi Horie , Takahiro Yonezawa , Hiroyuki Kiyomura , Tetsuya Tokunaga , Tatsuo Sasaoka
发明人： Satoshi Horie , Takahiro Yonezawa , Hiroyuki Kiyomura , Tetsuya Tokunaga , Tatsuo Sasaoka
IPC分类号： B23K20/00 , H01L21/60 , H01L21/607 , B23K31/00 , B23K31/02 , B23K37/00
CPC分类号： B23K20/007 , H01L24/11 , H01L24/12 , H01L24/45 , H01L2224/05568 , H01L2224/05571 , H01L2224/05573 , H01L2224/05624 , H01L2224/1134 , H01L2224/13144 , H01L2224/45015 , H01L2224/45144 , H01L2224/78301 , H01L2224/85045 , H01L2224/85205 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01039 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/20306 , H01L2924/20307 , H01L2924/20308 , H01L2924/20309 , H01L2224/13099 , H01L2924/00 , H01L2224/48 , H01L2924/20752
摘要： In a bump bonding technique for forming a bump on an IC, including forming a ball at the tip of a gold wire protruding from a capillary, and providing a metal-to-metal joint by applying ultrasonic vibration from a ultrasonic head through the capillary while pressing the ball against a pad portion on the IC, the metal-to-metal joint is provided by applying the ultrasonic vibration at a frequency in a range of 130 to 320 kHz, more preferably in a range of 170 to 270 kHz, and most preferably at a frequency of 230±10 kHz at room temperatures and atmospheric pressure. Consequently, a bump is formed on an IC having a low heat resistance temperature in a satisfactory joint condition, and a bump is formed with good positional accuracy without giving the influence of heat to the surroundings.
摘要翻译：在用于在IC上形成凸块的凸块接合技术中，包括在从毛细管突出的金线的尖端处形成球，并且通过从超声波头通过毛细管施加超声波振动来提供金属对金属接头，同时将球压在IC上的焊盘部分上，通过以130至320kHz的范围内，更优选在170至270kHz的范围内施加超声波振动来提供金属对金属接头，并且大多数优选在室温和大气压下以230±10kHz的频率进行。因此，在良好的接合状态下，在具有低耐热温度的IC上形成凸块，并且在没有给周围环境造成热的影响的情况下形成具有良好位置精度的凸块。

3. 发明授权

US06667250B2 Film substrate treatment apparatus, film substrate treatment method, and film substrate transport method 失效
标题翻译：薄膜基板处理装置，薄膜基板处理方法以及薄膜基板输送方法
公开(公告)号：US06667250B2
公开(公告)日：2003-12-23
申请号：US10403081
申请日：2003-04-01
申请人： Tatsuo Sasaoka , Naoki Suzuki , Takahiro Yonezawa , Satoshi Horie
发明人： Tatsuo Sasaoka , Naoki Suzuki , Takahiro Yonezawa , Satoshi Horie
IPC分类号： H01L2131
CPC分类号： H01L21/6838 , H01L21/6831 , H05K3/3489 , H05K3/381 , Y10S414/135 , Y10S414/139
摘要： To provide a film substrate treatment apparatus that appropriately mounts film substrates on an electrostatic adsorption stage. In the film substrate treatment apparatus, adsorption pads are disposed on the first adsorption units that mount film substrates on an electrostatic stage, and a pressing member that presses the edge portion areas of the film substrates against the stage is provided. The film substrates can thereby be reliably attached to the stage, and the film substrates can be appropriately treated in a decompressed atmosphere.
摘要翻译：提供一种适当地将薄膜基板安装在静电吸附台上的薄膜基板处理装置。在薄膜基板处理装置中，设置吸附垫，将第一吸附单元安装在静电台上的薄膜基板上，并且提供将薄膜基板的边缘部分区域压在台上的按压构件。因此，能够将膜基材可靠地附着在载物台上，并且可以在减压气氛中适当地处理膜基材。

4. 发明申请

US20070193682A1 Bonding method and apparatus 失效
标题翻译：粘合方法和装置
公开(公告)号：US20070193682A1
公开(公告)日：2007-08-23
申请号：US10599638
申请日：2005-04-06
申请人： Tatsuo Sasaoka , Satoshi Horie , Isamu Aokura , Yoshihiko Yagi , Kazuki Fukada
发明人： Tatsuo Sasaoka , Satoshi Horie , Isamu Aokura , Yoshihiko Yagi , Kazuki Fukada
IPC分类号： B32B38/16 , B32B38/10 , B32B38/00 , B31F1/07
CPC分类号： B23K1/203 , B23K2101/40 , H01L21/4864 , H01L21/6835 , H01L23/3142 , H01L24/75 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/1134 , H01L2224/1181 , H01L2224/1184 , H01L2224/13019 , H01L2224/13144 , H01L2224/749 , H01L2224/75 , H01L2224/75301 , H01L2224/75753 , H01L2224/81009 , H01L2224/81011 , H01L2224/81012 , H01L2224/81013 , H01L2224/81191 , H01L2224/81395 , H01L2224/81801 , H01L2224/8182 , H01L2224/81894 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01021 , H01L2924/01025 , H01L2924/01033 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H05K3/328 , H05K3/3489 , H05K3/383 , H05K2201/0373 , H05K2201/10674 , H05K2203/0307 , Y10S438/974 , Y10T156/1023 , Y10T156/14 , H01L2224/05599
摘要： A bonding method and an apparatus that enable metal bonding under the atmospheric pressure and at room temperature, wherein the surfaces of objects (1b, 2a) to be bonded together are cleaned in an initial cleaning step (S1) to remove bonding inhibitor substances (G) such as oxides and adhered substances; one (1b) of the bonding surfaces is provided with an uneven profile with a predetermined roughness in a surface roughness control step (S3); a surface treatment step (S5) is performed to remove the substances (F) that have been removed but adhered to the bonding surfaces (1b, 2a) again; and the uneven bonding surface (1b) is pressed against the other bonding surface (2a) to bond them together.
摘要翻译：在大气压和室温下能够进行金属接合的接合方法和装置，其中在初始清洁步骤（S1）中清洁要结合在一起的物体（1b，2a）的表面以除去结合抑制剂物质（G），如氧化物和附着物质; 一个（1b）的粘合表面在表面粗糙度控制步骤（S 3）中设置有具有预定粗糙度的凹凸轮廓; 执行表面处理步骤（S 5）以除去已经去除但又粘附到接合表面（1b，2a）上的物质（F）并且不平坦的接合表面（1b）被压靠在另一个接合表面（2a）上以将它们结合在一起。

5. 发明授权

US07659148B2 Bonding method and apparatus 失效
标题翻译：粘合方法和装置
公开(公告)号：US07659148B2
公开(公告)日：2010-02-09
申请号：US10599638
申请日：2005-04-06
申请人： Tatsuo Sasaoka , Satoshi Horie , Isamu Aokura , Yoshihiko Yagi , Kazuki Fukada
发明人： Tatsuo Sasaoka , Satoshi Horie , Isamu Aokura , Yoshihiko Yagi , Kazuki Fukada
IPC分类号： H01L21/60 , H01L21/603 , H05K3/32 , H01L21/58
CPC分类号： B23K1/203 , B23K2101/40 , H01L21/4864 , H01L21/6835 , H01L23/3142 , H01L24/75 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/1134 , H01L2224/1181 , H01L2224/1184 , H01L2224/13019 , H01L2224/13144 , H01L2224/749 , H01L2224/75 , H01L2224/75301 , H01L2224/75753 , H01L2224/81009 , H01L2224/81011 , H01L2224/81012 , H01L2224/81013 , H01L2224/81191 , H01L2224/81395 , H01L2224/81801 , H01L2224/8182 , H01L2224/81894 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01021 , H01L2924/01025 , H01L2924/01033 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H05K3/328 , H05K3/3489 , H05K3/383 , H05K2201/0373 , H05K2201/10674 , H05K2203/0307 , Y10S438/974 , Y10T156/1023 , Y10T156/14 , H01L2224/05599
摘要： A bonding method and an apparatus that enable metal bonding under the atmospheric pressure and at room temperature, wherein the surfaces of objects (1b, 2a) to be bonded together are cleaned in an initial cleaning step (S1) to remove bonding inhibitor substances (G) such as oxides and adhered substances; one (1b) of the bonding surfaces is provided with an uneven profile with a predetermined roughness in a surface roughness control step (S3); a surface treatment step (S5) is performed to remove the substances (F) that have been removed but adhered to the bonding surfaces (1b, 2a) again; and the uneven bonding surface (1b) is pressed against the other bonding surface (2a) to bond them together.
摘要翻译：在大气压和室温下能够进行金属接合的接合方法和装置，其中在初始清洁步骤（S1）中清洁要结合在一起的物体（1b，2a）的表面以除去粘合抑制剂物质（G ）如氧化物和附着物质; 一个（1b）的接合表面在表面粗糙度控制步骤（S3）中设置有具有预定粗糙度的不平坦轮廓; 执行表面处理步骤（S5）以除去已经去除但再次粘合到接合表面（1b，2a）上的物质（F）; 并且不平坦的接合表面（1b）被压靠在另一个接合表面（2a）上以将它们结合在一起。

6. 发明授权

US06996889B2 Electronic part mounting apparatus and method 失效
标题翻译：电子零件安装装置及方法
公开(公告)号：US06996889B2
公开(公告)日：2006-02-14
申请号：US10627479
申请日：2003-07-25
申请人： Kazushi Higashi , Tatsuo Sasaoka , Satoshi Horie , Takashi Omura
发明人： Kazushi Higashi , Tatsuo Sasaoka , Satoshi Horie , Takashi Omura
IPC分类号： B23P23/00
CPC分类号： H05K13/04 , H01L21/67739 , H01L24/75 , H01L2924/14 , H01L2924/351 , H05K3/26 , H05K3/3489 , Y10T29/5136 , Y10T29/5137 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , H01L2924/00
摘要： An electronic part mounting apparatus includes a chamber for cleaning a substrate and an electronic part by plasma, a mounting mechanism for mounting the electronic part on the electronic part, and a conveying robot for conveying the substrate and the electronic part from the chamber to the mounting mechanism. After plasma cleaned, the substrate and the electronic part are swiftly conveyed to the mounting mechanism by the conveying robot. After the electronic part is mounted on the substrate by the mounting mechanism, the resultant combination of them is pulse heated. Therefore, the electronic part is appropriately mounted on the substrate in a state that those are exposed to the air. A part mounting mechanism is simplified.
摘要翻译：电子部件安装装置包括用于通过等离子体清洁基板和电子部件的室，用于将电子部件安装在电子部件上的安装机构，以及用于将基板和电子部件从腔室输送到安装件的输送机器人机制。等离子体清洁后，基板和电子部件通过输送机器人迅速地传送到安装机构。在通过安装机构将电子部件安装在基板上之后，将它们的组合进行脉冲加热。因此，电子部件以暴露于空气的状态适当地安装在基板上。零件安装机构简化。

7. 发明申请

US20060081974A1 Electronic part mounting apparatus and method 审中-公开
标题翻译：电子零件安装装置及方法
公开(公告)号：US20060081974A1
公开(公告)日：2006-04-20
申请号：US11288020
申请日：2005-11-28
申请人： Kazushi Higashi , Tatsuo Sasaoka , Satoshi Horie , Takashi Omura
发明人： Kazushi Higashi , Tatsuo Sasaoka , Satoshi Horie , Takashi Omura
IPC分类号： H01L23/48
CPC分类号： H05K13/04 , H01L21/67739 , H01L24/75 , H01L2924/14 , H01L2924/351 , H05K3/26 , H05K3/3489 , Y10T29/5136 , Y10T29/5137 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , H01L2924/00
摘要： An electronic part mounting apparatus includes a chamber for cleaning a substrate and an electronic part by plasma, amounting mechanism for mounting the electronic part on the electronic part, and a conveying robot for conveying the substrate and the electronic part from the chamber to the mounting mechanism. After plasma cleaned, the substrate and the electronic part are swiftly conveyed to the mounting mechanism by the conveying robot. After the electronic part is mounted on the substrate by the mounting mechanism, the resultant combination of them is pulse heated. Therefore, the electronic part is appropriately mounted on the substrate in a state that those are exposed to the air. A part mounting mechanism is simplified.
摘要翻译：电子部件安装装置包括用于清洁基板的室和通过等离子体的电子部件，用于将电子部件安装在电子部件上的分配机构，以及用于将基板和电子部件从腔室传送到安装机构的输送机器人。等离子体清洁后，基板和电子部件通过输送机器人迅速地传送到安装机构。在通过安装机构将电子部件安装在基板上之后，将它们的组合进行脉冲加热。因此，电子部件以暴露于空气的状态适当地安装在基板上。零件安装机构简化。

8. 发明授权

US09688825B2 Method for manufacturing rubber composition 有权
公开(公告)号：US09688825B2
公开(公告)日：2017-06-27
申请号：US13876983
申请日：2011-10-03
申请人： Seiichi Katou , Satoshi Horie
发明人： Seiichi Katou , Satoshi Horie
IPC分类号： C08J3/20 , C08J3/22 , C08K3/00 , C08K3/04 , C08K3/36 , C08K5/00 , C08K5/31 , C08K5/38 , C08K5/39 , C08K5/40 , C08K5/44 , C08K5/47 , C08K5/548 , C08K9/06 , C08K5/405 , C08L7/00
CPC分类号： C08J3/22 , C08J3/20 , C08J2309/00 , C08K3/013 , C08K3/04 , C08K3/36 , C08K5/0025 , C08K5/31 , C08K5/38 , C08K5/39 , C08K5/40 , C08K5/405 , C08K5/44 , C08K5/47 , C08K5/548 , C08K9/06 , C08L7/00 , C08L21/00
摘要： The present invention relates to a method for producing a rubber composition containing a rubber component (A) of at least one selected from natural rubbers and synthetic dienic rubbers, a filler containing an inorganic filler (B), a silane coupling agent (C) and at least one vulcanization promoter (D) selected from guanidines, sulfenamides, thiazoles, thiurams, dithiocarbamate salts, thioureas and xanthate salts, wherein the rubber composition is kneaded in at least three stages, in the first stage (X) of kneading, the rubber component (A), all or a part of the inorganic filler (B), and all or a part of the silane coupling agent (C) are kneaded, then in the stage (Y) on and after the second stage of kneading but before the final stage, the vulcanization promoter (D) is added and kneaded, and in the final stage (Z) of kneading, a vulcanizing agent is added and kneaded.

9. 发明申请

US20140142235A1 RUBBER COMPOSITION 有权
标题翻译：橡胶组合物
公开(公告)号：US20140142235A1
公开(公告)日：2014-05-22
申请号：US14114252
申请日：2012-04-27
申请人： Satoshi Horie , Takaaki Igarashi
发明人： Satoshi Horie , Takaaki Igarashi
IPC分类号： C08K3/36 , C08K5/548
CPC分类号： C08K3/36 , B60C1/0016 , C08K3/04 , C08K5/548 , C08L9/06 , C08L19/006 , C08L21/00
摘要： The present invention provides a rubber composition containing: (A) a rubber component containing from 90 to 100% by mass of at least one kind of diene rubber synthesized by solution polymerization and from 0 to 10% by mass of another kind of diene rubber; (B) silica having a n-hexadecyltrimethylammonium bromide (CTAB) adsorption specific surface area of 140 m2/g or more and less than 180 m2/g measured according to a method described in ASTM D3765-92; (C) at least one silane coupling agent selected from a polysulfide compound and a thioester compound; and (D) a vulcanization accelerator, the rubber composition after vulcanization having an average aggregated aggregate area (nm2) of the silica of 2,200 or less, and thus provides a rubber composition that is improved in low-heat-generation property.
摘要翻译：本发明提供一种橡胶组合物，其含有：（A）含有90〜100质量％的通过溶液聚合合成的至少一种二烯系橡胶和0〜10质量％的其他二烯系橡胶的橡胶成分; （B）根据ASTM D3765-92中描述的方法测量的具有140m 2 / g以上且小于180m 2 / g的正十六烷基三甲基溴化铵（CTAB）吸附比表面积的二氧化硅; （C）选自多硫化物化合物和硫酯化合物的至少一种硅烷偶联剂; 和（D）硫化促进剂，硫化后的橡胶组合物的二氧化硅的平均凝集聚集面积（nm2）为2200以下，由此提供低发热性提高的橡胶组合物。

10. 发明申请

US20140051792A1 RUBBER COMPOSITION 有权
标题翻译：橡胶组合物
公开(公告)号：US20140051792A1
公开(公告)日：2014-02-20
申请号：US14113499
申请日：2012-04-27
申请人： Satoshi Horie , Takaaki Igarashi
发明人： Satoshi Horie , Takaaki Igarashi
IPC分类号： C08K3/36 , C08K5/548 , C08K13/02 , C08K5/31
CPC分类号： C08K13/02 , C08K3/04 , C08K3/36 , C08K5/31 , C08K5/548 , C08L9/00 , C08L21/00
摘要： The present invention provides a rubber composition containing: (A) a rubber component containing from 90 to 100% by mass of at least one kind of diene rubber synthesized by solution polymerization and from 0 to 10% by mass of another kind of diene rubber; (B) a silica having a n-hexadecyltrimethylammonium bromide (CTAB) adsorption specific surface area of 180 m2/g or more measured according to a method described in ASTM D3765-92; (C) at least one silane coupling agent selected from a polysulfide compound and a thioester compound; and (D) a vulcanization accelerator, the rubber composition after vulcanization having an average aggregated aggregate area (nm2) of the silica of 1,700 or less, and thus provides a rubber composition that is improved in low-heat-generation property.
摘要翻译：本发明提供一种橡胶组合物，其含有：（A）含有90〜100质量％的通过溶液聚合合成的至少一种二烯系橡胶和0〜10质量％的其他二烯系橡胶的橡胶成分; （B）根据ASTM D3765-92中记载的方法测定的具有正十六烷基三甲基溴化铵（CTAB）吸附比表面积为180m 2 / g以上的二氧化硅; （C）选自多硫化物化合物和硫酯化合物的至少一种硅烷偶联剂; 和（D）硫化促进剂，硫化后的橡胶组合物的二氧化硅的平均凝集聚集面积（nm2）为1700以下，由此提供了低发热性提高的橡胶组合物。

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