会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Mounting apparatus of electronic component
    • 电子元件安装装置
    • US5457874A
    • 1995-10-17
    • US174359
    • 1993-12-28
    • Takahiro YonezawaWataru HiraiMuneyoshi FujiwaraKunio SakuraiNaohiko ChimuraHiroshi Ohta
    • Takahiro YonezawaWataru HiraiMuneyoshi FujiwaraKunio SakuraiNaohiko ChimuraHiroshi Ohta
    • B23P21/00H05K13/00H05K13/04B23P19/04H05K3/32
    • H05K13/0408Y10S29/044Y10T29/53178Y10T29/53183Y10T29/53191
    • A mounting apparatus for mounting electronic components, includes a component feeding section wherein plural component feeding units accommodating plural components and sequentially supplying components to a predetermined component take-out position are arranged on a moving table along a moving direction, a positioning mechanism of a mounting member to which one component is to be mounted, and a mounting device for holding one component at a predetermined position in the feeding section and mounting the component onto the mounting member. The mounting device includes a movable member which is vertically movable and has a gas groove which is formed at an inside part of the movable member, and a rotary member which is rotatable around a vertical axis of the movable member and has at its inside part a gas groove which is formed at an inside part of the rotary member and is communicated with the groove of the movable member so as to transmit gas between the grooves during operation. The mounting device also includes a pressure gas transmitting member having positive and negative pressure holes of gas passages formed at its inside, and a gas switching member having a gas groove communicating with a suction passage of a suction member for sucking the component. The switching member is movable to selectively switch between states where the suction passage is communicated with the positive pressure hole and the negative pressure hole, respectively.
    • 一种用于安装电子部件的安装装置,包括:部件供给部,其中容纳多个部件的多个部件供给单元和向预定部件取出位置顺序供给部件沿着移动方向配置在移动台上,安装部 要安装一个部件的部件和用于将一个部件保持在进给部分中的预定位置并将部件安装到安装部件上的安装装置。 安装装置包括可移动部件,其可垂直移动并且具有形成在可动部件的内侧部分的气体槽,以及能够围绕可动部件的垂直轴线旋转的旋转部件,其内侧部分 气槽,其形成在旋转构件的内部,并与可动构件的槽连通,以便在操作期间在槽之间传递气体。 安装装置还包括具有在其内部形成的气体通道的正和负压孔的压力气体传递构件,以及气体切换构件,其具有与抽吸构件的吸入通道连通的气体槽。 切换构件可移动以选择性地在吸入通道与正压孔和负压孔连通的状态之间切换。
    • 2. 发明授权
    • Electronic component mounting apparatus
    • 电子元件安装装置
    • US06178621B2
    • 2001-01-30
    • US09029627
    • 1998-04-23
    • Satoshi ShidaWataru HiraiMuneyoshi FujiwaraHiroshi OhtaHirokazu Honkawa
    • Satoshi ShidaWataru HiraiMuneyoshi FujiwaraHiroshi OhtaHirokazu Honkawa
    • H05K330
    • H05K13/0409Y10T29/53091Y10T29/53178Y10T29/53191Y10T29/53261
    • By lightening the impact load to an electronic component and greatly promoting the load range, the adaptability to the electronic components is enhanced and the manned manual operation is eliminated, thereby improving the productivity and realizing unmanned operation. The vacuum-clamping nozzle unit comprises an automatically detachable vacuum-clamping nozzle (2) for vacuum-clamping the electronic component, a positioning section (3) for positioning the vacuum-clamping nozzle (2) in a rotating direction and a vertical direction, a pushing section (4) for urging said vacuum-clamping nozzle (2) downward by using fluid, a fluid pressure switching section for switching the urging force, a timing switching section for switching the timing of the urging force of said vacuum-clamping nozzle, and a pressure control section for controlling the load to a desired load. Switching the timing of the urging force can be made before or at the time of mounting the electronic component on an electronic circuit board.
    • 通过减轻对电子元件的冲击负荷并大大提高负载范围,提高了对电子元器件的适应性,消除了人工操作,从而提高了生产效率,实现了无人操作。 真空夹紧喷嘴单元包括用于真空夹紧电子部件的可自动拆卸的真空夹紧喷嘴(2),用于将真空夹紧喷嘴(2)沿旋转方向和垂直方向定位的定位部分(3) 用于通过使用流体向下推动所述真空夹紧喷嘴(2)的推动部分(4),用于切换所述推动力的流体压力切换部分,用于切换所述真空夹紧喷嘴的作用力的正时的定时切换部分 以及用于将负载控制到期望负载的压力控制部。 可以在将电子部件安装在电子电路板上之前或之前进行推压力的定时切换。
    • 3. 发明授权
    • Component-mounting apparatus and method
    • 组件安装设备和方法
    • US5740604A
    • 1998-04-21
    • US510679
    • 1995-08-03
    • Naoyuki KitamuraHiroshi OhtaMuneyoshi FujiwaraWataru Hirai
    • Naoyuki KitamuraHiroshi OhtaMuneyoshi FujiwaraWataru Hirai
    • H05K13/00H05K13/04H05K3/30B23P19/00
    • H05K13/0452Y10T29/4913Y10T29/53178Y10T29/53183Y10T29/53261
    • A component-mounting apparatus includes a component supply mechanism for supplying components to be mounted on a circuit board, a circuit board positioning device for placing in position the circuit board on which the components are to be mounted, and a mounting head for taking out one of the components at a predetermined component take-out position of the component supply mechanism, thus mounting the component on the circuit board. The component supply mechanism includes a plurality of supply tables on which a plurality of component supply devices have been arranged at predetermined intervals, a driving device for moving the supply tables in a direction in which the component supply devices have been arranged, thus placing the desired component supply device at the predetermined component take-out position, and a table exchange device provided at one end of a movable range of the supply tables to be driven by the driving device and allow the supply tables to be placed thereon and allow positions of the desired supply table to be switched by the driving device.
    • 部件安装装置包括用于提供要安装在电路板上的部件的部件供给机构,用于将要安装部件的电路板放置在其上的电路板定位装置,以及用于取出一个 在部件供给机构的预定部件取出位置处的部件,从而将部件安装在电路板上。 部件供给机构包括多个供给台,多个部件供给装置以预定的间隔配置在该供给台上,驱动装置用于沿供给部件供给装置的排列方向移动供给台, 零件供给装置,以及在所述供给台的可移动范围的一端设置成由所述驱动装置驱动的台面更换装置,并且允许所述供给台被放置在其上, 所需供应台由驱动装置切换。
    • 9. 发明授权
    • 2-amino-bicyclo(3.1.0) hexane-2,6-dicarboxylic ester derivative
    • 2-氨基 - 双环(3.1.0)己烷-2,6-二羧酸酯衍生物
    • US08076502B2
    • 2011-12-13
    • US12847392
    • 2010-07-30
    • Akito YasuharaKazunari SakagamiHiroshi OhtaAtsuro Nakazato
    • Akito YasuharaKazunari SakagamiHiroshi OhtaAtsuro Nakazato
    • C07C69/74C07C61/12
    • C07C229/50C07D307/88
    • A drug effective for the treatment and prevention of psychiatric disorders such as schizophrenia, anxiety and related ailments thereof, depression, bipolar disorder and epilepsy. The drug antagonizes the action of group II metabotropic glutamate receptors and shows high activity in oral administrationA 2-amino-bicyclo[3.1.0]hexane-2,6-dicarboxylic ester derivative represented by formula [I] [wherein R1 and R2 are identical or different, and each represents a hydrogen atom, a C1-10alkyl group or the like; X represents a hydrogen atom or a fluorine atom; Y represents —OCHR3R4 or the like (wherein R3 and R4 are identical or different, and each represents a hydrogen atom, a C1-10alkyl group or the like; and n represents integer 1 or 2)], a pharmaceutically acceptable salt thereof or a hydrate thereof.
    • 一种有效治疗和预防精神疾病如精神分裂症,焦虑及其相关疾病,抑郁症,双相情感障碍和癫痫的药物。 该药物拮抗II型代谢型谷氨酸受体的作用,并且在口服给药中表现出高活性。由式[I]表示的2-氨基 - 双环[3.1.0]己烷-2,6-二羧酸酯衍生物[其中R1和R2为 相同或不同,并且各自表示氢原子,C 1-10烷基等; X表示氢原子或氟原子; Y表示-OCHR 3 R 4等(其中R 3和R 4相同或不同,并且各自表示氢原子,C 1-10烷基等; n表示1或2的整数)],其药学上可接受的盐或 水合物。
    • 10. 发明授权
    • Semiconductor device having a junction of P type pillar region and N type pillar region
    • 具有P型支柱区域和N型支柱区域的结的半导体器件
    • US08013360B2
    • 2011-09-06
    • US12764763
    • 2010-04-21
    • Wataru SaitoSyotaro OnoMasakatsu TakashitaYasuto SumiMasaru IzumisawaHiroshi OhtaWataru Sekine
    • Wataru SaitoSyotaro OnoMasakatsu TakashitaYasuto SumiMasaru IzumisawaHiroshi OhtaWataru Sekine
    • H01L29/66
    • H01L29/872H01L29/0619H01L29/0623H01L29/0634H01L29/0696H01L29/0878H01L29/402H01L29/404H01L29/41741H01L29/7395H01L29/7397H01L29/7722H01L29/7806H01L29/7811H01L29/8611
    • A semiconductor device includes: a semiconductor layer of a first conductivity type; a first semiconductor pillar region of the first conductivity type provided on a major surface of the semiconductor layer; a second semiconductor pillar region of a second conductivity type provided adjacent to the first semiconductor pillar region on the major surface of the semiconductor layer, the second semiconductor pillar region forming a periodic arrangement structure substantially parallel to the major surface of the semiconductor layer together with the first semiconductor pillar region; a first main electrode; a first semiconductor region of the second conductivity type; a second semiconductor region of the first conductivity type; a second main electrode; a control electrode; and a high-resistance semiconductor layer provided on the semiconductor layer in an edge termination section surrounding the first semiconductor pillar region and the second semiconductor pillar region. The high-resistance semiconductor layer has a lower dopant concentration than the first semiconductor pillar region. A boundary region is provided between a device central region and the edge termination section. The first semiconductor pillar region and the second semiconductor pillar region adjacent to the high-resistance semiconductor layer in the boundary region have a depth decreasing stepwise toward the edge termination section.
    • 半导体器件包括:第一导电类型的半导体层; 设置在半导体层的主表面上的第一导电类型的第一半导体柱区域; 第二导电类型的第二半导体柱区域,与半导体层的主表面上的第一半导体柱区域相邻设置,第二半导体柱区域形成基本上平行于半导体层的主表面的周期性排列结构以及 第一半导体柱区域; 第一主电极; 第二导电类型的第一半导体区域; 第一导电类型的第二半导体区域; 第二主电极; 控制电极; 以及设置在包围第一半导体柱区域和第二半导体柱区域的边缘终端部分的半导体层上的高电阻半导体层。 高电阻半导体层的掺杂浓度低于第一半导体柱区域。 边界区域设置在设备中心区域和边缘终端部分之间。 边界区域中与高电阻半导体层相邻的第一半导体柱区域和第二半导体柱区域具有沿着边缘终止部分逐步减小的深度。