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    • 2. 发明授权
    • Synchronous RAM controlling device and method
    • 同步RAM控制装置及方法
    • US5946269A
    • 1999-08-31
    • US156345
    • 1998-09-18
    • Tae-seong Jang
    • Tae-seong Jang
    • G11C11/413G11C7/10G11C8/04G11C11/407H03M7/00G11C8/00
    • G11C7/1018
    • There are provided a synchronous RAM controlling device and method for controlling a synchronous RAM in order to access data when a burst length of a memory access is full page regardless of whether a termination access method or a wrap-around access method is used. In the synchronous RAM controlling device, an OR gate performs an OR operation on a burst stop signal for stopping input/output of data in the synchronous RAM responsive to an externally received input/output operation command signal. A counter is reset in response to the OR-operation result and counts the cycles of an external system clock signal. A burst sensor senses completion of a burst operation according to a burst length signal which is externally received and represents a burst length of at least 1 and outputs the sensed result as the burst stop signal. A control signal is input to the burst sensor which causes the burst sensor to operate the memory in one of termination or wrap-around access methods. A controller outputs the control signal, where the value of the control signal indicates termination access method when a fuse of the controller is not cut and either no logic level or a high logic level are input to an input pad of the controller. When the fuse is cut or a logic low level is input to the input pad, then the control signal output by the controller will indicate wrap-around access method.
    • 提供了一种用于控制同步RAM的同步RAM控制装置和方法,以便当存储器访问的突发长度是全页时访问数据,而不管终端访问方法还是环绕访问方法是否被使用。 在同步RAM控制装置中,OR门响应于外部接收的输入/输出操作命令信号,对突发停止信号执行OR操作,以停止同步RAM中的数据的输入/输出。 计数器响应于或运算结果而复位,并对外部系统时钟信号的周期进行计数。 突发传感器根据外部接收的突发长度信号来感测突发操作的完成,并且表示至少为1的突发长度,并将感测结果输出为突发停止信号。 控制信号被输入到突发传感器,其使得突发传感器以终止或环绕访问方法之一来操作存储器。 控制器输出控制信号,其中控制信号的值表示当控制器的熔丝没有被切断并且没有逻辑电平或高逻辑电平被输入到控制器的输入焊盘时的终止访问方法。 当熔断器被切断或逻辑低电平输入到输入焊盘时,控制器输出的控制信号将指示环绕存取方式。
    • 3. 发明授权
    • Integrated circuit chips with multiplexed input/output pads and methods
of operating same
    • 具有复用输入/输出焊盘的集成电路芯片及其操作方法
    • US5677877A
    • 1997-10-14
    • US651375
    • 1996-05-22
    • Sei-Seung YoonTae-Seong Jang
    • Sei-Seung YoonTae-Seong Jang
    • G11C11/41G11C5/06G11C11/407G11C29/00H01L21/8242H01L27/10H01L27/108G11C7/00G11C8/00
    • G11C29/808G11C29/84G11C5/066
    • Integrated circuit chips with multiplexed input/output pads include means for expanding the functional and diagnostic capability of the circuit by increasing the effective number of input/output pads connected thereto so that more information can be provided to and from the chip. In particular, multiplexing means preferably provides the capability of accessing any one of a plurality of signal lines in the circuit from each input/output pad. This expanded capability is preferably achieved using one or more selection control signals which can be generated internally or externally to a chip containing the integrated circuit. An integrated circuit memory device, for example, preferably comprises a semiconductor substrate, a memory circuit in the substrate, a plurality of input/output pads and means, coupled to signal lines in the memory circuit, for multiplexing the plurality of input/output pads to the signal lines by electrically connecting respective ones of the signal lines to the input/output pads in response to a first select signal and electrically connecting respective others of the signal lines to the input/output pads in response to a second select signal. Because each pad on a chip can be connected to one or more signal lines, the memory circuit has a greater number of effective pads which means that a fewer number of pads on a small memory circuit chip can provide essentially the same input/output capability as a greater number of pads on a larger chip.
    • 具有复用输入/输出焊盘的集成电路芯片包括通过增加连接到其上的输入/输出焊盘的有效数量来扩展电路的功能和诊断能力的装置,以便可以向芯片提供更多的信息。 具体地,复用装置优选地提供从每个输入/输出焊盘访问电路中的多条信号线中的任何一条的能力。 该扩展能力优选地使用可以在包含集成电路的芯片的内部或外部产生的一个或多个选择控制信号来实现。 例如,集成电路存储器件优选地包括半导体衬底,衬底中的存储器电路,耦合到存储器电路中的信号线的多个输入/输出焊盘和装置,用于多路复用多个输入/输出焊盘 通过响应于第一选择信号将相应的信号线电连接到输入/输出焊盘并且响应于第二选择信号将各个信号线电连接到输入/输出焊盘而将信号线连接到信号线。 因为芯片上的每个焊盘可以连接到一个或多个信号线,所以存储器电路具有更多数量的有效焊盘,这意味着小存储器电路芯片上较少数量的焊盘可以提供基本相同的输入/输出能力 更大数量的焊盘在更大的芯片上。
    • 4. 发明授权
    • Semiconductor memory device capable of driving word lines at high speed
    • 能够高速驱动字线的半导体存储器件
    • US5579268A
    • 1996-11-26
    • US580885
    • 1995-12-29
    • Dong-Il SeoTae-Seong Jang
    • Dong-Il SeoTae-Seong Jang
    • G11C8/08G11C29/00G11C11/40
    • G11C29/844G11C8/08G11C29/781
    • A semiconductor memory device for driving word lines at high speed has a word line signal generating circuit for receiving a predecoded signal of a row address, and power source supply circuit for supplying the output signal of the word line signal generating circuit to a word line as source power. The device includes a normal word line decoder for receiving the predecoded signal and the output signal of the power source supplying circuit, respectively and for selecting a normal word line; a spare word line decoder for receiving the predecoded signal and the output signal of the power source supply circuit, respectively and for selecting a spare word line; and a redundancy enabling circuit connected to the spare word line decoder and the normal word line decoder for determining whether the normal word line is selected.
    • 用于高速驱动字线的半导体存储器件具有用于接收行地址的预解码信号的字线信号发生电路和用于将字线信号发生电路的输出信号提供给字线的电源供应电路, 源功率 该装置包括用于分别接收预解码信号和电源供给电路的输出信号的正常字线解码器,用于选择正常字线; 用于分别接收所述预解码信号和所述电源供给电路的输出信号的备用字线解码器,用于选择备用字线; 以及连接到备用字线解码器和通常字线解码器的冗余使能电路,用于确定是否选择了正常字线。
    • 8. 发明申请
    • Circuit for selecting a power supply voltage and semiconductor device having the same
    • 用于选择电源电压的电路和具有该电源电压的半导体器件
    • US20070036019A1
    • 2007-02-15
    • US11500346
    • 2006-08-08
    • Tae-Seong Jang
    • Tae-Seong Jang
    • G11C5/14
    • G11C5/14G11C29/02G11C29/021G11C29/1201
    • A semiconductor memory device capable of reducing the number of pads is provided. The semiconductor memory device may include a pad, a power supply voltage generating circuit and a voltage selection circuit. The power supply voltage generating circuit may generate one or more power supply voltages, which may be used in a semiconductor device. The voltage selection circuit may select one of the power supply voltages in response to test mode signals to provide the selected power supply voltage to the pad. The voltage selection circuit may include a voltage level regulating circuit to convert voltage levels of the test mode signals to generate gate control signals and metal-oxide semiconductor (MOS) transistors connected to the power supply voltages, respectively. The MOS transistors may be selectively turned on in response to the gate control signals to provide the selected power supply voltage to the pad.
    • 提供了能够减少焊盘数量的半导体存储器件。 半导体存储器件可以包括焊盘,电源电压产生电路和电压选择电路。 电源电压发生电路可以产生可用于半导体器件中的一个或多个电源电压。 电压选择电路可以响应于测试模式信号选择电源电压之一,以将所选择的电源电压提供给焊盘。 电压选择电路可以包括电压电平调节电路,以分别转换测试模式信号的电压电平以产生连接到电源电压的栅极控制信号和金属氧化物半导体(MOS)晶体管。 可以响应于栅极控制信号选择性地导通MOS晶体管,以向焊盘提供所选择的电源电压。