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1. 发明授权

US5740729A Printing apparatus and method for inspecting printed materials 失效
标题翻译：用于检查印刷品的印刷装置和方法
公开(公告)号：US5740729A
公开(公告)日：1998-04-21
申请号：US536262
申请日：1995-09-29
申请人： Osamu Hikita , Syoji Sato , Toshinori Mimura , Kazue Okanoue , Youichi Nakamura
发明人： Osamu Hikita , Syoji Sato , Toshinori Mimura , Kazue Okanoue , Youichi Nakamura
IPC分类号： B41F15/08 , B41F15/12 , B41F15/26 , B41F33/00 , B41M1/12 , B41M1/34 , H05K3/12 , H05K3/34 , B41F15/18
CPC分类号： B41F15/12 , B41F15/26 , B41F33/0036 , B41M1/12 , H05K3/1216 , B41M1/34
摘要： In a printing apparatus and method, printing material is printed on to-be-printed circuit boards in a predetermined pattern and a printing state of the material is inspected. The apparatus includes the following devices. A board supporting device has a rotary body supporting a plurality of board-fixed tables to which the boards are secured, and turns the rotary body together with the board-fixed tables intermittently at predetermined angular intervals so as to stop the board-fixed tables at each of a fixing, recognizing, printing, and inspecting position. A board feed device feeds the boards to the board-fixed tables arranged at the fixing position. A board discharge device discharges the boards from the board-fixed tables arranged at the fixing position. A recognizing device recognizes fixed positions of the boards relative to the board-fixed tables at the recognizing position. A printing device prints the printing material on the boards at the printing position. An inspecting device inspects the printing state of the boards at the inspecting position. The method carries out the board-feeding, position recognizing, printing, printing-state-inspecting, and board-discharging operations by use of the corresponding devices.
摘要翻译：在打印设备和方法中，印刷材料以预定图案印刷在印刷电路板上，并检查材料的印刷状态。该装置包括以下装置。板支撑装置具有支撑板固定的多个板固定台的旋转体，并以预定的角度间隔间歇地将旋转体与板固定台一起转动，以便将板固定台停止在每个固定，识别，打印和检查位置。板馈送装置将板馈送到布置在固定位置的板固定台。板放电装置将板从布置在固定位置的板固定台排出。识别装置在识别位置识别板相对于板固定台的固定位置。打印装置在打印位置将打印材料打印在印刷电路板上。检查装置在检查位置检查印版的印刷状态。该方法通过使用相应的设备进行板进给，位置识别，打印，打印状态检查和板放电操作。

2. 发明授权

US5693559A Method for printing solder paste 失效
标题翻译：焊膏印刷方法
公开(公告)号：US5693559A
公开(公告)日：1997-12-02
申请号：US631021
申请日：1996-04-12
申请人： Masahiro Taniguchi , Toshinori Mimura , Kazue Okanoue , Hiroaki Onishi , Nobuya Matsumura
发明人： Masahiro Taniguchi , Toshinori Mimura , Kazue Okanoue , Hiroaki Onishi , Nobuya Matsumura
IPC分类号： B41F15/08 , B41F15/16 , H05K3/12 , H01L21/48
CPC分类号： B41F15/0818 , B41F15/16 , H05K3/1233 , B41P2215/14 , H05K2201/10151 , H05K2203/0264
摘要： A method for printing a solder paste to a printed circuit board with use of a screen mask plate and a squeegee, the method includes steps of moving one of the printed circuit board and the screen mask plate at a first moving speed in a direction to be separated from the other of them after printing of the solder paste and until the moving one of the printed circuit board and the screen mask plate reaches a plate-separation position which is a position immediately before the screen mask plate and the printed circuit board are completely separated from each other, and changing the first moving speed to a second moving speed higher than the first moving speed when the moving one of the printed circuit board and the screen mask plate reaches the plate-separation position.
摘要翻译：一种使用屏蔽掩模板和刮板将焊膏印刷到印刷电路板的方法，所述方法包括以一个方向移动印刷电路板和屏蔽掩模板之一的步骤：在印刷焊膏之后与另一个分离，并且直到印刷电路板和屏蔽掩模板上移动的一个到达屏幕掩模板和印刷电路板之前的位置的板分离位置是完全的并且当印刷电路板和屏蔽掩模板中的移动的一个到达分隔位置时，将第一移动速度改变到高于第一移动速度的第二移动速度。

3. 发明授权

US5735203A Apparatus for printing solder paste to a printed circuit board and separating a screen mask plate from the printed circuit board 失效
标题翻译：用于将焊膏印刷到印刷电路板并将屏蔽掩模板与印刷电路板分离的装置
公开(公告)号：US5735203A
公开(公告)日：1998-04-07
申请号：US762872
申请日：1996-12-12
申请人： Masahiro Taniguchi , Toshinori Mimura , Kazue Okanoue , Hiroaki Onishi , Nobuya Matsumura
发明人： Masahiro Taniguchi , Toshinori Mimura , Kazue Okanoue , Hiroaki Onishi , Nobuya Matsumura
IPC分类号： B41F15/08 , B41F15/16 , H05K3/12 , B41F15/26
CPC分类号： B41F15/0818 , B41F15/16 , H05K3/1233 , B41P2215/14 , H05K2201/10151 , H05K2203/0264
摘要： An apparatus for printing a solder paste to a printed circuit board with use of a screen mask plate and a squeegee. The apparatus includes a device for moving one of the printed circuit board and the screen mask plate at a first moving speed in a direction to be separated from the other of them after printing of the solder paste and until the moving one of the printed circuit board and the screen mask plate reaches a plate-separation position which is a position immediately before the screen mask plate and the printed circuit board are completely separated from each other, and a controller for changing the first moving speed to a second moving speed higher than the first moving speed when the moving one of the printed circuit board and the screen mask plate reaches the plate-separation position.
摘要翻译：一种使用屏蔽掩模板和刮板将焊膏印刷到印刷电路板的设备。该装置包括：在印刷焊膏之后，以与第一移动速度相对应的方向移动印刷电路板和屏蔽掩模板中的一个的装置，并且直到移动的印刷电路板屏幕掩模板到达位于屏幕掩模板之前的位置和印刷电路板完全分离的平板分离位置，以及控制器，用于将第一移动速度改变为高于当移动的印刷电路板和屏幕掩模板之一到达平板分离位置时的第一移动速度。

4. 发明授权

US5976269A Printing mask cleaning apparatus and method 失效
标题翻译：印刷面膜清洗装置及方法
公开(公告)号：US5976269A
公开(公告)日：1999-11-02
申请号：US942111
申请日：1997-10-01
申请人： Kurayasu Hamasaki , Toshiaki Yamauchi , Kazue Okanoue , Kazumi Ishimoto , Ken Takahashi , Takao Naito , Koji Mitsushiro
发明人： Kurayasu Hamasaki , Toshiaki Yamauchi , Kazue Okanoue , Kazumi Ishimoto , Ken Takahashi , Takao Naito , Koji Mitsushiro
IPC分类号： B41F15/12 , B41F35/00 , H05K3/12
CPC分类号： B41F35/005 , H05K3/1216
摘要： A main wiping portion which contacts the back of a mask through a cleaning paper is provided behind a suction port as viewed in the direction of movement of an air suction portion. The cleaning paper is able to wipe off both solder paste adhered on the back of the mask and solder paste discharged from openings of the mask by suction through the suction port, whereby the solder paste deposits on the mask can be cleaned off at high removal efficiency.
摘要翻译：在吸气部的移动方向观察时，在吸入口的后方设置有通过清洁纸与面罩背面接触的主擦拭部。清洁纸能够通过吸入口从吸附口抽出掩模上粘附的焊膏和从面罩开口排出的焊膏，从而能够以高的去除效率清除掩模上的焊膏沉积物。

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