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    • 2. 发明授权
    • Duty control circuit and semiconductor device having the same
    • 占空比控制电路和具有相同功能的半导体器件
    • US07994835B2
    • 2011-08-09
    • US12585680
    • 2009-09-22
    • Kwan-yeob ChaeSu-ho KimWon LeeSang-hoon JooDharmendra PanditJong-ryun Choi
    • Kwan-yeob ChaeSu-ho KimWon LeeSang-hoon JooDharmendra PanditJong-ryun Choi
    • H03K3/017
    • H03K5/1565H03K2005/00058
    • A duty control circuit including a clock input unit connected to a first node and a second node, the clock input unit receiving an input clock signal through the first node and changing a voltage of the second node to one of a first voltage level and a second voltage level in response to respective low and high logic levels of the input clock signal, a slew controller connected to the second node, the slew controller including one or more switches controlled by respective control signals, the one or more switches providing one of the first voltage level and the second voltage level to the second node in response to the control signals such that a slew rate of a signal at the second node is varied, and a clock output unit, the clock output unit outputting an output clock signal having a duty that varies.
    • 一种占空比控制电路,包括连接到第一节点和第二节点的时钟输入单元,时钟输入单元通过第一节点接收输入时钟信号,并将第二节点的电压改变为第一电压电平和第二节点之一 响应于输入时钟信号的相应低和高逻辑电平的电压电平,连接到第二节点的转换控制器,所述转换控制器包括由相应控制信号控制的一个或多个开关,所述一个或多个开关提供第一 电压电平和第二电压电平响应于控制信号,使得第二节点处的信号的转换速率改变;以及时钟输出单元,时钟输出单元输出具有占空比的输出时钟信号 不一样。
    • 4. 发明授权
    • Method for manufacturing semiconductor device having recess gate
    • 具有凹槽的半导体器件的制造方法
    • US07723189B2
    • 2010-05-25
    • US11618565
    • 2006-12-29
    • Yong Seok EunSu Ho KimAn Bae LeeHai Won Kim
    • Yong Seok EunSu Ho KimAn Bae LeeHai Won Kim
    • H01L21/336
    • H01L29/66545H01L21/76224H01L29/66583
    • A method for manufacturing a semiconductor device having recess gates includes forming an etch stop film on a semiconductor substrate; forming an etch stop film pattern selectively exposing the semiconductor substrate by patterning the etch stop film; forming a semiconductor layer on the semiconductor substrate; forming a hard mask film pattern exposing regions, for forming trenches for recess gates, on the semiconductor substrate; removing the semiconductor layer using the hard mask film pattern as a mask until the etch stop film pattern is exposed; forming the trenches for recess gates by removing the etch stop film pattern from the semiconductor substrate; and forming gate stacks, each of which is formed in the corresponding one of the trenches for recess gates.
    • 一种用于制造具有凹槽的半导体器件的方法包括在半导体衬底上形成蚀刻停止膜; 通过图案化所述蚀刻停止膜形成选择性地暴露所述半导体衬底的蚀刻停止膜图案; 在半导体衬底上形成半导体层; 在半导体衬底上形成用于形成用于凹槽的沟槽的暴露区域的硬掩模膜图案; 使用硬掩模膜图案作为掩模去除半导体层,直到蚀刻停止膜图案被曝光; 通过从半导体衬底去除蚀刻停止膜图案来形成凹槽的沟槽; 以及形成栅极堆叠,每个栅极堆叠形成在用于凹槽的相应的一个沟槽中。
    • 6. 发明申请
    • Method for forming isolation layer of semiconductor device
    • 形成半导体器件隔离层的方法
    • US20050118786A1
    • 2005-06-02
    • US10889480
    • 2004-07-12
    • Su Ho KimYun Hyuck Ji
    • Su Ho KimYun Hyuck Ji
    • H01L21/76H01L21/762H01L29/80H01L31/112
    • H01L21/76232
    • Disclosed is a method for forming an isolation layer of a semiconductor device. The method includes the steps of providing a semiconductor substrate having a predetermined isolation region, sequentially forming a pad oxide layer and a pad nitride layer exposing the predetermined isolation region on the semiconductor substrate, forming a trench through etching the semiconductor substrate by a predetermined thickness using the pad nitride layer as a mask, forming a wall oxide layer at a side wall of the trench, sequentially forming a nitride layer and an oxide layer on a trench structure including the wall oxide layer, forming an Al2O3 layer on an entire surface of a resultant structure, planarizing the Al2O3 layer through polishing the Al2O3 layer, and forming the isolation layer by removing the pad nitride layer.
    • 公开了一种形成半导体器件隔离层的方法。 该方法包括以下步骤:提供具有预定隔离区域的半导体衬底,顺序地形成衬垫氧化物层和暴露半导体衬底上的预定隔离区域的衬垫氮化物层,通过使用 衬垫氮化物层作为掩模,在沟槽的侧壁处形成壁氧化物层,在包括壁氧化物层的沟槽结构上依次形成氮化物层和氧化物层,形成Al 2 在所得结构的整个表面上形成O 3层,通过抛光Al 2 O 3层平坦化Al 2 O 3层,以及通过去除衬垫氮化物层形成隔离层。
    • 10. 发明申请
    • Method for forming gate of semiconductor device
    • 半导体器件栅极形成方法
    • US20050136575A1
    • 2005-06-23
    • US10889483
    • 2004-07-12
    • Su Ho KimSang Ho WooYong Seok Eun
    • Su Ho KimSang Ho WooYong Seok Eun
    • H01L21/336H01L21/00H01L21/28H01L21/8234H01L21/8242H01L21/84
    • H01L21/28176H01L21/28061H01L21/823462
    • Disclosed is a method for forming a gate of a semiconductor device. The method includes the steps of forming a first oxide layer on a substrate divided into a cell area and a peripheral circuit area, forming a photoresist film pattern on a cell area, thereby exposing a surface of the first oxide layer, removing the exposed first oxide layer formed in the peripheral circuit area, and then, removing the photoresist film, forming a second oxide layer on a surface of the silicon substrate, in which the first oxide layer of the peripheral circuit area is removed, and on a first gate oxide layer of the cell area, forming a poly silicon layer on the second oxide layer, forming a tungsten silicide layer on the poly silicon layer, and sequentially patterning the tungsten silicide layer, the poly silicon layer, the second oxide layer, and the first oxide layer.
    • 公开了一种形成半导体器件的栅极的方法。 该方法包括以下步骤:在分为单元区域和外围电路区域的基板上形成第一氧化物层,在单元区域形成光致抗蚀剂图案,从而暴露第一氧化物层的表面,去除暴露的第一氧化物 在所述外围电路区域中形成的层,然后除去所述光致抗蚀剂膜,在除去所述外围电路区域的所述第一氧化物层的所述硅衬底的表面上形成第二氧化物层,并且在第一栅极氧化物层 在所述第二氧化物层上形成多晶硅层,在所述多晶硅层上形成硅化钨层,并顺序构图所述硅化钨层,所述多晶硅层,所述第二氧化物层和所述第一氧化物层 。