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1. 发明授权

US08481419B2 Method for producing a metal contact on a coated semiconductor substrate 失效
标题翻译：在涂覆的半导体衬底上制造金属接触的方法
公开(公告)号：US08481419B2
公开(公告)日：2013-07-09
申请号：US13125815
申请日：2009-11-26
申请人： Jorg Horzel , Gunnar Schubert , Stefan Dauwe , Peter Roth , Tobias Droste , Wilfried Schmidt , Ingrid Ernst
发明人： Jorg Horzel , Gunnar Schubert , Stefan Dauwe , Peter Roth , Tobias Droste , Wilfried Schmidt , Ingrid Ernst
IPC分类号： H01L21/4763
CPC分类号： H01L31/022425 , H01L31/068 , Y02E10/547
摘要： A method for producing an electrically conducting metal contact on a semiconductor component having a coating on the surface of a semiconductor substrate. In order to keep transfer resistances low while maintaining good mechanical strength, the invention proposes applying a particle-containing fluid onto the coating, where the particles contain at least metal particles and glass frits, curing the fluid while simultaneously forming metal areas in the substrate through heat treatment, removing the cured fluid and the areas of the coating covered by the fluid, and depositing, for the purposes of forming the contact without using intermediate layers, electrically conducting material from a solution onto areas of the semiconductor component in which the coating is removed while at the same time conductively connecting the metal areas present in said areas on the substrate.
摘要翻译：一种在半导体元件上制造导电金属接触的方法，该半导体元件在半导体衬底的表面上具有涂层。为了保持转印阻力低，同时保持良好的机械强度，本发明提出将含颗粒的流体施加到涂层上，其中颗粒至少含有金属颗粒和玻璃料，固化流体同时在基板中形成金属区域，通过热处理，去除固化的流体和被流体覆盖的涂层的区域，并且为了形成接触而不使用中间层，沉积，将导电材料从溶液导电到半导体组件的其中涂层是同时导电地连接存在于基板上的所述区域中的金属区域。

2. 发明申请

US20110062028A1 PROCESS AND APPARATUS FOR ELECTROPLATING SUBSTRATES 审中-公开
标题翻译：电镀基板的工艺和装置
公开(公告)号：US20110062028A1
公开(公告)日：2011-03-17
申请号：US12883551
申请日：2010-09-16
申请人： Lothar Lippert , Stefan Dauwe
发明人： Lothar Lippert , Stefan Dauwe
IPC分类号： C25D5/18 , C25B9/06
CPC分类号： C25D5/18 , C25D5/00 , C25D5/006 , C25D5/08 , C25D7/126 , C25D17/001 , C25D21/12 , H01L31/022425 , Y02E10/50
摘要： An apparatus for electroplating one or more surfaces (2,3) on one or more substrates (1), especially solar cells (1a), is described. The apparatus includes an electrochemical coating bath (13), which has a coating tank (12) filled with an electrochemical coating liquid (14). The apparatus also includes a conveying device (15) for transporting the substrate through the coating bath (13), a light source circuit (60) with light sources (64) for irradiating the substrate (1) and an electrolytic cell rectifier circuit (50) for the substrate with anodes (54). The apparatus is characterized by a device for generating synchronous current pulses and light pulses, so that during a time interval between the current pulses the irradiating of the substrate or substrates is interrupted. A process for electrochemical plating of the surface of the substrate or substrates is also described.
摘要翻译：描述了用于在一个或多个基板（1），特别是太阳能电池（1a）上电镀一个或多个表面（2,3）的装置。该设备包括电化学涂层浴（13），其具有填充有电化学涂覆液体（14）的涂料槽（12）。该设备还包括用于将衬底输送通过涂浴（13）的输送装置（15），具有用于照射衬底（1）的光源（64）和电解池整流电路（50）的光源电路（60））用于具有阳极（54）的衬底。该装置的特征在于用于产生同步电流脉冲和光脉冲的装置，使得在电流脉冲之间的时间间隔期间，中断衬底或衬底的照射。还描述了用于基板或基板的表面的电化学电镀的方法。

3. 发明申请

US20110062030A1 ELECTROLYTE COMPOSITION 审中-公开
标题翻译：电解质组合物
公开(公告)号：US20110062030A1
公开(公告)日：2011-03-17
申请号：US12878207
申请日：2010-09-09
申请人： Lothar Lippert , Stefan Dauwe
发明人： Lothar Lippert , Stefan Dauwe
IPC分类号： C25D7/12 , C25D3/02 , C25D3/10 , C25D3/12 , C25D3/20 , C25D3/38 , C25D3/46 , C25D3/54
CPC分类号： C25D3/02 , C25D3/46 , H01L31/022425 , Y02E10/50
摘要： The electrolyte composition is used in a method of depositing metals, in particular, onto substrates, especially solar cells. The electrolyte composition is particularly suitable for the deposition of metals, in particular silver, onto solar cells. The electrolyte composition is preferably free of cyanides and contains at least one metal, preferably silver, and an iminodisuccinate derivative, preferably a sodium or postassium iminodisuccinate.
摘要翻译：电解质组合物用于沉积金属，特别是沉积在基材，特别是太阳能电池上的方法。电解质组合物特别适用于将金属，特别是银沉积到太阳能电池上。电解质组合物优选不含氰化物，并且含有至少一种金属，优选银，亚氨基二琥珀酸衍生物，优选亚氨基二琥珀酸钠或钾。

4. 发明授权

US08148195B2 Process for producing a contact area of an electronic component 有权
标题翻译：一种电子部件的接触区域的制造方法
公开(公告)号：US08148195B2
公开(公告)日：2012-04-03
申请号：US12880198
申请日：2010-09-13
申请人： Axel Metz , Stefan Bagus , Stefan Dauwe , Tobias Droste , Peter Roth , Andreas Teppe
发明人： Axel Metz , Stefan Bagus , Stefan Dauwe , Tobias Droste , Peter Roth , Andreas Teppe
IPC分类号： H01L21/00
CPC分类号： H01L31/186 , H01L21/268 , H01L24/03 , H01L24/05 , H01L31/022425 , H01L2224/05073 , H01L2224/05624 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/0106 , H01L2924/01068 , H01L2924/0107 , H01L2924/01075 , H01L2924/01077 , H01L2924/01079 , H01L2924/01322 , H01L2924/014 , Y02E10/50 , Y02P70/521
摘要： A process for forming at least one local contact area of a substrate of an electrical component for contacting the contact area with a connector, in which the substrate, on the contact side, is provided with a sintered porous metal layer. To make available a mechanically durable, electrically faultless solderable contact area, it is proposed that the porous layer be compacted and/or removed in the contact area to be formed.
摘要翻译：一种用于形成电气部件的基板的至少一个局部接触区域的方法，用于使接触区域与连接器接触，其中在接触侧上的基板设置有烧结的多孔金属层。为了提供机械耐久的，电气故障的可焊接接触区域，建议多孔层在要形成的接触区域中压实和/或去除。

5. 发明申请

US20110201196A1 METHOD FOR PRODUCING A METAL CONTACT ON A SEMICONDUCTOR SUBSTRATE PROVIDED WITH A COATING 失效
标题翻译：在用涂料提供的半导体衬底上生产金属接触的方法
公开(公告)号：US20110201196A1
公开(公告)日：2011-08-18
申请号：US13125815
申请日：2009-11-26
申请人： Jorg Horzel , Gunnar Schubert , Stefan Dauwe , Peter Roth , Tobias Droste , Wilfried Schmidt , Ingrid Ernst
发明人： Jorg Horzel , Gunnar Schubert , Stefan Dauwe , Peter Roth , Tobias Droste , Wilfried Schmidt , Ingrid Ernst
IPC分类号： H01L21/288
CPC分类号： H01L31/022425 , H01L31/068 , Y02E10/547
摘要： A method for producing an electrically conducting metal contact on a semiconductor component having a coating on the surface of a semiconductor substrate. In order to keep transfer resistances low while maintaining good mechanical strength, the invention proposes applying a particle-containing fluid onto the coating, where the particles contain at least metal particles and glass frits, curing the fluid while simultaneously forming metal areas in the substrate through heat treatment, removing the cured fluid and the areas of the coating covered by the fluid, and depositing, for the purposes of forming the contact without using intermediate layers, electrically conducting material from a solution onto areas of the semiconductor component in which the coating is removed while at the same time conductively connecting the metal areas present in said areas on the substrate.
摘要翻译：一种在具有在半导体衬底的表面上具有涂层的半导体部件上制造导电金属接触的方法。为了保持转印阻力低，同时保持良好的机械强度，本发明提出将含颗粒的流体施加到涂层上，其中颗粒至少含有金属颗粒和玻璃料，固化流体同时在基板中形成金属区域，通过热处理，去除固化的流体和被流体覆盖的涂层的区域，并且为了形成接触而不使用中间层，沉积，将导电材料从溶液导电到半导体组件的其中涂层是同时导电地连接存在于基板上的所述区域中的金属区域。

6. 发明申请

US20110065231A1 PROCESS FOR PRODUCING A CONTACT AREA OF AN ELECTRONIC COMPONENT 有权
标题翻译：生产电子元件接触面的方法
公开(公告)号：US20110065231A1
公开(公告)日：2011-03-17
申请号：US12880198
申请日：2010-09-13
申请人： Axel METZ , Stefan BAGUS , Stefan DAUWE , Tobias DROSTE , Peter ROTH , Andreas TEPPE
发明人： Axel METZ , Stefan BAGUS , Stefan DAUWE , Tobias DROSTE , Peter ROTH , Andreas TEPPE
IPC分类号： H01L21/28
CPC分类号： H01L31/186 , H01L21/268 , H01L24/03 , H01L24/05 , H01L31/022425 , H01L2224/05073 , H01L2224/05624 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/0106 , H01L2924/01068 , H01L2924/0107 , H01L2924/01075 , H01L2924/01077 , H01L2924/01079 , H01L2924/01322 , H01L2924/014 , Y02E10/50 , Y02P70/521
摘要： A process for forming at least one local contact area of a substrate of an electrical component for contacting the contact area with a connector, in which the substrate, on the contact side, is provided with a sintered porous metal layer. To make available a mechanically durable, electrically faultless solderable contact area, it is proposed that the porous layer be compacted and/or removed in the contact area to be formed.
摘要翻译：一种用于形成电气部件的基板的至少一个局部接触区域的方法，用于使接触区域与连接器接触，其中在接触侧上的基板设置有烧结的多孔金属层。为了提供机械耐久的，电气故障的可焊接接触区域，建议多孔层在要形成的接触区域中压实和/或去除。

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