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    • 1. 发明申请
    • PROCESS AND APPARATUS FOR ELECTROPLATING SUBSTRATES
    • 电镀基板的工艺和装置
    • US20110062028A1
    • 2011-03-17
    • US12883551
    • 2010-09-16
    • Lothar LippertStefan Dauwe
    • Lothar LippertStefan Dauwe
    • C25D5/18C25B9/06
    • C25D5/18C25D5/00C25D5/006C25D5/08C25D7/126C25D17/001C25D21/12H01L31/022425Y02E10/50
    • An apparatus for electroplating one or more surfaces (2,3) on one or more substrates (1), especially solar cells (1a), is described. The apparatus includes an electrochemical coating bath (13), which has a coating tank (12) filled with an electrochemical coating liquid (14). The apparatus also includes a conveying device (15) for transporting the substrate through the coating bath (13), a light source circuit (60) with light sources (64) for irradiating the substrate (1) and an electrolytic cell rectifier circuit (50) for the substrate with anodes (54). The apparatus is characterized by a device for generating synchronous current pulses and light pulses, so that during a time interval between the current pulses the irradiating of the substrate or substrates is interrupted. A process for electrochemical plating of the surface of the substrate or substrates is also described.
    • 描述了用于在一个或多个基板(1),特别是太阳能电池(1a)上电镀一个或多个表面(2,3)的装置。 该设备包括电化学涂层浴(13),其具有填充有电化学涂覆液体(14)的涂料槽(12)。 该设备还包括用于将衬底输送通过涂浴(13)的输送装置(15),具有用于照射衬底(1)的光源(64)和电解池整流电路(50)的光源电路(60) )用于具有阳极(54)的衬底。 该装置的特征在于用于产生同步电流脉冲和光脉冲的装置,使得在电流脉冲之间的时间间隔期间,中断衬底或衬底的照射。 还描述了用于基板或基板的表面的电化学电镀的方法。