专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08133823B2 Method for picking up semiconductor chips from a wafer table and method for mounting semiconductor chips on a substrate 有权
标题翻译：从晶片台拾取半导体芯片的方法以及将半导体芯片安装在基板上的方法
公开(公告)号：US08133823B2
公开(公告)日：2012-03-13
申请号：US12247986
申请日：2008-10-08
申请人： Stefan Behler , Patrick Blessing
发明人： Stefan Behler , Patrick Blessing
IPC分类号： H01L21/98
CPC分类号： G05B19/4015 , G05B2219/37619 , G05B2219/39022 , G05B2219/39041 , G05B2219/45029 , G05B2219/45063 , G05B2219/49206 , G05B2219/50023 , H01L21/67144 , H01L21/67276 , H01L21/681 , H01L22/12
摘要： The invention relates to a method for picking up semiconductor chips from a wafer table and, optionally, their mounting on a substrate by means of a pick-and-place system. The position and orientation of the semiconductor chip to be mounted next are determined by means of a first camera and made available in the form of positional data relating to a first system of coordinates. The position and orientation of the substrate place on which the semiconductor chip will be mounted are determined by means of a second camera and made available in the form of positional data relating to a second system of coordinates. The conversion of coordinates of the first or second system of coordinates into coordinates of motion of the pick-and-place system occurs by means of two fixed mapping functions and two changeable correction vectors. The correction vectors are readjusted on the occurrence of a predetermined event.
摘要翻译：本发明涉及一种用于从晶片台拾取半导体芯片的方法，并且可选地，通过拾取和放置系统将其安装在基板上。接下来要安装的半导体芯片的位置和取向通过第一相机确定，并以与第一坐标系相关的位置数据的形式提供。通过第二相机确定半导体芯片将要安装的基板位置的位置和取向，并以与第二坐标系相关的位置数据的形式提供。通过两个固定映射函数和两个可更改的校正向量，将第一或第二坐标系坐标转换为拾取和放置系统的运动坐标。在发生预定事件时重新调整校正矢量。

2. 发明申请

US20100315655A1 Method And Device For Measuring A Height Difference 审中-公开
标题翻译：测量高差的方法和装置
公开(公告)号：US20100315655A1
公开(公告)日：2010-12-16
申请号：US12518098
申请日：2007-11-19
申请人： Stefan Behler , Patrick Blessing , Stephan Scholze , Roland Stalder , Martin Von Arx
发明人： Stefan Behler , Patrick Blessing , Stephan Scholze , Roland Stalder , Martin Von Arx
IPC分类号： G01B11/02
CPC分类号： G01B11/0608
摘要： Determination of the height difference between a first reference point and a second reference point, at least one of the two reference points lying on a semiconductor chip, which is mounted on a substrate, comprises the stepsA) recording a first image from a first direction, which runs diagonally to the surface of the substrate at a predetermined angle α2, the substrate and the semiconductor chip being illuminated from a second direction which runs diagonally to the surface of the substrate at a predetermined angle α3, a telecentric optics being located in the beam path, B) recording a second image from the second direction, the substrate and the semiconductor chip being illuminated from the first direction, either the cited telecentric optics or a further telecentric optics being located in the beam path, C) ascertaining a first coordinate of the position of the first reference point and a first coordinate of the position of the second reference point in the first image and determining a first difference between these two coordinates, D) ascertaining a first coordinate of the position of the first reference point and a first coordinate of the position of the second reference point in the second image and determining a second difference between these two coordinates, and E) calculating the height difference from the first difference and the second difference.
摘要翻译：确定第一参考点和第二参考点之间的高度差，位于安装在基板上的半导体芯片上的两个参考点中的至少一个包括以下步骤：A）从第一方向，其以预定角度α2对角地延伸到基板的表面，基板和半导体芯片从以基板的表面以预定角度α3斜对角地延伸的第二方向照射，远心光学器件位于 B）从所述第二方向记录第二图像，所述衬底和所述半导体芯片从所述第一方向被照射，所述远心光学器件或另外的远心光学器件位于所述光束路径中，C）确定第一坐标的第一参考点的位置和第二参考点在第一图像和确定中的位置的第一坐标确定这两个坐标之间的第一差异，D）确定第一参考点的位置的第一坐标和第二图像中的第二参考点的位置的第一坐标，并确定这两个坐标之间的第二差，以及 E）计算与第一差异和第二差异的高度差。

3. 发明授权

US08715457B2 Method for detaching and removing a semiconductor chip from a foil 有权
标题翻译：从箔片上分离和去除半导体芯片的方法
公开(公告)号：US08715457B2
公开(公告)日：2014-05-06
申请号：US13128864
申请日：2009-11-03
申请人： Stefan Behler
发明人： Stefan Behler
IPC分类号： B32B38/10
CPC分类号： H01L21/67132
摘要： The detachment and removal of a semiconductor chip from a foil occurs in accordance with the invention in three phases. In the first phase there is a partial detachment of the semiconductor chip from the foil with mechanical means, but without the participation of a chip gripper. In the second phase the semiconductor chip is further detached from the foil, with the semiconductor chip being held by the chip gripper. In the third phase the chip gripper is lifted and moved away.
摘要翻译：根据本发明，从箔片中剥离和除去半导体芯片分三个阶段。在第一阶段中，半导体芯片与机械装置的箔部分脱离，但是没有芯片夹持器的参与。在第二阶段，半导体芯片进一步与箔分离，半导体芯片由芯片夹持器保持。在第三阶段，芯片夹持器被提起并移开。

4. 发明申请

US20090098667A1 Method For Picking Up Semiconductor Chips From A Wafer Table And Method For Mounting Semiconductor Chips On A Substrate 有权
标题翻译：从晶圆表拾取半导体芯片的方法以及在基板上安装半导体芯片的方法
公开(公告)号：US20090098667A1
公开(公告)日：2009-04-16
申请号：US12247986
申请日：2008-10-08
申请人： Stefan Behler , Patrick Blessing
发明人： Stefan Behler , Patrick Blessing
IPC分类号： H01L21/66
CPC分类号： G05B19/4015 , G05B2219/37619 , G05B2219/39022 , G05B2219/39041 , G05B2219/45029 , G05B2219/45063 , G05B2219/49206 , G05B2219/50023 , H01L21/67144 , H01L21/67276 , H01L21/681 , H01L22/12
摘要： The invention relates to a method for picking up semiconductor chips from a wafer table and, optionally, their mounting on a substrate by means of a pick-and-place system. The position and orientation of the semiconductor chip to be mounted next are determined by means of a first camera and made available in the form of positional data relating to a first system of coordinates. The position and orientation of the substrate place on which the semiconductor chip will be mounted are determined by means of a second camera and made available in the form of positional data relating to a second system of coordinates. The conversion of coordinates of the first or second system of coordinates into coordinates of motion of the pick-and-place system occurs by means of two fixed mapping functions and two changeable correction vectors. The correction vectors are readjusted on the occurrence of a predetermined event.
摘要翻译：本发明涉及一种用于从晶片台拾取半导体芯片的方法，并且可选地，通过拾取和放置系统将其安装在基板上。接下来要安装的半导体芯片的位置和取向通过第一相机确定，并以与第一坐标系相关的位置数据的形式提供。通过第二相机确定半导体芯片将要安装的基板位置的位置和取向，并以与第二坐标系相关的位置数据的形式提供。通过两个固定映射函数和两个可更改的校正向量，将第一或第二坐标系坐标转换为拾取和放置系统的运动坐标。在发生预定事件时重新调整校正矢量。

5. 发明授权

US06435492B1 Die bonder and/or wire bonder with a suction device for pulling flat and holding down a curved substrate 失效
标题翻译：模具接合器和/或引线接合器，其具有用于拉平并拉紧弯曲基板的抽吸装置
公开(公告)号：US06435492B1
公开(公告)日：2002-08-20
申请号：US09732678
申请日：2000-12-08
申请人： Stefan Behler , Reto Schubiger , Beat Zumbuehl
发明人： Stefan Behler , Reto Schubiger , Beat Zumbuehl
IPC分类号： B25B1100
CPC分类号： B25B11/005 , H01L21/67138 , H01L21/67144 , H01L21/6835 , H01L21/6838 , H01L24/80 , H01L2924/01005 , H01L2924/01033 , H01L2924/01082 , H01L2924/19043 , H05K13/0069
摘要： A Die Bonder or Wire Bonder has a suction device for pulling flat and holding down a curved substrate equipped with or to be equipped with a semiconductor chip onto a supporting surface of a plate. The plate contains at least one cavity open towards the supporting surface in which there is a vacuum gripper made out of flexible material, whereby the vacuum gripper is lowerable into the cavity during transport of the substrate and which is raisable above the level of the supporting surface to apply suction to the substrate.
摘要翻译：芯片焊接机或导线焊接机具有用于拉平平板的抽吸装置，并将装有半导体芯片的弯曲基板保持在板的支撑表面上。该板包含至少一个朝向支撑表面开口的空腔，在该空间中存在由柔性材料制成的真空夹持器，由此真空夹持器在输送基板期间可以降低到空腔中，并且可升高到支撑表面的高度之上以向基板施加吸力。

6. 发明申请

US20110214819A1 Method For Detaching And Removing A Semiconductor Chip From A Foil 有权
标题翻译：从铝箔剥离和去除半导体芯片的方法
公开(公告)号：US20110214819A1
公开(公告)日：2011-09-08
申请号：US13128864
申请日：2009-11-03
申请人： Stefan Behler
发明人： Stefan Behler
IPC分类号： H01L21/301
CPC分类号： H01L21/67132
摘要： The detachment and removal of a semiconductor chip from a foil occurs in accordance with the invention in three phases. In the first phase there is a partial detachment of the semiconductor chip from the foil with mechanical means, but without the participation of a chip gripper. In the second phase the semiconductor chip is further detached from the foil, with the semiconductor chip being held by the chip gripper. In the third phase the chip gripper is lifted and moved away.
摘要翻译：根据本发明，从箔片中剥离和除去半导体芯片分三个阶段。在第一阶段中，半导体芯片与机械装置的箔部分脱离，但是没有芯片夹持器的参与。在第二阶段，半导体芯片进一步与箔分离，半导体芯片由芯片夹持器保持。在第三阶段，芯片夹持器被提起并移开。

7. 发明授权

US07066373B2 Method for aligning the bondhead of a Die Bonder 失效
标题翻译：用于对准芯片焊接机的焊接头的方法
公开(公告)号：US07066373B2
公开(公告)日：2006-06-27
申请号：US10937991
申请日：2004-09-10
申请人： Stefan Behler
发明人： Stefan Behler
IPC分类号： B23K31/02
CPC分类号： H01L21/67144 , H01L21/68 , H01L21/681 , H01L24/75 , H05K13/0413 , H05K13/0815
摘要： In order to eliminate the inclination of a semiconductor chip picked by a gripper, the height of at least three points on the underneath of the semiconductor chip is determined in relation to a reference surface and from this the inclination is calculated. Determining the heights takes place in that the semiconductor chip is lowered until the semiconductor chip comes into contact with a needle.
摘要翻译：为了消除由夹持器拾取的半导体芯片的倾斜度，相对于参考表面确定半导体芯片的下面的至少三个点的高度，并且由此计算倾斜度。确定高度是因为半导体芯片被降低直到半导体芯片与针接触。

8. 发明申请

US20050061852A1 Method for aligning the bondhead of a die bonder 失效
标题翻译：用于对准管芯接合器的焊接头的方法
公开(公告)号：US20050061852A1
公开(公告)日：2005-03-24
申请号：US10937991
申请日：2004-09-10
申请人： Stefan Behler
发明人： Stefan Behler
IPC分类号： H01L21/52 , B23K1/00 , H01L21/00 , H01L21/50 , H01L21/58 , H01L21/60 , H01L21/68 , H05K13/04
CPC分类号： H01L21/67144 , H01L21/68 , H01L21/681 , H01L24/75 , H05K13/0413 , H05K13/0815
摘要： In order to eliminate the inclination of a semiconductor chip picked by a gripper, the height of at least three points on the underneath of the semiconductor chip is determined in relation to a reference surface and from this the inclination is calculated. Determining the heights takes place in that the semiconductor chip is lowered until the semiconductor chip comes into contact with a needle.
摘要翻译：为了消除由夹持器拾取的半导体芯片的倾斜度，相对于参考表面确定半导体芯片的下面的至少三个点的高度，并且由此计算倾斜度。确定高度是因为半导体芯片被降低直到半导体芯片与针接触。

9. 发明授权

US06585145B2 Die bonder and/or wire bonder with a device for holding down a substrate 失效
公开(公告)号：US06585145B2
公开(公告)日：2003-07-01
申请号：US10006201
申请日：2001-12-04
申请人： Stefan Behler , Beat Zumbuehl , Reto Schubiger , Ruedi Grueter , Rolf Schuermann
发明人： Stefan Behler , Beat Zumbuehl , Reto Schubiger , Ruedi Grueter , Rolf Schuermann
IPC分类号： B25B1100
CPC分类号： B23K37/0426 , B23K2101/40 , H01L2924/0002 , H01L2924/00
摘要： A Die Bonder or a Wire Bonder contains a device for holding down a substrate. The device comprises a table with drill holes. The drill holes are mechanically programmable with regard to whether vacuum can be applied to them or not. The mechanical programming enables a fast and easy adaptation of the device to different substrates.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式