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1. 发明授权

US06585145B2 Die bonder and/or wire bonder with a device for holding down a substrate 失效
公开(公告)号：US06585145B2
公开(公告)日：2003-07-01
申请号：US10006201
申请日：2001-12-04
申请人： Stefan Behler , Beat Zumbuehl , Reto Schubiger , Ruedi Grueter , Rolf Schuermann
发明人： Stefan Behler , Beat Zumbuehl , Reto Schubiger , Ruedi Grueter , Rolf Schuermann
IPC分类号： B25B1100
CPC分类号： B23K37/0426 , B23K2101/40 , H01L2924/0002 , H01L2924/00
摘要： A Die Bonder or a Wire Bonder contains a device for holding down a substrate. The device comprises a table with drill holes. The drill holes are mechanically programmable with regard to whether vacuum can be applied to them or not. The mechanical programming enables a fast and easy adaptation of the device to different substrates.

2. 发明授权

US06435492B1 Die bonder and/or wire bonder with a suction device for pulling flat and holding down a curved substrate 失效
标题翻译：模具接合器和/或引线接合器，其具有用于拉平并拉紧弯曲基板的抽吸装置
公开(公告)号：US06435492B1
公开(公告)日：2002-08-20
申请号：US09732678
申请日：2000-12-08
申请人： Stefan Behler , Reto Schubiger , Beat Zumbuehl
发明人： Stefan Behler , Reto Schubiger , Beat Zumbuehl
IPC分类号： B25B1100
CPC分类号： B25B11/005 , H01L21/67138 , H01L21/67144 , H01L21/6835 , H01L21/6838 , H01L24/80 , H01L2924/01005 , H01L2924/01033 , H01L2924/01082 , H01L2924/19043 , H05K13/0069
摘要： A Die Bonder or Wire Bonder has a suction device for pulling flat and holding down a curved substrate equipped with or to be equipped with a semiconductor chip onto a supporting surface of a plate. The plate contains at least one cavity open towards the supporting surface in which there is a vacuum gripper made out of flexible material, whereby the vacuum gripper is lowerable into the cavity during transport of the substrate and which is raisable above the level of the supporting surface to apply suction to the substrate.
摘要翻译：芯片焊接机或导线焊接机具有用于拉平平板的抽吸装置，并将装有半导体芯片的弯曲基板保持在板的支撑表面上。该板包含至少一个朝向支撑表面开口的空腔，在该空间中存在由柔性材料制成的真空夹持器，由此真空夹持器在输送基板期间可以降低到空腔中，并且可升高到支撑表面的高度之上以向基板施加吸力。

3. 发明授权

US06898481B2 Apparatus for mounting semiconductor chips 失效
标题翻译：用于安装半导体芯片的装置
公开(公告)号：US06898481B2
公开(公告)日：2005-05-24
申请号：US10389722
申请日：2003-03-13
申请人： Eugen Mannhart , Reto Schubiger
发明人： Eugen Mannhart , Reto Schubiger
IPC分类号： H01L21/00 , G06F7/00
CPC分类号： H01L21/67271 , H01L21/67259 , Y10T29/41
摘要： An apparatus for mounting semiconductor chips comprises a loading station for the presentation of substrates, a first transport system and a second transport system. The first transport system removes one substrate after the other from the loading station and passes them on to the second transport system which transports the substrates in steps to a dispensing or soldering station and to a bonding station. A sensor with two coils arranged at a distance to one another is arranged in such a way that one end of the substrate transported by the first transport system travels through a gap formed between the two coils. The signal delivered by the sensor is used to determine a control signal which indicates whether or not the first transport system should pass the substrate on to the second transport system.
摘要翻译：用于安装半导体芯片的装置包括用于呈现衬底的装载站，第一传送系统和第二传送系统。第一运输系统从装载站中将一个基板相继地移除，并将它们传递到第二运输系统，该第二运输系统将基板逐步运输到分配或焊接站和粘合站。布置有彼此间隔一定距离的两个线圈的传感器被布置成使得由第一传送系统传送的基板的一端穿过形成在两个线圈之间的间隙。由传感器传递的信号用于确定控制信号，该控制信号指示第一传输系统是否应将衬底通过第二传输系统。

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