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1. 发明申请

US20140002990A1 THERMAL MANAGEMENT IN OPTICAL AND ELECTRONIC DEVICES 有权
标题翻译：光学和电子设备的热管理
公开(公告)号：US20140002990A1
公开(公告)日：2014-01-02
申请号：US13538746
申请日：2012-06-29
申请人： Rajdeep Sharma , Stanton Earl Weaver, JR.
发明人： Rajdeep Sharma , Stanton Earl Weaver, JR.
IPC分类号： H05K7/20 , F28D15/00
CPC分类号： F21V29/76 , F21K9/23 , F21K9/238 , F21V23/004 , F21V23/006 , F21V29/74
摘要： A thermal management system for electronic devices is provided. The thermal management system includes a plurality of synthetic jets provided in a stacked arrangement and separated by respective spacers within the stacked arrangement. The stack of synthetic jets may be used to facilitate airflow in the thermal management system, such as to facilitate air flow over a heat sink in one implementation.
摘要翻译：提供了一种用于电子设备的热管理系统。热管理系统包括以层叠的方式设置的多个合成射流，并且在堆叠结构内由相应的间隔件隔开。合成射流的堆叠可以用于促进热管理系统中的气流，例如在一个实施方案中促进空气流过散热器。

2. 发明申请

US20130170142A1 HEAT EXCHANGE ASSEMBLY FOR USE WITH ELECTRICAL DEVICES AND METHODS OF ASSEMBLING AN ELECTRICAL DEVICE 有权
标题翻译：与电气设备一起使用的热交换器组件和组装电气设备的方法
公开(公告)号：US20130170142A1
公开(公告)日：2013-07-04
申请号：US13340309
申请日：2011-12-29
申请人： Stanton Earl Weaver, JR. , Tao Deng , Hendrik Pieter Jacobus de Bock , Shakti Singh Chauhan
发明人： Stanton Earl Weaver, JR. , Tao Deng , Hendrik Pieter Jacobus de Bock , Shakti Singh Chauhan
IPC分类号： H05K7/20 , H05K13/00 , F28F9/00
CPC分类号： H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： An electrical device is described herein. The electrical device includes a housing that includes an inner surface that defines a cavity, a heat sink that is coupled to the housing and oriented along a first plane, and at least one electrical component positioned within the housing cavity and oriented along a second plane that is different than the first plane. A heat exchange assembly is coupled to the electrical component and the heat sink for adjusting a temperature of the electrical component. The heat exchange assembly includes an evaporator section, a condenser section, and a transport section extending between the evaporator section and the condenser section for channeling a working fluid between the evaporator section and the condenser section. The heat exchange assembly is configured to bend along at least one bending axis oriented with respect to the transport section.
摘要翻译：这里描述了一种电气设备。电气设备包括壳体，其包括限定空腔的内表面，联接到壳体并沿着第一平面定向的散热器，以及定位在壳体空腔内并沿着第二平面定向的至少一个电气部件，与第一架飞机不同。热交换组件耦合到电气部件和散热器，用于调节电气部件的温度。热交换组件包括蒸发器部分，冷凝器部分和在蒸发器部分和冷凝器部分之间延伸的输送部分，用于在蒸发器部分和冷凝器部分之间引导工作流体。热交换组件构造成沿着相对于输送部分定向的至少一个弯曲轴线弯曲。

3. 发明授权

US07431479B2 LED lighting system with reflective board 有权
标题翻译： LED照明系统带反光板
公开(公告)号：US07431479B2
公开(公告)日：2008-10-07
申请号：US11725410
申请日：2007-03-19
申请人： Stanton Earl Weaver, Jr. , Thomas Elliot Stecher
发明人： Stanton Earl Weaver, Jr. , Thomas Elliot Stecher
IPC分类号： F21V7/00
CPC分类号： H05K1/181 , F21K9/00 , H01L25/0753 , H01L2924/0002 , H01S5/005 , H01S5/02216 , H01S5/02292 , H01S5/4025 , H05K1/0274 , H05K2201/0195 , H05K2201/0209 , H05K2201/2054 , Y02P70/611 , Y10S362/80 , H01L2924/00
摘要： A light emitting apparatus (8) includes one or more light emitting chips (10) that are disposed on a printed circuit board (12) and emit light predominantly in a wavelength range between about 400 nanometers and about 470 nanometers. The printed circuit board includes: (i) an electrically insulating board (14); (ii) electrically conductive printed circuitry (20); and (iii) an electrically insulating solder mask (22) having vias (24) through which the one or more light emitting chips electrically contact the printed circuitry. The solder mask (22) has a reflectance of greater than 60% at least between about 400 nanometers and about 470 nanometers.
摘要翻译：发光装置（8）包括设置在印刷电路板（12）上的一个或多个发光芯片（10），并且发射主要在约400纳米至约470纳米的波长范围内。印刷电路板包括：（i）电绝缘板（14）; （ii）导电印刷电路（20）; 和（iii）具有通孔（24）的电绝缘的焊接掩模（22），所述一个或多个发光芯片通过该通孔与印刷电路电接触。焊料掩模（22）具有大于60％的反射率，至少在约400纳米和约470纳米之间。

4. 发明申请

US20160186979A1 EFFICIENT COOLING OF LASERS, LED AND PHOTONICS DEVICES 审中-公开
标题翻译：激光，LED和光电器件的有效冷却
公开(公告)号：US20160186979A1
公开(公告)日：2016-06-30
申请号：US15062823
申请日：2016-03-07
申请人： Mehmet Arik , Stanton Earl Weaver, JR.
发明人： Mehmet Arik , Stanton Earl Weaver, JR.
IPC分类号： F21V29/58 , H01L33/48 , H01L33/50 , H01L33/62 , F21V29/74 , H01L33/64
CPC分类号： F21V29/59 , C09K5/10 , F21K9/23 , F21V29/58 , F21V29/74 , F21Y2101/02 , F21Y2115/10 , F21Y2115/30 , F28D15/00 , H01L33/486 , H01L33/507 , H01L33/56 , H01L33/62 , H01L33/644 , H01L33/648 , H01L2224/48091 , H01L2933/0075 , Y02P20/124 , H01L2924/00014
摘要： The present invention provides an optoelectronic device comprising a heat source and a heat transfer fluid. The present invention also provides a method of preparing an optoelectronic device, which comprises (i) providing a heat source, and (ii) filling a space in the vicinity of the heat source with a heat transfer liquid. The optoelectronic device has gained technical merits such as improved heat removing efficiency, lower chip/junction temperature, increased lumen output, longer operational lifetime, and better reliability, among others.
摘要翻译：本发明提供一种包括热源和传热流体的光电子器件。本发明还提供一种制备光电子器件的方法，其包括（i）提供热源，和（ii）用热传递液体填充热源附近的空间。光电子器件获得了诸如提高散热效率，降低芯片/结温，增加流明输出，延长使用寿命和更好的可靠性等技术优点。

5. 发明授权

US09194575B2 Thermal management in optical and electronic devices 有权
标题翻译：光学和电子设备的热管理
公开(公告)号：US09194575B2
公开(公告)日：2015-11-24
申请号：US13538746
申请日：2012-06-29
申请人： Rajdeep Sharma , Stanton Earl Weaver, Jr.
发明人： Rajdeep Sharma , Stanton Earl Weaver, Jr.
IPC分类号： H05K7/20 , F21V29/76 , F21V23/00 , F21K99/00 , F21V29/74
CPC分类号： F21V29/76 , F21K9/23 , F21K9/238 , F21V23/004 , F21V23/006 , F21V29/74
摘要： A thermal management system for electronic devices is provided. The thermal management system includes a plurality of synthetic jets provided in a stacked arrangement and separated by respective spacers within the stacked arrangement. The stack of synthetic jets may be used to facilitate airflow in the thermal management system, such as to facilitate air flow over a heat sink in one implementation.
摘要翻译：提供了一种用于电子设备的热管理系统。热管理系统包括以层叠的方式设置的多个合成射流，并且在堆叠结构内由相应的间隔件隔开。合成射流的堆叠可以用于促进热管理系统中的气流，例如在一个实施方案中促进空气流过散热器。

6. 发明授权

US08496049B2 Heat sinks with distributed and integrated jet cooling 有权
标题翻译：散热器采用分布式和集成式喷射冷却
公开(公告)号：US08496049B2
公开(公告)日：2013-07-30
申请号：US12421068
申请日：2009-04-09
申请人： Mehmet Arik , Tunc Icoz , Juan Manuel Rivas Davila , Charles Erklin Seeley , Yogen Vishwas Utturkar , Stanton Earl Weaver, Jr.
发明人： Mehmet Arik , Tunc Icoz , Juan Manuel Rivas Davila , Charles Erklin Seeley , Yogen Vishwas Utturkar , Stanton Earl Weaver, Jr.
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink with distributed jet cooling is provided. The heat sink includes a base for thermal connection to at least one heated object, an array of fins thermally coupled to the base, and at least one multi-orifice synthetic jet or multiple single orifice jets disposed on a side of the array of fins. A heat sink with distributed and integrated jet cooling is also provided and includes a base and an array of fins. Respective ones of at least a subset of the fins comprise a synthetic jet configured to eject an ambient fluid into an ambient environment of the fins and base. Another heat sink with distributed and integrated jet cooling is provided and includes a base, an array of fins and multiple synthetic jets coupled to respective ones of the fins. The synthetic jets are provided for at least a subset of the fins.
摘要翻译：提供分布式喷射冷却的散热器。散热器包括用于热连接到至少一个被加热物体的基座，热耦合到基座的翅片阵列，以及设置在翅片阵列侧面的至少一个多孔合成射流或多个单孔射流。还提供了具有分布式和集成式射流冷却的散热器，并且包括底座和翅片阵列。翅片的至少一个子集中的各个翼片包括配置成将周围流体喷射到翅片和底座的周围环境中的合成射流。提供了具有分布式和集成的喷射式冷却的另一散热器，并且包括底座，翅片阵列和耦合到相应散热片的多个合成射流。合成射流被提供用于鳍的至少一个子集。

7. 发明授权

US08364427B2 Flow sensor assemblies 失效
标题翻译：流量传感器组件
公开(公告)号：US08364427B2
公开(公告)日：2013-01-29
申请号：US12683474
申请日：2010-01-07
申请人： Ertugrul Berkcan , Shankar Chandrasekaran , Bo Li , Stanton Earl Weaver, Jr.
发明人： Ertugrul Berkcan , Shankar Chandrasekaran , Bo Li , Stanton Earl Weaver, Jr.
IPC分类号： G01F1/00
CPC分类号： G01F1/66 , G01F1/712
摘要： A flow sensor assembly is provided and includes a flow conduit configured to impart a disturbance to a flow, multiple sensors disposed at respective sensing locations along the flow conduit. Each sensor is responsive to the disturbance of the flow and generates a corresponding response signal. The flow sensor assembly further includes a processor operably connected to each sensor, the processor being configured to compute a cross-correlation function between the response signals generated by said sensors, and determine a flow rate and a direction for the flow through the conduit based on the computed cross-correlation function. Additional flow sensor assembly arrangements are also disclosed.
摘要翻译：提供了一种流量传感器组件，并且包括配置成对流动造成干扰的流动管道，设置在沿着流动管道的各个感测位置处的多个传感器。每个传感器响应于流动的干扰并产生相应的响应信号。所述流量传感器组件还包括可操作地连接到每个传感器的处理器，所述处理器被配置为计算由所述传感器产生的所述响应信号之间的互相关函数，并且基于所述传感器确定流速和通过所述导管的流动的方向计算的互相关函数。还公开了附加的流量传感器组件装置。

8. 发明申请

US20110162823A1 METHOD AND APPARATUS FOR REMOVING HEAT FROM ELECTRONIC DEVICES USING SYNTHETIC JETS 有权
标题翻译：使用合成喷嘴从电子设备中除去热量的方法和装置
公开(公告)号：US20110162823A1
公开(公告)日：2011-07-07
申请号：US12683826
申请日：2010-01-07
申请人： Rajdeep Sharma , Stanton Earl Weaver, JR. , Charles Erklin Seeley , Mehmet Arik , Tunc Icoz , Charles Franklin Wolfe, JR. , Yogen Vishwas Utturkar
发明人： Rajdeep Sharma , Stanton Earl Weaver, JR. , Charles Erklin Seeley , Mehmet Arik , Tunc Icoz , Charles Franklin Wolfe, JR. , Yogen Vishwas Utturkar
IPC分类号： F28D15/00 , F28F7/00 , F28F13/12 , B21D53/02
CPC分类号： H05K7/20154 , F21K9/23 , F21V29/507 , F21V29/63 , F21V29/83 , F21Y2115/10 , H01L23/467 , H01L2924/0002 , H05K7/20172 , H05K7/20409 , Y10T29/4935 , H01L2924/00
摘要： An apparatus for removing heat comprises a heat sink having a cavity, and a synthetic jet stack comprising at least one synthetic jet mounted within the cavity. At least one rod and at least one engaging structure to provide a rigid positioning of the at least one synthetic jet with respect to the at least one rod. The synthetic jet comprises at least one orifice through which a fluid is ejected.
摘要翻译：一种用于去除热量的装置包括具有空腔的散热器和包括安装在该空腔内的至少一个合成射流的合成喷射叠层。至少一个杆和至少一个接合结构，以提供至少一个合成射流相对于至少一个杆的刚性定位。合成射流包括至少一个孔口，流体被喷射通过该孔口。

9. 发明授权

US07969734B2 Unique cooling scheme for advanced thermal management of high flux electronics 有权
标题翻译：独特的冷却方案，用于高通量电子器件的高级热管理
公开(公告)号：US07969734B2
公开(公告)日：2011-06-28
申请号：US11649173
申请日：2007-01-03
申请人： Mehmet Arik , Chellappa Balan , Todd Garrett Wetzel , Stephen Adam Solovitz , Charles Max Byrd , Stanton Earl Weaver, Jr.
发明人： Mehmet Arik , Chellappa Balan , Todd Garrett Wetzel , Stephen Adam Solovitz , Charles Max Byrd , Stanton Earl Weaver, Jr.
IPC分类号： H05K7/20
CPC分类号： F28F3/04 , F04B43/04 , F04B43/046 , F04D29/582 , F28D1/05316 , F28D15/00 , F28D2021/0031 , F28F2260/02 , H01L23/473 , H01L2924/0002 , H01L2924/09701 , Y10S165/908 , H01L2924/00
摘要： Disclosed is a system for cooling an electronics package. The system includes a fluid pump and a microcooler assembly. The system utilizes one or more cooling layers interspersed with layers of electronics in the electronics package. Each cooling layer has an array of cooling channels formed in a substrate, an input manifold through which cooling fluid is provided for distribution through the array of cooling channels, and an output manifold which collects fluid from the array of cooling channels. The elements of the cooling system are integrated by conduits including a package conduit for passage of fluid from the fluid pump to the electronics package, a cooler conduit for passage of fluid from the electronics package to the microcooler assembly, and a pump conduit for passage of fluid from the microcooler assembly to the fluid pump. Also disclosed is a method for cooling the electronics package.
摘要翻译：公开了一种用于冷却电子封装的系统。该系统包括流体泵和微冷却器组件。该系统利用在电子封装中散布有电子层的一个或多个冷却层。每个冷却层具有形成在衬底中的冷却通道阵列，通过冷却通道阵列提供冷却流体的输入歧管，以及从冷却通道阵列收集流体的输出歧管。冷却系统的元件通过导管集成，导管包括用于将流体从流体泵通到电子封装的封装导管，用于将流体从电子封装件通至微型冷却器组件的冷却器导管，以及用于通过从微冷却器组件到流体泵的流体。还公开了一种用于冷却电子封装的方法。

10. 发明授权

US07878232B2 Light emitting chip apparatuses with a thermally superconducting heat transfer medium for thermal management 有权
标题翻译：具有用于热管理的热超导传热介质的发光芯片装置
公开(公告)号：US07878232B2
公开(公告)日：2011-02-01
申请号：US10887601
申请日：2004-07-09
申请人： Mehmet Arik , Stanton Earl Weaver, Jr.
发明人： Mehmet Arik , Stanton Earl Weaver, Jr.
IPC分类号： F28F7/00 , F28D15/00 , F21V29/00
CPC分类号： H01L33/648 , F21K9/00 , F21W2131/103 , H01L25/0753 , H01L2224/48091 , H01L2224/48464 , H05K1/0203 , H05K1/05 , H01L2924/00014
摘要： A light emitting apparatus (10, 110, 210, 310, 410) includes one or more light emitting chips (12, 112, 212, 312, 412) and a support (13, 14, 114, 214, 314, 414) on which the light emitting chips are disposed. The support includes a first side on which the light emitting chips are attached and a second side opposite the first side. A thermally superconducting heat transfer medium (22, 122, 222, 322, 422) is disposed in an interior volume of the support and thermally connects the first and second sides of the support. The thermally superconducting heat transfer medium has a thermal conductivity at least 1500 times greater than the thermal conductivity of copper.
摘要翻译：发光装置（10,110,210,310,410）包括一个或多个发光芯片（12,112,212,312,412）和支撑件（13,14,144,214,314,414），所述支撑件发光芯片设置在其上。支撑件包括附接有发光芯片的第一侧和与第一侧相对的第二侧。热超导传热介质（22,122,222,322,422）设置在支撑件的内部容积中并且热连接支撑件的第一和第二侧。热超导传热介质具有比铜的热导率至少大1500倍的导热系数。

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