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1. 发明申请

US20100175857A1 MILLICHANNEL HEAT SINK, AND STACK AND APPARATUS USING THE SAME 审中-公开
标题翻译： MILLICHANNEL热水槽，堆叠和使用它的装置
公开(公告)号：US20100175857A1
公开(公告)日：2010-07-15
申请号：US12354386
申请日：2009-01-15
申请人： William Dwight Gerstler , Joseph Lucian Smolenski , Richard Alfred Beaupre , Stephen Adam Solovitz
发明人： William Dwight Gerstler , Joseph Lucian Smolenski , Richard Alfred Beaupre , Stephen Adam Solovitz
IPC分类号： H05K7/20 , F28D15/00 , F28F3/12 , F28F13/06
CPC分类号： F28D15/00 , F28F3/12 , F28F13/185 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A cooling device comprises an upper surface configured to contact the baseplate, an inlet manifold configured to receive a coolant, an outlet manifold configured to exhaust the coolant, and at least one set of millichannels in the upper surface. The at least one set of the millichannels defines at least one heat sink region with at least one groove about one or more millichannels in the respective heat sink region with the groove configured to receive a seal. The at least one heat sink region establishes direct contact of the coolant with the baseplate, and the millichannels are configured to receive the coolant from the inlet manifold and to deliver the coolant to the outlet manifold. An apparatus and a stack are also presented.
摘要翻译：冷却装置包括构造成接触基板的上表面，构造成接收冷却剂的入口歧管，构造成排出冷却剂的出口歧管以及上表面中的至少一组毫通道。所述至少一组所述毫通道限定至少一个散热区域，所述至少一个散热区域具有围绕相应散热区域中的一个或多个毫通道的至少一个凹槽，所述凹槽被配置为接收密封。所述至少一个散热区域建立冷却剂与基板的直接接触，并且所述毫通道构造成从所述入口歧管接收所述冷却剂并将所述冷却剂输送到所述出口歧管。还提供了一种装置和堆叠。

2. 发明授权

US07353859B2 Heat sink with microchannel cooling for power devices 失效
标题翻译：用于功率器件的微通道冷却散热器
公开(公告)号：US07353859B2
公开(公告)日：2008-04-08
申请号：US10998707
申请日：2004-11-24
申请人： Ljubisa Dragoljub Stevanovic , Stephen Adam Solovitz
发明人： Ljubisa Dragoljub Stevanovic , Stephen Adam Solovitz
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , H01L2224/32225 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/00
摘要： An apparatus for cooling at least one heated surface includes a base plate defining a number of inlet and outlet manifolds. The inlet manifolds are configured to receive a coolant, and the outlet manifolds exhaust the coolant. The inlet and outlet manifolds are interleaved. The apparatus also includes at least one substrate having inner and outer surfaces. The inner surface is coupled to the base plate and defines a number of microchannels that receive the coolant from the inlet manifolds and deliver the coolant to the outlet manifolds. The microchannels are oriented substantially perpendicular to the inlet and outlet manifolds. The outer surface is in thermal contact with the heated surface. The apparatus also includes an inlet plenum that supplies the coolant to the inlet manifolds, and an outlet plenum that exhausts the coolant from the outlet manifolds. The inlet plenum and outlet plenum are oriented in a plane of the base plate.
摘要翻译：用于冷却至少一个加热表面的装置包括限定多个入口和出口歧管的基板。入口歧管被构造成接收冷却剂，并且出口歧管排出冷却剂。入口和出口歧管交错。该装置还包括具有内表面和外表面的至少一个基底。内表面联接到基板并限定许多微通道，其从入口歧管接收冷却剂并将冷却剂输送到出口歧管。微通道基本上垂直于入口歧管和出口歧管取向。外表面与加热表面热接触。该装置还包括将冷却剂供应到入口歧管的入口增压室和从出口歧管排出冷却剂的出口增压室。入口增压室和出口增压室在基板的平面内定向。

3. 发明授权

US07969734B2 Unique cooling scheme for advanced thermal management of high flux electronics 有权
标题翻译：独特的冷却方案，用于高通量电子器件的高级热管理
公开(公告)号：US07969734B2
公开(公告)日：2011-06-28
申请号：US11649173
申请日：2007-01-03
申请人： Mehmet Arik , Chellappa Balan , Todd Garrett Wetzel , Stephen Adam Solovitz , Charles Max Byrd , Stanton Earl Weaver, Jr.
发明人： Mehmet Arik , Chellappa Balan , Todd Garrett Wetzel , Stephen Adam Solovitz , Charles Max Byrd , Stanton Earl Weaver, Jr.
IPC分类号： H05K7/20
CPC分类号： F28F3/04 , F04B43/04 , F04B43/046 , F04D29/582 , F28D1/05316 , F28D15/00 , F28D2021/0031 , F28F2260/02 , H01L23/473 , H01L2924/0002 , H01L2924/09701 , Y10S165/908 , H01L2924/00
摘要： Disclosed is a system for cooling an electronics package. The system includes a fluid pump and a microcooler assembly. The system utilizes one or more cooling layers interspersed with layers of electronics in the electronics package. Each cooling layer has an array of cooling channels formed in a substrate, an input manifold through which cooling fluid is provided for distribution through the array of cooling channels, and an output manifold which collects fluid from the array of cooling channels. The elements of the cooling system are integrated by conduits including a package conduit for passage of fluid from the fluid pump to the electronics package, a cooler conduit for passage of fluid from the electronics package to the microcooler assembly, and a pump conduit for passage of fluid from the microcooler assembly to the fluid pump. Also disclosed is a method for cooling the electronics package.
摘要翻译：公开了一种用于冷却电子封装的系统。该系统包括流体泵和微冷却器组件。该系统利用在电子封装中散布有电子层的一个或多个冷却层。每个冷却层具有形成在衬底中的冷却通道阵列，通过冷却通道阵列提供冷却流体的输入歧管，以及从冷却通道阵列收集流体的输出歧管。冷却系统的元件通过导管集成，导管包括用于将流体从流体泵通到电子封装的封装导管，用于将流体从电子封装件通至微型冷却器组件的冷却器导管，以及用于通过从微冷却器组件到流体泵的流体。还公开了一种用于冷却电子封装的方法。

4. 发明授权

US07817422B2 Heat sink and cooling and packaging stack for press-packages 有权
标题翻译：散热器和冷却和包装堆叠用于压力包装
公开(公告)号：US07817422B2
公开(公告)日：2010-10-19
申请号：US12193441
申请日：2008-08-18
申请人： Satish Sivarama Gunturi , Mahadevan Balasubramaniam , Ramakrishna Venkata Mallina , Richard Alfred Beaupre , Le Yan , Richard S. Zhang , Ljubisa Dragoljub Stevanovic , Adam Gregory Pautsch , Stephen Adam Solovitz
发明人： Satish Sivarama Gunturi , Mahadevan Balasubramaniam , Ramakrishna Venkata Mallina , Richard Alfred Beaupre , Le Yan , Richard S. Zhang , Ljubisa Dragoljub Stevanovic , Adam Gregory Pautsch , Stephen Adam Solovitz
IPC分类号： H05K7/20
CPC分类号： F28F3/12 , H01L23/473 , H01L25/117 , H01L2924/0002 , H01L2924/13055 , H01L2924/3011 , H01L2924/00
摘要： A heat sink for directly cooling at least one electronic device package is provided. The electronic device package has an upper contact surface and a lower contact surface. The heat sink comprises a cooling piece formed of at least one thermally conductive material. The cooling piece defines multiple inlet manifolds configured to receive a coolant and multiple outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved. The cooling piece further defines multiple millichannels configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels and inlet and outlet manifolds are further configured to directly cool one of the upper and lower contact surface of the electronic device package by direct contact with the coolant, such that the heat sink comprises an integral heat sink.
摘要翻译：提供了用于直接冷却至少一个电子设备封装的散热器。电子器件封装具有上接触表面和下接触表面。散热器包括由至少一种导热材料形成的冷却片。冷却片限定了多个入口歧管，其构造成接收冷却剂和多个出口歧管，其被配置为排出冷却剂。入口和出口歧管交错。冷却片进一步限定多个毫通道，其构造成从入口歧管接收冷却剂并且将冷却剂输送到出口歧管。毫通道和入口和出口歧管还被构造成通过与冷却剂直接接触直接冷却电子器件封装的上接触表面和下接触表面之一，使得散热器包括整体式散热器。

5. 发明申请

US20100230800A1 DOUBLE SIDE COOLED POWER MODULE WITH POWER OVERLAY 有权
标题翻译：双电源双电源模块与电源覆盖
公开(公告)号：US20100230800A1
公开(公告)日：2010-09-16
申请号：US12404272
申请日：2009-03-13
申请人： Richard Alfred Beaupre , Arun Virupaksha Gowda , Ljubisa Dragol jub Stevanovic , Stephen Adam Solovitz
发明人： Richard Alfred Beaupre , Arun Virupaksha Gowda , Ljubisa Dragol jub Stevanovic , Stephen Adam Solovitz
IPC分类号： H01L23/52
CPC分类号： H01L23/3735 , H01L23/051 , H01L23/42 , H01L23/473 , H01L24/24 , H01L25/072 , H01L2224/24137 , H01L2224/92144 , H01L2924/01029 , H01L2924/14
摘要： A power module includes one or more semiconductor power devices having a power overlay (POL) bonded thereto. A first heat sink is bonded to the semiconductor power devices on a side opposite the POL. A second heat sink is bonded to the POL opposite the side of the POL bonded to the semiconductor power devices. The semiconductor power devices, POL, first channel heat sink, and second channel heat sink together form a double side cooled power overlay module. The second channel heat sink is bonded to the POL solely via a compliant thermal interface material without the need for planarizing, brazing or metallurgical bonding.
摘要翻译：功率模块包括具有与其结合的功率覆盖（POL）的一个或多个半导体功率器件。第一散热器在与POL相对的一侧结合到半导体功率器件。第二散热器接合到与结合到半导体功率器件的POL的侧面相反的POL。半导体功率器件POL，第一通道散热器和第二通道散热器一起形成双侧冷却功率覆盖模块。第二通道散热器仅通过柔性热界面材料结合到POL，而不需要平坦化，钎焊或冶金结合。

6. 发明授权

US08051905B2 Cooling systems employing fluidic jets, methods for their use and methods for cooling 有权
标题翻译：采用流体喷射的冷却系统，其使用方法和冷却方法
公开(公告)号：US08051905B2
公开(公告)日：2011-11-08
申请号：US11464563
申请日：2006-08-15
申请人： Mehmet Arik , Todd Garrett Wetzel , Stephen Adam Solovitz
发明人： Mehmet Arik , Todd Garrett Wetzel , Stephen Adam Solovitz
IPC分类号： F28F13/02 , F28F13/08 , F28F13/10 , F28F13/12 , H05K7/20
CPC分类号： H01L23/4735 , H01L2924/0002 , Y10S165/908 , H01L2924/00
摘要： In one embodiment, a cooling system is disclosed. The cooling system comprises: a cooling channel for receiving a cooling media, a substrate disposed near the cooling channel, and a fluidic jet disposed within the substrate and in fluid communication with the cooling channel. The cooling channel is for thermal communication with a component to be cooled. The cooling channel has a height of less than or equal to about 3 mm and a width of less than or equal to 2 mm. The fluidic jet comprises a cavity defined by a well and a membrane. In one embodiment, a method of cooling an electrical component comprises: passing a cooling media through a cooling channel, drawing the cooling media into one or more of the fluidic jets, expelling the cooling media from the one or more fluidic jets into the cooling channel, and removing thermal energy from the electrical component.
摘要翻译：在一个实施例中，公开了一种冷却系统。冷却系统包括：用于接收冷却介质的冷却通道，设置在冷却通道附近的基板以及设置在基板内并与冷却通道流体连通的流体射流。冷却通道用于与要冷却的部件进行热连通。冷却通道的高度小于或等于约3mm，宽度小于或等于2mm。流体射流包括由阱和膜限定的空腔。在一个实施例中，一种冷却电气部件的方法包括：使冷却介质通过冷却通道，将冷却介质拉入一个或多个流体喷射器，将冷却介质从一个或多个流体喷射器排出到冷却通道并且从电气部件去除热能。

7. 发明申请

US20100038774A1 ADVANCED AND INTEGRATED COOLING FOR PRESS-PACKAGES 审中-公开
标题翻译：用于压缩包装的先进和集成式冷却
公开(公告)号：US20100038774A1
公开(公告)日：2010-02-18
申请号：US12193429
申请日：2008-08-18
申请人： Richard S. Zhang , Richard Alfred Beaupre , Ramakrishna Venkata Mallina , Arun Virupaksha Gowda , Le Yan , Ljubisa Dragoljub Stevanovic , Peter Morley , Stephen Adam Solovitz
发明人： Richard S. Zhang , Richard Alfred Beaupre , Ramakrishna Venkata Mallina , Arun Virupaksha Gowda , Le Yan , Ljubisa Dragoljub Stevanovic , Peter Morley , Stephen Adam Solovitz
IPC分类号： H01L23/34
CPC分类号： H01L23/473 , H01L24/72 , H01L2924/01079 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/3011 , H01L2924/00
摘要： A heat sink for cooling at least one electronic device package is provided. The electronic device package has an upper contact surface and a lower contact surface. The heat sink comprises at least one thermally conductive material and defines multiple inlet manifolds configured to receive a coolant, multiple outlet manifolds configured to exhaust the coolant, and multiple millichannels configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The manifolds and millichannels are disposed proximate to the respective one of the upper and lower contact surface of the electronic device package for cooling the respective surface with the coolant.
摘要翻译：提供了用于冷却至少一个电子设备封装的散热器。电子器件封装具有上接触表面和下接触表面。散热器包括至少一个导热材料并且限定被配置为接收冷却剂的多个入口歧管，被配置为排出冷却剂的多个出口歧管以及被配置成从进气歧管接收冷却剂并将冷却剂输送到出口的多个通路歧管。歧管和毫通道靠近电子装置包装的上接触表面和下接触表面中的相应一个设置，用于用冷却剂冷却相应的表面。

8. 发明授权

US08486710B2 Method, sensor and system for measuring a lower heating value and a Wobbe Index of a gaseous fuel 有权
标题翻译：用于测量气体燃料的较低热值和沃泊指数的方法，传感器和系统
公开(公告)号：US08486710B2
公开(公告)日：2013-07-16
申请号：US11299588
申请日：2005-12-12
申请人： William Joseph Antel , Nirm Velumylum Nirmalan , Stephen Adam Solovitz , Nishant Vats , Subhrajit Dey , Robert Michael Orenstein , Matthew Moorman , Ronald P. Manginell
发明人： William Joseph Antel , Nirm Velumylum Nirmalan , Stephen Adam Solovitz , Nishant Vats , Subhrajit Dey , Robert Michael Orenstein , Matthew Moorman , Ronald P. Manginell
IPC分类号： G01N33/00
CPC分类号： G01N25/22 , Y10T436/218
摘要： A method for measuring a lower heating value of a gaseous fuel. The method includes mixing a gaseous fuel with air to provide a combustible air-fuel mixture. The air-fuel mixture is directed to flow across a flow surface of a first micro-hotplate maintained at a constant temperature. A change in power required to maintain a constant temperature of the first micro-hotplate flow surface due to a convective and conductive heat transfer from the first micro-hotplate flow surface to the air-fuel mixture is measured. The air-fuel mixture is directed to flow across a flow surface of a second micro-hotplate maintained at a constant temperature. The air-fuel mixture is combusted as the air-fuel mixture flows across the second micro-hotplate flow surface. A change in power required to maintain a constant temperature of the second micro-hotplate flow surface due to the combustion of the air-fuel mixture is measured.
摘要翻译：一种用于测量气体燃料的较低热值的方法。该方法包括将气态燃料与空气混合以提供可燃空气 - 燃料混合物。空气 - 燃料混合物被引导流过维持在恒定温度的第一微电热板的流动表面。测量由于从第一微型加热板流动表面到空气 - 燃料混合物的对流和导电的热传递来维持第一微型电热板流动表面的恒定温度所需的功率变化。空气 - 燃料混合物被引导流过维持在恒定温度的第二微电热板的流动表面。空气燃料混合物随着空气 - 燃料混合物流过第二微电镀板流动表面而燃烧。测量由于空气 - 燃料混合物的燃烧而保持第二微型加热板流动表面的恒定温度所需的功率变化。

9. 发明授权

US08358000B2 Double side cooled power module with power overlay 有权
标题翻译：双面冷却功率模块，带电源覆盖
公开(公告)号：US08358000B2
公开(公告)日：2013-01-22
申请号：US12404272
申请日：2009-03-13
申请人： Richard Alfred Beaupre , Arun Virupaksha Gowda , Ljubisa Dragol jub Stevanovic , Stephen Adam Solovitz
发明人： Richard Alfred Beaupre , Arun Virupaksha Gowda , Ljubisa Dragol jub Stevanovic , Stephen Adam Solovitz
IPC分类号： H01L23/48
CPC分类号： H01L23/3735 , H01L23/051 , H01L23/42 , H01L23/473 , H01L24/24 , H01L25/072 , H01L2224/24137 , H01L2224/92144 , H01L2924/01029 , H01L2924/14
摘要： A power module includes one or more semiconductor power devices having a power overlay (POL) bonded thereto. A first heat sink is bonded to the semiconductor power devices on a side opposite the POL. A second heat sink is bonded to the POL opposite the side of the POL bonded to the semiconductor power devices. The semiconductor power devices, POL, first channel heat sink, and second channel heat sink together form a double side cooled power overlay module. The second channel heat sink is bonded to the POL solely via a compliant thermal interface material without the need for planarizing, brazing or metallurgical bonding.
摘要翻译：功率模块包括具有与其结合的功率覆盖（POL）的一个或多个半导体功率器件。第一散热器在与POL相对的一侧结合到半导体功率器件。第二散热器接合到与结合到半导体功率器件的POL的侧面相反的POL。半导体功率器件POL，第一通道散热器和第二通道散热器一起形成双侧冷却功率覆盖模块。第二通道散热器仅通过柔性热界面材料结合到POL，而不需要平坦化，钎焊或冶金结合。

10. 发明申请

US20100038058A1 HEAT SINK AND COOLING AND PACKAGING STACK FOR PRESS-PACKAGES 有权
标题翻译：用于压缩包的热水槽和冷却和包装堆叠
公开(公告)号：US20100038058A1
公开(公告)日：2010-02-18
申请号：US12193441
申请日：2008-08-18
申请人： Satish Sivarama Gunturi , Mahadevan Balasubramaniam , Ramakrishna Venkata Mallina , Richard Alfred Beaupre , Le Yan , Richard S. Zhang , Ljubisa Dragoljub Stevanovic , Adam Gregory Pautsch , Stephen Adam Solovitz
发明人： Satish Sivarama Gunturi , Mahadevan Balasubramaniam , Ramakrishna Venkata Mallina , Richard Alfred Beaupre , Le Yan , Richard S. Zhang , Ljubisa Dragoljub Stevanovic , Adam Gregory Pautsch , Stephen Adam Solovitz
IPC分类号： F28F7/00
CPC分类号： F28F3/12 , H01L23/473 , H01L25/117 , H01L2924/0002 , H01L2924/13055 , H01L2924/3011 , H01L2924/00
摘要： A heat sink for directly cooling at least one electronic device package is provided. The electronic device package has an upper contact surface and a lower contact surface. The heat sink comprises a cooling piece formed of at least one thermally conductive material. The cooling piece defines multiple inlet manifolds configured to receive a coolant and multiple outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved. The cooling piece further defines multiple millichannels configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels and inlet and outlet manifolds are further configured to directly cool one of the upper and lower contact surface of the electronic device package by direct contact with the coolant, such that the heat sink comprises an integral heat sink.
摘要翻译：提供了用于直接冷却至少一个电子设备封装的散热器。电子器件封装具有上接触表面和下接触表面。散热器包括由至少一种导热材料形成的冷却片。冷却片限定了多个入口歧管，其构造成接收冷却剂和多个出口歧管，其被配置为排出冷却剂。入口和出口歧管交错。冷却片进一步限定多个毫通道，其构造成从入口歧管接收冷却剂并且将冷却剂输送到出口歧管。毫通道和入口和出口歧管还被构造成通过与冷却剂直接接触直接冷却电子器件封装的上接触表面和下接触表面之一，使得散热器包括整体式散热器。

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