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1. 发明申请

US20120187551A1 SEMICONDUCTOR MODULE 审中-公开
标题翻译：半导体模块
公开(公告)号：US20120187551A1
公开(公告)日：2012-07-26
申请号：US13323495
申请日：2011-12-12
申请人： Masahiko KUSHINO , Masahiro MURAKAMI , Yoshihisa AMANO , Shinichi TOKUNO
发明人： Masahiko KUSHINO , Masahiro MURAKAMI , Yoshihisa AMANO , Shinichi TOKUNO
IPC分类号： H01L23/552
CPC分类号： H01L23/552 , H01L21/561 , H01L23/3121 , H01L24/73 , H01L24/97 , H01L25/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2224/97 , H01L2924/00011 , H01L2924/01029 , H01L2924/14 , H01L2924/181 , H01L2924/19105 , H01L2924/30107 , H01L2924/3025 , H01L2224/81 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2924/01005 , H01L2924/01033
摘要： Provided is a semiconductor module (A), including: a substrate (1) having an electronic component (2) mounted on an upper surface thereof; an encapsulation resin layer (3) having an insulating property, for encapsulating the upper surface; an exterior shielding member (4) having conductivity, for covering a side of the encapsulation resin layer (3) opposite to the substrate (1); and a connection portion (5), which is provided inside the encapsulation resin layer (3), for electrically connecting the exterior shielding member (4) and a ground terminal (13) provided to the substrate (1).
摘要翻译：提供一种半导体模块（A），包括：具有安装在其上表面上的电子部件（2）的基板（1）具有绝缘性的封装树脂层（3），用于密封上表面; 具有导电性的外部屏蔽构件（4），用于覆盖与所述基板（1）相对的所述密封树脂层（3）的一侧; 以及设置在密封树脂层（3）内部的用于将外部屏蔽部件（4）和设置于基板（1）的接地端子（13）电连接的连接部分（5）。

2. 发明申请

US20110104429A1 SUBSTRATE MEMBER, MODULE, ELECTRIC EQUIPMENT, AND MANUFACTURING METHOD OF MODULES 审中-公开
标题翻译：基板成员，模块，电气设备和模块的制造方法
公开(公告)号：US20110104429A1
公开(公告)日：2011-05-05
申请号：US12832353
申请日：2010-07-08
申请人： Masahiko Kushino , Masahiro Murakami , Shinichi Tokuno
发明人： Masahiko Kushino , Masahiro Murakami , Shinichi Tokuno
IPC分类号： B32B3/02 , B32B3/30 , B29C65/00
CPC分类号： H01L21/565 , H01L21/561 , H01L23/13 , H01L23/3128 , H01L24/97 , H01L2224/83385 , H01L2924/01004 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/014 , H01L2924/12041 , H01L2924/19041 , Y10T428/239 , Y10T428/24479 , Y10T428/24612
摘要： A substrate member is a manufacturing component of a module including electronic components mounted on a substrate and sealed with resin. The substrate member has substantially a plate-like shape and is to be the substrate later. A manufacturing process of the modules includes a mounting step of mounting electronic components on a component side of the substrate member, and a sealing step of supplying resin to flow on the component side so that the mounted electronic components are sealed with the resin. The mounting step includes mounting a first electronic component having substantially a flat mounting surface in a first mounting region specified on the component side so that a gap is formed between the mounting surface and the component side. The component side is provided with a first groove for boosting the resin to fill up the gap in the sealing step. Thus, insufficient filling of the resin in the gap between the substrate member and the electronic component is suppressed.
摘要翻译：基板构件是包括安装在基板上并用树脂密封的电子部件的模块的制造部件。基板构件基本上具有板状形状，并且稍后将成为基板。模块的制造过程包括将电子部件安装在基板部件的部件侧的安装步骤以及供给树脂在部件侧流动从而将所安装的电子部件用树脂密封的密封工序。安装步骤包括将具有基本上平坦的安装表面的第一电子部件安装在在部件侧指定的第一安装区域中，使得在安装表面和部件侧之间形成间隙。部件侧设置有用于在密封步骤中增加树脂以填充间隙的第一凹槽。因此，抑制了树脂在衬底构件和电子部件之间的间隙中的填充不充分。

3. 发明申请

US20050002109A1 Optical pick-up device, and optical disc drive including the same 审中-公开
标题翻译：光学拾取装置和包括其的光盘驱动器
公开(公告)号：US20050002109A1
公开(公告)日：2005-01-06
申请号：US10879562
申请日：2004-06-28
申请人： Shinichi Tokuno
发明人： Shinichi Tokuno
IPC分类号： G11B7/125 , G02B27/10 , G02B27/14 , G11B7/00 , G11B7/1263 , G11B7/135 , H01S5/022
CPC分类号： G11B7/1263 , G11B2007/0006
摘要： An optical pick-up device comprising: at least two light sources for emitting laser beams of different wavelengths; a beam splitter for reflecting or transmitting the light beams from the light sources; the beam splitter including a wavelength selecting film which reflects substantially all of the light beam from one of the light sources and transmits substantially all of the light beam from the other light source, a collimator lens for collimating the light beams reflected or transmitted by the beam splitter; a rising mirror for reflecting the light beams collimated at the collimator lens for rising; an objective lens for transmitting the laser beams reflected at the rising mirror, at least two reflecting mirrors for reflecting, in advance, the light beam unnecessary for rising before entering the beam splitter, when the light beam is reflected at the rising mirror after being emitted from each light source and passing through the beam splitter and the collimator lens; and a front monitor PD for receiving the light beams and monitoring the quantity of light of the light beams reflected at the reflecting mirrors.
摘要翻译：一种光学拾取装置，包括：用于发射不同波长的激光束的至少两个光源; 用于从光源反射或透射光束的分束器; 所述分束器包括波长选择膜，其基本上反射来自所述光源中的一个的所述光束并且基本上透射来自所述另一光源的所述光束;准直透镜，用于准直由所述光束反射或透射的光束分流器用于反射在准直透镜准直的光束上升的上升反射镜; 用于透射在上升反射镜处反射的激光束的物镜;至少两个反射镜，用于在发射之后在上升反射镜处反射预先在预先进入分束器之前上升的光束从每个光源并通过分束器和准直透镜; 以及用于接收光束并监视在反射镜处反射的光束的光量的前监视器PD。

4. 发明申请

US20120286415A1 METHOD OF PRODUCING SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE 有权
标题翻译：生产半导体模块和半导体模块的方法
公开(公告)号：US20120286415A1
公开(公告)日：2012-11-15
申请号：US13470029
申请日：2012-05-11
申请人： Takae Sakai , Masahiro Murakami , Masahiko Kushino , Yoshihisa Amano , Shinichi Tokuno
发明人： Takae Sakai , Masahiro Murakami , Masahiko Kushino , Yoshihisa Amano , Shinichi Tokuno
IPC分类号： H01L23/48 , H01L21/56
CPC分类号： H01L23/60 , H01L21/563 , H01L21/78 , H01L23/3121 , H01L23/552 , H01L24/16 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/0655 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01065 , H01L2924/014 , H01L2924/12042 , H01L2924/1421 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H01L2224/81 , H01L2224/85 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In order to securely ground an exterior shield and reduce burden imposed on a dicing blade and the exterior shield, a method of producing a semiconductor module comprises a hole-forming step of forming a hole 30 extending from a top surface of a sealing resin layer 3 to a ground wiring 111 (112) provided at a collective substrate 100, a film-forming step of forming an electrically conductive film made of an electrically conductive material so as to cover at least the top surface of the sealing resin layer 3, an internal surface of the hole 20, and the ground wiring 111 (112), and a separation step of separating from each other a plurality of individual module sections which the individual module section comprises.
摘要翻译：为了牢固地研磨外部屏蔽并降低施加在切割刀片和外部屏蔽上的负担，制造半导体模块的方法包括形成从密封树脂层3的顶表面延伸的孔30的孔形成步骤设置在集合基板100上的接地布线111（112），成膜步骤，形成由导电材料制成的导电膜，以至少覆盖密封树脂层3的顶面，内部孔20的表面和接地布线111（112），以及分离步骤，分离各个模块部分所包括的多个单独的模块部分。

5. 发明授权

US07321533B2 Optical pickup device having a wavelength selecting film and an optical reflector 失效
标题翻译：具有波长选择膜和光反射器的光学拾取装置
公开(公告)号：US07321533B2
公开(公告)日：2008-01-22
申请号：US10391185
申请日：2003-03-19
申请人： Hiroshi Katayama , Shinichi Tokuno
发明人： Hiroshi Katayama , Shinichi Tokuno
IPC分类号： G11B7/125
CPC分类号： G11B7/1263 , G11B7/1275 , G11B7/1356 , G11B2007/0006
摘要： An optical pickup device has first and second light sources that emit first and second laser beams of different wavelengths, an object lens that concentrates the first and second laser beams on a data recording surface of an optical disk, an optical separator disposed between the first and second light sources and the object lens, and an optical monitor that detects a quantity of light of the second laser beam. The optical separator has a wavelength selecting film that, on one hand, reflects the first laser beam emitted from the first light source toward the object lens and, on the other hand, transmits the second laser beam emitted from the second light source to the object lens, and a reflector that reflects a part of the second laser beam emitted from the second light source toward the optical monitor.
摘要翻译：光学拾取装置具有发射不同波长的第一和第二激光束的第一和第二光源，将第一和第二激光束集中在光盘的数据记录表面上的物镜，设置在第一和第二激光束之间的光学分离器第二光源和物镜，以及检测第二激光束的光量的光学监视器。光学分离器具有波长选择膜，其一方面将从第一光源发射的第一激光束反射到物镜，另一方面将从第二光源发射的第二激光束透射到物体透镜和将从第二光源发射的第二激光束的一部分反射到光学监视器的反射器。

6. 发明授权

US09076892B2 Method of producing semiconductor module and semiconductor module 有权
标题翻译：半导体模块和半导体模块的制造方法
公开(公告)号：US09076892B2
公开(公告)日：2015-07-07
申请号：US13470029
申请日：2012-05-11
申请人： Takae Sakai , Masahiro Murakami , Masahiko Kushino , Yoshihisa Amano , Shinichi Tokuno
发明人： Takae Sakai , Masahiro Murakami , Masahiko Kushino , Yoshihisa Amano , Shinichi Tokuno
IPC分类号： H01L21/78 , H01L23/00 , H01L23/31 , H01L23/552 , H01L25/065
CPC分类号： H01L23/60 , H01L21/563 , H01L21/78 , H01L23/3121 , H01L23/552 , H01L24/16 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/0655 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01065 , H01L2924/014 , H01L2924/12042 , H01L2924/1421 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H01L2224/81 , H01L2224/85 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In order to securely ground an exterior shield and reduce burden imposed on a dicing blade and the exterior shield, a method of producing a semiconductor module comprises a hole-forming step of forming a hole 30 extending from a top surface of a sealing resin layer 3 to a ground wiring 111 (112) provided at a collective substrate 100, a film-forming step of forming an electrically conductive film made of an electrically conductive material so as to cover at least the top surface of the sealing resin layer 3, an internal surface of the hole 20, and the ground wiring 111 (112), and a separation step of separating from each other a plurality of individual module sections which the individual module section comprises.
摘要翻译：为了牢固地研磨外部屏蔽并降低施加在切割刀片和外部屏蔽上的负担，制造半导体模块的方法包括形成从密封树脂层3的顶表面延伸的孔30的孔形成步骤设置在集合基板100上的接地布线111（112），成膜步骤，形成由导电材料制成的导电膜，以至少覆盖密封树脂层3的顶面，内部孔20的表面和接地布线111（112），以及分离步骤，分离各个模块部分所包括的多个单独的模块部分。

7. 外观设计

USD611576S1 Hose 有权
标题翻译：软管
公开(公告)号：USD611576S1
公开(公告)日：2010-03-09
申请号：US29287542
申请日：2007-08-20
申请人： Shinichi Tokuno
设计人： Shinichi Tokuno

8. 发明申请

US20080031121A1 OPTICAL PICKUP DEVICE HAVING A WAVELENGTH SELECTING FILM AND AN OPTICAL REFLECTOR 审中-公开
标题翻译：具有波长选择膜和光反射器的光学拾取器件
公开(公告)号：US20080031121A1
公开(公告)日：2008-02-07
申请号：US11867601
申请日：2007-10-04
申请人： Hiroshi KATAYAMA , Shinichi TOKUNO
发明人： Hiroshi KATAYAMA , Shinichi TOKUNO
IPC分类号： G11B7/135
CPC分类号： G11B7/1263 , G11B7/1275 , G11B7/1356 , G11B2007/0006
摘要： An optical pickup device has first and second light sources that emit first and second laser beams of different wavelengths, an object lens that concentrates the first and second laser beams on a data recording surface of an optical disk, an optical separator disposed between the first and second light sources and the object lens, and an optical monitor that detects a quantity of light of the second laser beam. The optical separator has a wavelength selecting film that, on one hand, reflects the first laser beam emitted from the first light source toward the object lens and, on the other hand, transmits the second laser beam emitted from the second light source to the object lens, and a reflector that reflects a part of the second laser beam emitted from the second light source toward the optical monitor.
摘要翻译：光学拾取装置具有发射不同波长的第一和第二激光束的第一和第二光源，将第一和第二激光束集中在光盘的数据记录表面上的物镜，设置在第一和第二激光束之间的光学分离器第二光源和物镜，以及检测第二激光束的光量的光学监视器。光学分离器具有波长选择膜，其一方面将从第一光源发射的第一激光束反射到物镜，另一方面将从第二光源发射的第二激光束透射到物体透镜和将从第二光源发射的第二激光束的一部分反射到光学监视器的反射器。

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