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1. 发明申请

US20110104429A1 SUBSTRATE MEMBER, MODULE, ELECTRIC EQUIPMENT, AND MANUFACTURING METHOD OF MODULES 审中-公开
标题翻译：基板成员，模块，电气设备和模块的制造方法
公开(公告)号：US20110104429A1
公开(公告)日：2011-05-05
申请号：US12832353
申请日：2010-07-08
申请人： Masahiko Kushino , Masahiro Murakami , Shinichi Tokuno
发明人： Masahiko Kushino , Masahiro Murakami , Shinichi Tokuno
IPC分类号： B32B3/02 , B32B3/30 , B29C65/00
CPC分类号： H01L21/565 , H01L21/561 , H01L23/13 , H01L23/3128 , H01L24/97 , H01L2224/83385 , H01L2924/01004 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/014 , H01L2924/12041 , H01L2924/19041 , Y10T428/239 , Y10T428/24479 , Y10T428/24612
摘要： A substrate member is a manufacturing component of a module including electronic components mounted on a substrate and sealed with resin. The substrate member has substantially a plate-like shape and is to be the substrate later. A manufacturing process of the modules includes a mounting step of mounting electronic components on a component side of the substrate member, and a sealing step of supplying resin to flow on the component side so that the mounted electronic components are sealed with the resin. The mounting step includes mounting a first electronic component having substantially a flat mounting surface in a first mounting region specified on the component side so that a gap is formed between the mounting surface and the component side. The component side is provided with a first groove for boosting the resin to fill up the gap in the sealing step. Thus, insufficient filling of the resin in the gap between the substrate member and the electronic component is suppressed.
摘要翻译：基板构件是包括安装在基板上并用树脂密封的电子部件的模块的制造部件。基板构件基本上具有板状形状，并且稍后将成为基板。模块的制造过程包括将电子部件安装在基板部件的部件侧的安装步骤以及供给树脂在部件侧流动从而将所安装的电子部件用树脂密封的密封工序。安装步骤包括将具有基本上平坦的安装表面的第一电子部件安装在在部件侧指定的第一安装区域中，使得在安装表面和部件侧之间形成间隙。部件侧设置有用于在密封步骤中增加树脂以填充间隙的第一凹槽。因此，抑制了树脂在衬底构件和电子部件之间的间隙中的填充不充分。

2. 发明授权

US09076892B2 Method of producing semiconductor module and semiconductor module 有权
标题翻译：半导体模块和半导体模块的制造方法
公开(公告)号：US09076892B2
公开(公告)日：2015-07-07
申请号：US13470029
申请日：2012-05-11
申请人： Takae Sakai , Masahiro Murakami , Masahiko Kushino , Yoshihisa Amano , Shinichi Tokuno
发明人： Takae Sakai , Masahiro Murakami , Masahiko Kushino , Yoshihisa Amano , Shinichi Tokuno
IPC分类号： H01L21/78 , H01L23/00 , H01L23/31 , H01L23/552 , H01L25/065
CPC分类号： H01L23/60 , H01L21/563 , H01L21/78 , H01L23/3121 , H01L23/552 , H01L24/16 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/0655 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01065 , H01L2924/014 , H01L2924/12042 , H01L2924/1421 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H01L2224/81 , H01L2224/85 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In order to securely ground an exterior shield and reduce burden imposed on a dicing blade and the exterior shield, a method of producing a semiconductor module comprises a hole-forming step of forming a hole 30 extending from a top surface of a sealing resin layer 3 to a ground wiring 111 (112) provided at a collective substrate 100, a film-forming step of forming an electrically conductive film made of an electrically conductive material so as to cover at least the top surface of the sealing resin layer 3, an internal surface of the hole 20, and the ground wiring 111 (112), and a separation step of separating from each other a plurality of individual module sections which the individual module section comprises.
摘要翻译：为了牢固地研磨外部屏蔽并降低施加在切割刀片和外部屏蔽上的负担，制造半导体模块的方法包括形成从密封树脂层3的顶表面延伸的孔30的孔形成步骤设置在集合基板100上的接地布线111（112），成膜步骤，形成由导电材料制成的导电膜，以至少覆盖密封树脂层3的顶面，内部孔20的表面和接地布线111（112），以及分离步骤，分离各个模块部分所包括的多个单独的模块部分。

3. 发明申请

US20120286415A1 METHOD OF PRODUCING SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE 有权
标题翻译：生产半导体模块和半导体模块的方法
公开(公告)号：US20120286415A1
公开(公告)日：2012-11-15
申请号：US13470029
申请日：2012-05-11
申请人： Takae Sakai , Masahiro Murakami , Masahiko Kushino , Yoshihisa Amano , Shinichi Tokuno
发明人： Takae Sakai , Masahiro Murakami , Masahiko Kushino , Yoshihisa Amano , Shinichi Tokuno
IPC分类号： H01L23/48 , H01L21/56
CPC分类号： H01L23/60 , H01L21/563 , H01L21/78 , H01L23/3121 , H01L23/552 , H01L24/16 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/0655 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01065 , H01L2924/014 , H01L2924/12042 , H01L2924/1421 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H01L2224/81 , H01L2224/85 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In order to securely ground an exterior shield and reduce burden imposed on a dicing blade and the exterior shield, a method of producing a semiconductor module comprises a hole-forming step of forming a hole 30 extending from a top surface of a sealing resin layer 3 to a ground wiring 111 (112) provided at a collective substrate 100, a film-forming step of forming an electrically conductive film made of an electrically conductive material so as to cover at least the top surface of the sealing resin layer 3, an internal surface of the hole 20, and the ground wiring 111 (112), and a separation step of separating from each other a plurality of individual module sections which the individual module section comprises.
摘要翻译：为了牢固地研磨外部屏蔽并降低施加在切割刀片和外部屏蔽上的负担，制造半导体模块的方法包括形成从密封树脂层3的顶表面延伸的孔30的孔形成步骤设置在集合基板100上的接地布线111（112），成膜步骤，形成由导电材料制成的导电膜，以至少覆盖密封树脂层3的顶面，内部孔20的表面和接地布线111（112），以及分离步骤，分离各个模块部分所包括的多个单独的模块部分。

4. 发明授权

US08179678B2 Electronic component module 有权
标题翻译：电子元件模块
公开(公告)号：US08179678B2
公开(公告)日：2012-05-15
申请号：US12753436
申请日：2010-04-02
申请人： Mitsuyoshi Yamashita , Yoshihisa Amano , Akiteru Deguchi , Masahiko Kushino , Masahiro Murakami
发明人： Mitsuyoshi Yamashita , Yoshihisa Amano , Akiteru Deguchi , Masahiko Kushino , Masahiro Murakami
IPC分类号： H05K7/20
CPC分类号： H05K1/0243 , H01L23/552 , H01L25/165 , H01L2224/16225 , H01L2224/16227 , H01L2224/73253 , H01L2924/00014 , H01L2924/19105 , H05K1/181 , H05K9/006 , H05K2201/10371 , H05K2201/10522 , H01L2224/0401
摘要： Provided is an electronic component module which has high reliability and is capable of suppressing reduction in handling performance of a mounting machine. An electronic component module includes a plurality of electronic components mounted on a top surface of a module substrate, a planar top plate covering the electronic components, and a top plate holding member for holding the top plate. The plurality of electronic components include a quartz resonator, and a RF-IC which has a height smaller than that of the quartz resonator and is disposed on the top surface of the module substrate so as to be side by side with the quartz resonator. In addition, the top plate is fixed to the quartz resonator, and the top plate holding member for holding the top plate is disposed between the RF-IC and the top plate.
摘要翻译：提供一种电子部件模块，其具有高可靠性并且能够抑制安装机器的操作性能的降低。电子部件模块包括安装在模块基板的上表面上的多个电子部件，覆盖电子部件的平面顶板和用于保持顶板的顶板保持部件。多个电子部件包括石英谐振器和具有比石英谐振器的高度小的RF-IC，并且被布置在模块基板的顶表面上以与石英谐振器并排。此外，顶板固定在石英谐振器上，用于保持顶板的顶板保持构件设置在RF-IC和顶板之间。

5. 发明申请

US20100265663A1 ELECTRONIC COMPONENT MODULE 有权
标题翻译：电子元件模块
公开(公告)号：US20100265663A1
公开(公告)日：2010-10-21
申请号：US12753436
申请日：2010-04-02
申请人： Mitsuyoshi YAMASHITA , Yoshihisa Amano , Akiteru Deguchi , Masahiko Kushino , Masahiro Murakami
发明人： Mitsuyoshi YAMASHITA , Yoshihisa Amano , Akiteru Deguchi , Masahiko Kushino , Masahiro Murakami
IPC分类号： H05K7/20 , H05K7/00
CPC分类号： H05K1/0243 , H01L23/552 , H01L25/165 , H01L2224/16225 , H01L2224/16227 , H01L2224/73253 , H01L2924/00014 , H01L2924/19105 , H05K1/181 , H05K9/006 , H05K2201/10371 , H05K2201/10522 , H01L2224/0401
摘要： Provided is an electronic component module which has high reliability and is capable of suppressing reduction in handling performance of a mounting machine. An electronic component module includes a plurality of electronic components mounted on a top surface of a module substrate, a planar top plate covering the electronic components, and a top plate holding member for holding the top plate. The plurality of electronic components include a quartz resonator, and a RF-IC which has a height smaller than that of the quartz resonator and is disposed on the top surface of the module substrate so as to be side by side with the quartz resonator. In addition, the top plate is fixed to the quartz resonator, and the top plate holding member for holding the top plate is disposed between the RF-IC and the top plate.
摘要翻译：提供一种电子部件模块，其具有高可靠性并且能够抑制安装机器的操作性能的降低。电子部件模块包括安装在模块基板的上表面上的多个电子部件，覆盖电子部件的平面顶板和用于保持顶板的顶板保持部件。多个电子部件包括石英谐振器和具有比石英谐振器的高度小的RF-IC，并且被布置在模块基板的顶表面上以与石英谐振器并排。此外，顶板固定在石英谐振器上，用于保持顶板的顶板保持构件设置在RF-IC和顶板之间。

6. 发明授权

US08335086B2 Semiconductor module 有权
标题翻译：半导体模块
公开(公告)号：US08335086B2
公开(公告)日：2012-12-18
申请号：US12685306
申请日：2010-01-11
申请人： Masahiro Murakami , Masahiko Kushino , Akiteru Deguchi , Yoshihisa Amano
发明人： Masahiro Murakami , Masahiko Kushino , Akiteru Deguchi , Yoshihisa Amano
IPC分类号： H05K7/02 , H05K7/06 , H05K7/08 , H05K7/10
CPC分类号： H05K1/0271 , H01L25/16 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/19105 , H05K1/144 , H05K1/181 , H05K3/341 , H05K2201/09136 , H05K2201/10204 , H01L2224/0401
摘要： A top panel, which is disposed to face a module board with an electronic component therebetween, includes a resin layer and a metal layer, and has an insulating characteristic. The metal layer includes a metal layer formed at a front side of the resin layer and a metal layer formed at a rear side of the resin layer. With this structure, in reflow soldering performed in mounting a semiconductor module on a main board, warp which is caused, under temperature change, in the top panel due to difference in coefficient of thermal expansion between the resin layer and the metal layer formed at the front side of the resin layer is cancelled by warp which is caused, under temperature change, in the top panel due to difference in coefficient of thermal expansion between the resin layer and the metal layer formed at the rear side of the resin layer, whereby warp of the top panel is eliminated. This helps prevent the electronic component adhered to the top panel with adhesive from being pressed down to or pulled up from the module board due to warp of the top panel.
摘要翻译：面对其间具有电子部件的模块板的顶板包括树脂层和金属层，并且具有绝缘特性。金属层包括在树脂层的前侧形成的金属层和形成在树脂层的后侧的金属层。利用这种结构，在将半导体模块安装在主板上进行的回流焊接中，由于在树脂层和形成在该主板上的金属层之间的热膨胀系数的差异，在顶板中在温度变化时引起的翘曲树脂层的前侧由于在树脂层和形成在树脂层的后侧的金属层之间的热膨胀系数的差异而在顶板中由于温度变化引起的翘曲而消除，由此翘曲的顶板被淘汰。这有助于防止由于顶板的翘曲而使粘合剂附着在顶板上的电子部件被压下或从模块板拉出。

7. 发明申请

US20110212302A1 RETARDATION FILM 有权
标题翻译：延迟膜
公开(公告)号：US20110212302A1
公开(公告)日：2011-09-01
申请号：US13128091
申请日：2009-11-06
申请人： Hideaki Nitta , Junichi Shibata , Atsushi Sasaki , Masahiro Murakami
发明人： Hideaki Nitta , Junichi Shibata , Atsushi Sasaki , Masahiro Murakami
IPC分类号： B32B3/00 , B29D11/00
CPC分类号： G02B5/3083 , B29C47/0021 , B29C47/8845 , B29C47/887 , B29C55/06 , B29K2069/00 , B29K2995/0032 , Y10T428/24479
摘要： A retardation film which has few foreign matter defects and small retardation nonuniformity and meets the required quality of a retardation film is provided with high productivity at a low cost by melt extruding a polycarbonate.The retardation film obtained by stretching and orienting a melt extruded film of a polycarbonate is characterized in that: (1) the polycarbonate constituting the film has a viscosity average molecular weight of 1.3×104 to 1.8×104; (2) the retardation R(589) within the plane of the film measured at a wavelength of 589 nm is 50 to 800 nm; (3) the retardation R (589) nonuniformity within the plane of the film is ±5 nm; (4) the average thickness of the film is 10 to 150 μm; and (5) the number of film defects as large as 100 μm or more is 2 or less/m2.
摘要翻译：通过熔融挤出聚碳酸酯，以低成本提供少量异物缺陷和小的延迟不均匀性并且满足延迟膜的所需质量的延迟膜。通过拉伸和取向聚碳酸酯的熔融挤出膜获得的延迟膜的特征在于：（1）构成膜的聚碳酸酯的粘均分子量为1.3×10 4〜1.8×10 4; （2）在波长589nm处测量的膜的平面内的延迟R（589）为50〜800nm; （3）薄膜平面内的延迟R（589）不均匀度为±5nm; （4）膜的平均厚度为10〜150μm; （5）大于100μm以上的膜缺陷的数量为2个以下/ m 2。

8. 发明申请

US20110023945A1 LAMINATE FOR A SOLAR BATTERY BACK-SHEET AND BACK-SHEET COMPRISNG SAME 审中-公开
标题翻译：用于太阳能电池背板和背板的层压板
公开(公告)号：US20110023945A1
公开(公告)日：2011-02-03
申请号：US12936355
申请日：2009-04-24
申请人： Mikine Hayashi , Kouichirou Azuma , Motoyoshi Mori , Masahiro Murakami
发明人： Mikine Hayashi , Kouichirou Azuma , Motoyoshi Mori , Masahiro Murakami
IPC分类号： H01L31/048 , B32B27/08 , B32B7/02
CPC分类号： C09D127/08 , B32B2327/00 , B32B2333/08 , B32B2367/00 , H01L31/048 , H01L31/049 , Y02E10/50 , Y10T428/24975 , Y10T428/31663
摘要： Provided is a laminate for a solar battery back-sheet, which is capable of exhibiting and maintaining an excellent water-vapor barrier property even under a severe natural environment for a long time, i.e., excellent in weather resistance and humidity resistance, and which is produced by laminating a vinylidene chloride-based resin layer and a silicone-modified acrylic-based resin layer.
摘要翻译：本发明提供一种太阳能电池背板的叠层体，即使在恶劣的自然环境下即使在耐候性和耐湿性优异的情况下也能显示出良好的水蒸气阻隔性，通过层压偏二氯乙烯类树脂层和硅氧烷改性的丙烯酸类树脂层而制造。

9. 发明授权

US07751015B2 Panel module for an LCD module having inter-substrate flexible wires 有权
标题翻译：用于具有基板间柔性线的LCD模块的面板模块
公开(公告)号：US07751015B2
公开(公告)日：2010-07-06
申请号：US10987872
申请日：2004-11-12
申请人： Masahiro Murakami
发明人： Masahiro Murakami
IPC分类号： G02F1/1345
CPC分类号： H05K1/028 , G02F1/13452 , H01L2924/0002 , H05K2201/09063 , H01L2924/00
摘要： A panel module for an LCD device has an LCD panel including a TFT panel and a counter panel, signal line and scanning line drive boards for connecting to external circuits, and TCPs connecting together the TFT panel and the drive boards. The signal line driver TCP has a plurality of slits in the film substrate thereof and bent at the slits, allow the signal line drive board to be located on the rear side of the backlight unit of the LCD device. The panel module is suited any of stacked, L-shaped or U-shaped board structure.
摘要翻译：用于LCD装置的面板模块具有包括TFT面板和对面板的LCD面板，用于连接到外部电路的信号线和扫描线驱动板以及将TFT面板和驱动板连接在一起的TCP。信号线驱动器TCP在其薄膜基板中具有多个狭缝并在狭缝处弯曲，允许信号线驱动板位于LCD装置的背光单元的后侧。面板模块适用于任何堆叠的L形或U形板结构。

10. 发明授权

US07652119B2 Curable composition 有权
标题翻译：可固化组合物
公开(公告)号：US07652119B2
公开(公告)日：2010-01-26
申请号：US11667459
申请日：2005-11-09
申请人： Katsuyu Wakabayashi , Hiroshi Iwakiri , Masahiro Murakami
发明人： Katsuyu Wakabayashi , Hiroshi Iwakiri , Masahiro Murakami
IPC分类号： C08G77/00 , C08G77/24
CPC分类号： C08K5/16 , C08K5/541 , C08L101/10 , C09K3/1018 , C08L71/02
摘要： A problem of the present invention is to provide a curable composition which gives good curability by use of a catalyst other than organic tin catalysts. The above problem is solved by a curable composition, comprising: (A) one or more polymers having a silicon-containing group which is crosslinkable by forming siloxane bonds, (B) an amine compound, and (C) a silicon compound having, as substituents on its silicon, at least one electron withdrawing group, and at least one group selected from the group consisting of alkoxy groups, alkenyloxy groups, acyloxy groups, and a hydroxyl group.
摘要翻译：本发明的问题是提供一种通过使用除了有机锡催化剂之外的催化剂提供良好固化性的可固化组合物。上述问题是通过一种可固化组合物来解决的，其包括：（A）一种或多种具有通过形成硅氧烷键可交联的含硅基团的聚合物，（B）胺化合物，和（C）具有如下其硅上的取代基，至少一个吸电子基团和至少一个选自烷氧基，烯氧基，酰氧基和羟基的基团。

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