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1. 发明申请

US20080031121A1 OPTICAL PICKUP DEVICE HAVING A WAVELENGTH SELECTING FILM AND AN OPTICAL REFLECTOR 审中-公开
标题翻译：具有波长选择膜和光反射器的光学拾取器件
公开(公告)号：US20080031121A1
公开(公告)日：2008-02-07
申请号：US11867601
申请日：2007-10-04
申请人： Hiroshi KATAYAMA , Shinichi TOKUNO
发明人： Hiroshi KATAYAMA , Shinichi TOKUNO
IPC分类号： G11B7/135
CPC分类号： G11B7/1263 , G11B7/1275 , G11B7/1356 , G11B2007/0006
摘要： An optical pickup device has first and second light sources that emit first and second laser beams of different wavelengths, an object lens that concentrates the first and second laser beams on a data recording surface of an optical disk, an optical separator disposed between the first and second light sources and the object lens, and an optical monitor that detects a quantity of light of the second laser beam. The optical separator has a wavelength selecting film that, on one hand, reflects the first laser beam emitted from the first light source toward the object lens and, on the other hand, transmits the second laser beam emitted from the second light source to the object lens, and a reflector that reflects a part of the second laser beam emitted from the second light source toward the optical monitor.
摘要翻译：光学拾取装置具有发射不同波长的第一和第二激光束的第一和第二光源，将第一和第二激光束集中在光盘的数据记录表面上的物镜，设置在第一和第二激光束之间的光学分离器第二光源和物镜，以及检测第二激光束的光量的光学监视器。光学分离器具有波长选择膜，其一方面将从第一光源发射的第一激光束反射到物镜，另一方面将从第二光源发射的第二激光束透射到物体透镜和将从第二光源发射的第二激光束的一部分反射到光学监视器的反射器。

2. 发明申请

US20120187551A1 SEMICONDUCTOR MODULE 审中-公开
标题翻译：半导体模块
公开(公告)号：US20120187551A1
公开(公告)日：2012-07-26
申请号：US13323495
申请日：2011-12-12
申请人： Masahiko KUSHINO , Masahiro MURAKAMI , Yoshihisa AMANO , Shinichi TOKUNO
发明人： Masahiko KUSHINO , Masahiro MURAKAMI , Yoshihisa AMANO , Shinichi TOKUNO
IPC分类号： H01L23/552
CPC分类号： H01L23/552 , H01L21/561 , H01L23/3121 , H01L24/73 , H01L24/97 , H01L25/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2224/97 , H01L2924/00011 , H01L2924/01029 , H01L2924/14 , H01L2924/181 , H01L2924/19105 , H01L2924/30107 , H01L2924/3025 , H01L2224/81 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2924/01005 , H01L2924/01033
摘要： Provided is a semiconductor module (A), including: a substrate (1) having an electronic component (2) mounted on an upper surface thereof; an encapsulation resin layer (3) having an insulating property, for encapsulating the upper surface; an exterior shielding member (4) having conductivity, for covering a side of the encapsulation resin layer (3) opposite to the substrate (1); and a connection portion (5), which is provided inside the encapsulation resin layer (3), for electrically connecting the exterior shielding member (4) and a ground terminal (13) provided to the substrate (1).
摘要翻译：提供一种半导体模块（A），包括：具有安装在其上表面上的电子部件（2）的基板（1）具有绝缘性的封装树脂层（3），用于密封上表面; 具有导电性的外部屏蔽构件（4），用于覆盖与所述基板（1）相对的所述密封树脂层（3）的一侧; 以及设置在密封树脂层（3）内部的用于将外部屏蔽部件（4）和设置于基板（1）的接地端子（13）电连接的连接部分（5）。

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