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1. 发明申请

US20120187551A1 SEMICONDUCTOR MODULE 审中-公开
标题翻译：半导体模块
公开(公告)号：US20120187551A1
公开(公告)日：2012-07-26
申请号：US13323495
申请日：2011-12-12
申请人： Masahiko KUSHINO , Masahiro MURAKAMI , Yoshihisa AMANO , Shinichi TOKUNO
发明人： Masahiko KUSHINO , Masahiro MURAKAMI , Yoshihisa AMANO , Shinichi TOKUNO
IPC分类号： H01L23/552
CPC分类号： H01L23/552 , H01L21/561 , H01L23/3121 , H01L24/73 , H01L24/97 , H01L25/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2224/97 , H01L2924/00011 , H01L2924/01029 , H01L2924/14 , H01L2924/181 , H01L2924/19105 , H01L2924/30107 , H01L2924/3025 , H01L2224/81 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2924/01005 , H01L2924/01033
摘要： Provided is a semiconductor module (A), including: a substrate (1) having an electronic component (2) mounted on an upper surface thereof; an encapsulation resin layer (3) having an insulating property, for encapsulating the upper surface; an exterior shielding member (4) having conductivity, for covering a side of the encapsulation resin layer (3) opposite to the substrate (1); and a connection portion (5), which is provided inside the encapsulation resin layer (3), for electrically connecting the exterior shielding member (4) and a ground terminal (13) provided to the substrate (1).
摘要翻译：提供一种半导体模块（A），包括：具有安装在其上表面上的电子部件（2）的基板（1）具有绝缘性的封装树脂层（3），用于密封上表面; 具有导电性的外部屏蔽构件（4），用于覆盖与所述基板（1）相对的所述密封树脂层（3）的一侧; 以及设置在密封树脂层（3）内部的用于将外部屏蔽部件（4）和设置于基板（1）的接地端子（13）电连接的连接部分（5）。

2. 发明申请

US20110104429A1 SUBSTRATE MEMBER, MODULE, ELECTRIC EQUIPMENT, AND MANUFACTURING METHOD OF MODULES 审中-公开
标题翻译：基板成员，模块，电气设备和模块的制造方法
公开(公告)号：US20110104429A1
公开(公告)日：2011-05-05
申请号：US12832353
申请日：2010-07-08
申请人： Masahiko Kushino , Masahiro Murakami , Shinichi Tokuno
发明人： Masahiko Kushino , Masahiro Murakami , Shinichi Tokuno
IPC分类号： B32B3/02 , B32B3/30 , B29C65/00
CPC分类号： H01L21/565 , H01L21/561 , H01L23/13 , H01L23/3128 , H01L24/97 , H01L2224/83385 , H01L2924/01004 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/014 , H01L2924/12041 , H01L2924/19041 , Y10T428/239 , Y10T428/24479 , Y10T428/24612
摘要： A substrate member is a manufacturing component of a module including electronic components mounted on a substrate and sealed with resin. The substrate member has substantially a plate-like shape and is to be the substrate later. A manufacturing process of the modules includes a mounting step of mounting electronic components on a component side of the substrate member, and a sealing step of supplying resin to flow on the component side so that the mounted electronic components are sealed with the resin. The mounting step includes mounting a first electronic component having substantially a flat mounting surface in a first mounting region specified on the component side so that a gap is formed between the mounting surface and the component side. The component side is provided with a first groove for boosting the resin to fill up the gap in the sealing step. Thus, insufficient filling of the resin in the gap between the substrate member and the electronic component is suppressed.
摘要翻译：基板构件是包括安装在基板上并用树脂密封的电子部件的模块的制造部件。基板构件基本上具有板状形状，并且稍后将成为基板。模块的制造过程包括将电子部件安装在基板部件的部件侧的安装步骤以及供给树脂在部件侧流动从而将所安装的电子部件用树脂密封的密封工序。安装步骤包括将具有基本上平坦的安装表面的第一电子部件安装在在部件侧指定的第一安装区域中，使得在安装表面和部件侧之间形成间隙。部件侧设置有用于在密封步骤中增加树脂以填充间隙的第一凹槽。因此，抑制了树脂在衬底构件和电子部件之间的间隙中的填充不充分。

3. 发明授权

US09076892B2 Method of producing semiconductor module and semiconductor module 有权
标题翻译：半导体模块和半导体模块的制造方法
公开(公告)号：US09076892B2
公开(公告)日：2015-07-07
申请号：US13470029
申请日：2012-05-11
申请人： Takae Sakai , Masahiro Murakami , Masahiko Kushino , Yoshihisa Amano , Shinichi Tokuno
发明人： Takae Sakai , Masahiro Murakami , Masahiko Kushino , Yoshihisa Amano , Shinichi Tokuno
IPC分类号： H01L21/78 , H01L23/00 , H01L23/31 , H01L23/552 , H01L25/065
CPC分类号： H01L23/60 , H01L21/563 , H01L21/78 , H01L23/3121 , H01L23/552 , H01L24/16 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/0655 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01065 , H01L2924/014 , H01L2924/12042 , H01L2924/1421 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H01L2224/81 , H01L2224/85 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In order to securely ground an exterior shield and reduce burden imposed on a dicing blade and the exterior shield, a method of producing a semiconductor module comprises a hole-forming step of forming a hole 30 extending from a top surface of a sealing resin layer 3 to a ground wiring 111 (112) provided at a collective substrate 100, a film-forming step of forming an electrically conductive film made of an electrically conductive material so as to cover at least the top surface of the sealing resin layer 3, an internal surface of the hole 20, and the ground wiring 111 (112), and a separation step of separating from each other a plurality of individual module sections which the individual module section comprises.
摘要翻译：为了牢固地研磨外部屏蔽并降低施加在切割刀片和外部屏蔽上的负担，制造半导体模块的方法包括形成从密封树脂层3的顶表面延伸的孔30的孔形成步骤设置在集合基板100上的接地布线111（112），成膜步骤，形成由导电材料制成的导电膜，以至少覆盖密封树脂层3的顶面，内部孔20的表面和接地布线111（112），以及分离步骤，分离各个模块部分所包括的多个单独的模块部分。

4. 发明授权

US08179678B2 Electronic component module 有权
标题翻译：电子元件模块
公开(公告)号：US08179678B2
公开(公告)日：2012-05-15
申请号：US12753436
申请日：2010-04-02
申请人： Mitsuyoshi Yamashita , Yoshihisa Amano , Akiteru Deguchi , Masahiko Kushino , Masahiro Murakami
发明人： Mitsuyoshi Yamashita , Yoshihisa Amano , Akiteru Deguchi , Masahiko Kushino , Masahiro Murakami
IPC分类号： H05K7/20
CPC分类号： H05K1/0243 , H01L23/552 , H01L25/165 , H01L2224/16225 , H01L2224/16227 , H01L2224/73253 , H01L2924/00014 , H01L2924/19105 , H05K1/181 , H05K9/006 , H05K2201/10371 , H05K2201/10522 , H01L2224/0401
摘要： Provided is an electronic component module which has high reliability and is capable of suppressing reduction in handling performance of a mounting machine. An electronic component module includes a plurality of electronic components mounted on a top surface of a module substrate, a planar top plate covering the electronic components, and a top plate holding member for holding the top plate. The plurality of electronic components include a quartz resonator, and a RF-IC which has a height smaller than that of the quartz resonator and is disposed on the top surface of the module substrate so as to be side by side with the quartz resonator. In addition, the top plate is fixed to the quartz resonator, and the top plate holding member for holding the top plate is disposed between the RF-IC and the top plate.
摘要翻译：提供一种电子部件模块，其具有高可靠性并且能够抑制安装机器的操作性能的降低。电子部件模块包括安装在模块基板的上表面上的多个电子部件，覆盖电子部件的平面顶板和用于保持顶板的顶板保持部件。多个电子部件包括石英谐振器和具有比石英谐振器的高度小的RF-IC，并且被布置在模块基板的顶表面上以与石英谐振器并排。此外，顶板固定在石英谐振器上，用于保持顶板的顶板保持构件设置在RF-IC和顶板之间。

5. 发明申请

US20100265663A1 ELECTRONIC COMPONENT MODULE 有权
标题翻译：电子元件模块
公开(公告)号：US20100265663A1
公开(公告)日：2010-10-21
申请号：US12753436
申请日：2010-04-02
申请人： Mitsuyoshi YAMASHITA , Yoshihisa Amano , Akiteru Deguchi , Masahiko Kushino , Masahiro Murakami
发明人： Mitsuyoshi YAMASHITA , Yoshihisa Amano , Akiteru Deguchi , Masahiko Kushino , Masahiro Murakami
IPC分类号： H05K7/20 , H05K7/00
CPC分类号： H05K1/0243 , H01L23/552 , H01L25/165 , H01L2224/16225 , H01L2224/16227 , H01L2224/73253 , H01L2924/00014 , H01L2924/19105 , H05K1/181 , H05K9/006 , H05K2201/10371 , H05K2201/10522 , H01L2224/0401
摘要： Provided is an electronic component module which has high reliability and is capable of suppressing reduction in handling performance of a mounting machine. An electronic component module includes a plurality of electronic components mounted on a top surface of a module substrate, a planar top plate covering the electronic components, and a top plate holding member for holding the top plate. The plurality of electronic components include a quartz resonator, and a RF-IC which has a height smaller than that of the quartz resonator and is disposed on the top surface of the module substrate so as to be side by side with the quartz resonator. In addition, the top plate is fixed to the quartz resonator, and the top plate holding member for holding the top plate is disposed between the RF-IC and the top plate.
摘要翻译：提供一种电子部件模块，其具有高可靠性并且能够抑制安装机器的操作性能的降低。电子部件模块包括安装在模块基板的上表面上的多个电子部件，覆盖电子部件的平面顶板和用于保持顶板的顶板保持部件。多个电子部件包括石英谐振器和具有比石英谐振器的高度小的RF-IC，并且被布置在模块基板的顶表面上以与石英谐振器并排。此外，顶板固定在石英谐振器上，用于保持顶板的顶板保持构件设置在RF-IC和顶板之间。

6. 发明申请

US20100202125A1 SEMICONDUCTOR MODULE 有权
标题翻译：半导体模块
公开(公告)号：US20100202125A1
公开(公告)日：2010-08-12
申请号：US12685306
申请日：2010-01-11
申请人： Masahiro MURAKAMI , Masahiko Kushino , Akiteru Deguchi , Yoshihisa Amano
发明人： Masahiro MURAKAMI , Masahiko Kushino , Akiteru Deguchi , Yoshihisa Amano
IPC分类号： H05K7/00
CPC分类号： H05K1/0271 , H01L25/16 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/19105 , H05K1/144 , H05K1/181 , H05K3/341 , H05K2201/09136 , H05K2201/10204 , H01L2224/0401
摘要： A top panel, which is disposed to face a module board with an electronic component therebetween, includes a resin layer and a metal layer, and has an insulating characteristic. The metal layer includes a metal layer formed at a front side of the resin layer and a metal layer formed at a rear side of the resin layer. With this structure, in reflow soldering performed in mounting a semiconductor module on a main board, warp which is caused, under temperature change, in the top panel due to difference in coefficient of thermal expansion between the resin layer and the metal layer formed at the front side of the resin layer is cancelled by warp which is caused, under temperature change, in the top panel due to difference in coefficient of thermal expansion between the resin layer and the metal layer formed at the rear side of the resin layer, whereby warp of the top panel is eliminated. This helps prevent the electronic component adhered to the top panel with adhesive from being pressed down to or pulled up from the module board due to warp of the top panel.
摘要翻译：面对其间具有电子部件的模块板的顶板包括树脂层和金属层，并且具有绝缘特性。金属层包括在树脂层的前侧形成的金属层和形成在树脂层的后侧的金属层。利用这种结构，在将半导体模块安装在主板上进行的回流焊接中，由于在树脂层和形成在该主板上的金属层之间的热膨胀系数的差异，在顶板中在温度变化时引起的翘曲树脂层的前侧由于在树脂层和形成在树脂层的后侧的金属层之间的热膨胀系数的差异而在顶板中由于温度变化引起的翘曲而消除，由此翘曲的顶板被淘汰。这有助于防止由于顶板的翘曲而使粘合剂附着在顶板上的电子部件被压下或从模块板拉出。

7. 发明授权

US08335086B2 Semiconductor module 有权
标题翻译：半导体模块
公开(公告)号：US08335086B2
公开(公告)日：2012-12-18
申请号：US12685306
申请日：2010-01-11
申请人： Masahiro Murakami , Masahiko Kushino , Akiteru Deguchi , Yoshihisa Amano
发明人： Masahiro Murakami , Masahiko Kushino , Akiteru Deguchi , Yoshihisa Amano
IPC分类号： H05K7/02 , H05K7/06 , H05K7/08 , H05K7/10
CPC分类号： H05K1/0271 , H01L25/16 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/19105 , H05K1/144 , H05K1/181 , H05K3/341 , H05K2201/09136 , H05K2201/10204 , H01L2224/0401
摘要： A top panel, which is disposed to face a module board with an electronic component therebetween, includes a resin layer and a metal layer, and has an insulating characteristic. The metal layer includes a metal layer formed at a front side of the resin layer and a metal layer formed at a rear side of the resin layer. With this structure, in reflow soldering performed in mounting a semiconductor module on a main board, warp which is caused, under temperature change, in the top panel due to difference in coefficient of thermal expansion between the resin layer and the metal layer formed at the front side of the resin layer is cancelled by warp which is caused, under temperature change, in the top panel due to difference in coefficient of thermal expansion between the resin layer and the metal layer formed at the rear side of the resin layer, whereby warp of the top panel is eliminated. This helps prevent the electronic component adhered to the top panel with adhesive from being pressed down to or pulled up from the module board due to warp of the top panel.
摘要翻译：面对其间具有电子部件的模块板的顶板包括树脂层和金属层，并且具有绝缘特性。金属层包括在树脂层的前侧形成的金属层和形成在树脂层的后侧的金属层。利用这种结构，在将半导体模块安装在主板上进行的回流焊接中，由于在树脂层和形成在该主板上的金属层之间的热膨胀系数的差异，在顶板中在温度变化时引起的翘曲树脂层的前侧由于在树脂层和形成在树脂层的后侧的金属层之间的热膨胀系数的差异而在顶板中由于温度变化引起的翘曲而消除，由此翘曲的顶板被淘汰。这有助于防止由于顶板的翘曲而使粘合剂附着在顶板上的电子部件被压下或从模块板拉出。

8. 发明授权

US06538303B1 Lead frame and semiconductor device using the same 有权
标题翻译：引线框和半导体器件使用相同
公开(公告)号：US06538303B1
公开(公告)日：2003-03-25
申请号：US09516157
申请日：2000-02-29
申请人： Masahiko Kushino
发明人： Masahiko Kushino
IPC分类号： H01L23495
CPC分类号： H01L23/4334 , H01L23/49503 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32245 , H01L2224/45144 , H01L2224/4809 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01029 , H01L2924/01039 , H01L2924/01079 , H01L2924/01322 , H01L2924/07802 , H01L2924/14 , H01L2924/1423 , H01L2924/15747 , H01L2924/181 , H01L2924/30107 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： In a semiconductor device, an island penetrating hole, which is larger than a mounted chip, is formed on an island of a lead frame, and a heatsink is mounted on the island so as to cover the island penetrating hole. The chip is disposed on a surface of the heatsink in the island penetrating hole. The ground terminal of the chip and the island are wire-bonded to each other via GND wires. This arrangement makes it possible to reduce a heat resistance in a heat-releasing path, thereby improving a heat-releasing property. Further, the GND wires are shortened and a GND inductance is reduced. Consequently, it is possible to efficiently exert capability of the chip.
摘要翻译：在半导体装置中，在引线框架的岛上形成比安装的芯片大的岛状贯通孔，并且在岛上安装散热器以覆盖岛状贯通孔。芯片设置在岛状贯通孔的散热器的表面上。芯片和岛的接地端子通过GND线彼此引线接合。由此，能够降低散热路径的耐热性，能够提高散热性。此外，GND线被缩短并且GND电感减小。因此，可以有效地发挥芯片的能力。

9. 发明授权

US5142137A Image sensor having clamp connecting sensing and driving components 失效
标题翻译：图像传感器具有夹紧连接检测和驱动部件
公开(公告)号：US5142137A
公开(公告)日：1992-08-25
申请号：US699656
申请日：1991-05-14
申请人： Masahiko Kushino , Hidetoshi Maeda , Noboru Nakajima , Mitsuhiko Yoshikawa , Toshiyuki Sakata
发明人： Masahiko Kushino , Hidetoshi Maeda , Noboru Nakajima , Mitsuhiko Yoshikawa , Toshiyuki Sakata
IPC分类号： H04N1/031
CPC分类号： H04N1/0286 , H04N1/02865 , H04N1/0312 , H04N1/0315 , H04N1/0318 , H04N2201/03112 , H04N2201/03154
摘要： An image sensor includes a light receiving insulating substrate which has a plurality of light receiving elements with one row disposed on one major surface and has a first wiring portion on one side of the major surface for connecting the light receiving elements to a plurality of external driving elements; a driving insulating substrate which has the driving elements mounted on one major surface and has a second wiring portion on one side of the major surface for connecting the driving elements to the light receiving elements; a press-contact connector for electrically connecting the wiring portions, keeping the light receiving insulating substrate and the driving insulating substrate in contact with each other with their respective wiring portions positioned back to back; and engaging means provided close to at least one of the wiring portions in the light receiving insulating substrate and the driving insulating substrate and also provided in the press-contact connector, for enhancing a mechanical holding strength of the press-contact connector to the insulating substrates.
摘要翻译：一种图像传感器包括：光接收绝缘基板，其具有设置在一个主表面上的多个具有一行的光接收元件，并且在主表面的一侧具有用于将光接收元件连接到多个外部驱动的第一布线部分元素驱动绝缘基板，其具有安装在一个主表面上的驱动元件，并且在主表面的一侧上具有用于将驱动元件连接到光接收元件的第二布线部分; 用于电连接所述布线部分的压接触连接器，保持所述光接收绝缘基板和所述驱动绝缘基板彼此接触，并且其各个布线部分背靠背定位; 以及接合装置，其靠近光接收绝缘基板和驱动绝缘基板中的布线部分中的至少一个并且还设置在压接触连接器中，用于提高压接触连接器对绝缘基板的机械保持强度。

10. 发明申请

US20120286415A1 METHOD OF PRODUCING SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE 有权
标题翻译：生产半导体模块和半导体模块的方法
公开(公告)号：US20120286415A1
公开(公告)日：2012-11-15
申请号：US13470029
申请日：2012-05-11
申请人： Takae Sakai , Masahiro Murakami , Masahiko Kushino , Yoshihisa Amano , Shinichi Tokuno
发明人： Takae Sakai , Masahiro Murakami , Masahiko Kushino , Yoshihisa Amano , Shinichi Tokuno
IPC分类号： H01L23/48 , H01L21/56
CPC分类号： H01L23/60 , H01L21/563 , H01L21/78 , H01L23/3121 , H01L23/552 , H01L24/16 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/0655 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01065 , H01L2924/014 , H01L2924/12042 , H01L2924/1421 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H01L2224/81 , H01L2224/85 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In order to securely ground an exterior shield and reduce burden imposed on a dicing blade and the exterior shield, a method of producing a semiconductor module comprises a hole-forming step of forming a hole 30 extending from a top surface of a sealing resin layer 3 to a ground wiring 111 (112) provided at a collective substrate 100, a film-forming step of forming an electrically conductive film made of an electrically conductive material so as to cover at least the top surface of the sealing resin layer 3, an internal surface of the hole 20, and the ground wiring 111 (112), and a separation step of separating from each other a plurality of individual module sections which the individual module section comprises.
摘要翻译：为了牢固地研磨外部屏蔽并降低施加在切割刀片和外部屏蔽上的负担，制造半导体模块的方法包括形成从密封树脂层3的顶表面延伸的孔30的孔形成步骤设置在集合基板100上的接地布线111（112），成膜步骤，形成由导电材料制成的导电膜，以至少覆盖密封树脂层3的顶面，内部孔20的表面和接地布线111（112），以及分离步骤，分离各个模块部分所包括的多个单独的模块部分。

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