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1. 发明申请

US20180047589A1 LEAD CARRIER WITH PRINT FORMED PACKAGE COMPONENTS AND CONDUCTIVE PATH REDISTRIBUTION STRUCTURES 审中-公开
公开(公告)号：US20180047589A1
公开(公告)日：2018-02-15
申请号：US15542075
申请日：2016-05-04
申请人： Philip E ROGREN , EOPLEX LIMITED
发明人： Philip E ROGREN
IPC分类号： H01L21/48 , H01L23/495 , H01L23/498 , H01L21/56
CPC分类号： H01L21/4832 , H01L21/568 , H01L23/3107 , H01L23/49541 , H01L23/49548 , H01L23/49861 , H01L23/49872 , H01L24/45 , H01L24/48 , H01L24/97 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/85207 , H01L2924/00014 , H01L2924/181 , H01L2924/18301 , H01L2924/00012 , H01L2224/05599
摘要： A lead carrier includes a temporary support layer, member, medium, or carrier upon which are dispersed a plurality of package sites, organized in a predetermined pattern such as a matrix or array. Each package site within a continuous sheet of mold compound of the lead carrier includes a semiconductor die; a set of terminal structures, each having a top side and an opposing back side that is exposed at a back side of the continuous sheet of mold compound; and a set of electrical current path redistribution structures, each formed as an elongate wiring structure having a first end, a second end distinct from the first end, a top surface, an opposing bottom surface, a width, and a thickness between its top and bottom surfaces. Each redistribution structure as-fabricated is either electrically pre-coupled to a predetermined terminal structure, or electrically isolated from each terminal structure.

2. 发明申请

US20180034038A1 LEAD CARRIER STRUCTURE AND PACKAGES FORMED THEREFROM WITHOUT DIE ATTACH PADS 审中-公开
公开(公告)号：US20180034038A1
公开(公告)日：2018-02-01
申请号：US15542405
申请日：2016-06-03
申请人： Philip E ROGREN , EOPLEX LIMITED
发明人： Philip E ROGREN
IPC分类号： H01M4/04 , H01M10/0525 , B33Y80/00 , H01M4/74 , H01M4/75 , H01M10/0562 , H01M10/0585
CPC分类号： H01M4/0483 , B33Y80/00 , H01M4/0416 , H01M4/0471 , H01M4/13 , H01M4/74 , H01M4/75 , H01M10/052 , H01M10/0525 , H01M10/0562 , H01M10/0585
摘要： A solid state electrochemical cell structure includes at least one integrated anode—current collector structure having a counterpart integrated cathode—current collector structure separated by an electrolyte layer. An integrated anode or cathode—current collector structure can be fabricated as a generally planar or planar layer structure having a surface area greater or much greater than its thickness, and which carries anode or cathode material composition, respectively, in which a current collector layer is enveloped, embedded, or encased; or a porous 3D mesh current collector structure in which an anode material composition or cathode material composition, respectively is enveloped, embedded, or encased by way of residing within a void volume fraction of the 3D mesh current collector structure. Integrated anode-current collector structures, cathode-current collector structures, and electrolyte layers can be fabricated by way of an additive manufacturing process (e.g., 3D printing).

3. 发明申请

US20130001761A1 LEAD CARRIER WITH THERMALLY FUSED PACKAGE COMPONENTS 审中-公开
公开(公告)号：US20130001761A1
公开(公告)日：2013-01-03
申请号：US13540903
申请日：2012-07-03
申请人： Philip E. Rogren
发明人： Philip E. Rogren
IPC分类号： H01L21/60 , H01L23/495
CPC分类号： H01L21/4828 , H01L21/561 , H01L21/568 , H01L23/3107 , H01L23/49548 , H01L23/49582 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/97 , H01L2224/04042 , H01L2224/32245 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/4866 , H01L2224/48664 , H01L2224/48669 , H01L2224/48684 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/4886 , H01L2224/48864 , H01L2224/48869 , H01L2224/48884 , H01L2224/73265 , H01L2224/85207 , H01L2224/85424 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85455 , H01L2224/8546 , H01L2224/85464 , H01L2224/85469 , H01L2224/85484 , H01L2224/92247 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/30107 , H01L2224/85 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A lead carrier provides support for a semiconductor device during manufacture. The lead carrier includes a temporary support member with multiple package sites. Each package site includes a die attach pad surrounded by a plurality of terminal pads. The pads are formed of a fusible fixing material on a lower portion. A chip is mounted upon the die attach pad and wire bonds extend from the chip to the terminal pads. The pads, chip and wire bonds are all encapsulated within a mold compound. The temporary support member can be heated above a melting temperature of the fusible fixing material and peeled away and then the individual package sites can be isolated from each other to provide completed packages including multiple surface mount joints for mounting within an electronics system board.

4. 发明授权

US5620129A Device and method for forming and attaching an array of conductive balls 失效
标题翻译：用于形成和附接导电球阵列的装置和方法
公开(公告)号：US5620129A
公开(公告)日：1997-04-15
申请号：US390677
申请日：1995-02-17
申请人： Philip E. Rogren
发明人： Philip E. Rogren
IPC分类号： B23K35/02 , B23K35/14 , B23K35/26 , H01L21/48 , H05K3/34
CPC分类号： B23K35/0222 , H01L21/4853 , H05K3/3478 , B23K35/0233 , B23K35/26 , H05K2201/0305 , H05K2201/10424 , H05K2201/10734 , H05K2203/043 , Y10T428/12361
摘要： A method and preform for forming and attaching an array of conductive balls, preferably solder balls, to ball receiving areas on a substrate is disclosed. The preform is a connected array of sub-preforms comprised of the conductive material from which the balls will be formed. The connections between adjacent sub-preforms are designed to assure division of the preform into individual masses, each sufficient to form one conductive ball. Each sub-preform is provided with a bottom protrusion which assures physical and thermal contact between preform and substrate. The method involves placing the preform on the substrate such that each sub-preform is positioned above the conductive ball receiving areas. The preform and substrate are than heated to above the melting point of the conductive material to melt the conductive material and form metallurgical bonds between the conductive material and the receiving areas. Surface tension causes the sub-preforms to separate from one another along discrete fuse zones and form into individual conductive balls. Cooling the assembly to below the melting temperature of the conductive material fixes the configuration and positions of the array of conductive balls on the ball receiving areas of the substrate.
摘要翻译：公开了用于将导电球阵列，优选焊球形成和附接到基底上的球接收区域的方法和预成型件。预成型件是由将由其形成球的导电材料构成的子预型件的连接阵列。相邻子预型件之间的连接被设计成确保将预成型件分成单独的质量，每个质量足以形成一个导电球。每个子预成型件设置有底部突起，其确保预成型件和基底之间的物理和热接触。该方法包括将预成型件放置在基板上，使得每个子预制件位于导电球接收区域的上方。预制件和基底被加热到高于导电材料的熔点以熔化导电材料并在导电材料和接收区域之间形成冶金结合。表面张力导致子预成型件沿着离散的熔合区彼此分离并形成单独的导电球。将组件冷却到低于导电材料的熔化温度，将导电球阵列的配置和位置固定在基板的球接收区域上。

5. 发明申请

US20130037927A1 LEAD CARRIER WITH MULTI-MATERIAL PRINT FORMED PACKAGE COMPONENTS 有权
标题翻译：带有多种打印成型包装组件的导线架
公开(公告)号：US20130037927A1
公开(公告)日：2013-02-14
申请号：US13571687
申请日：2012-08-10
申请人： Philip E. Rogren
发明人： Philip E. Rogren
IPC分类号： H01L23/495 , C25D1/00 , H01L21/64
CPC分类号： H01L23/49541 , H01L21/4828 , H01L21/4832 , H01L21/568 , H01L23/3107 , H01L23/49548 , H01L23/49579 , H01L23/49582 , H01L24/97 , H01L2224/05553 , H01L2224/45144 , H01L2224/45147 , H01L2224/48247 , H01L2224/97 , H01L2924/01015 , H01L2924/01029 , H01L2924/01047 , H01L2924/181 , H01L2924/18301 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A lead carrier provides support for a semiconductor device during manufacture. The lead carrier includes a temporary support member with multiple package sites. Each site includes a die attach pad surrounded by terminal pads. The pads are formed of multiple materials including a lower layer and a body portion. An upper layer can also be provided over the body portion. A chip is mounted upon the die pad and wire bonds extend from the chip to the terminal pads. These parts are all encapsulated within a mold compound. The body portion is preferably formed by providing a matrix of metal powder and a suspension medium at locations where the pads are to be located. Heat is applied to disperse the suspension medium and sinter the metal powder to form the body portion. After encapsulation the temporary support member can be peeled away and the package sites isolated from each other.
摘要翻译：引线载体在制造期间为半导体器件提供支持。引线架包括具有多个封装位置的临时支撑构件。每个站点都包括一个由端子焊盘包围的管芯连接焊盘。垫片由包括下层和主体部分的多种材料形成。也可以在身体部分上方设置上层。芯片安装在芯片焊盘上，引线键合从芯片延伸到端子焊盘。这些部件都被封装在模具化合物中。身体部分优选通过在垫位于的位置处提供金属粉末和悬浮介质的基体而形成。施加热量以分散悬浮介质并烧结金属粉末以形成主体部分。在封装之后，临时支撑构件可以被剥离并且包装位置彼此隔离。

6. 发明授权

US5625228A High performance semiconductor package with area array leads 失效
标题翻译：具有面阵列引线的高性能半导体封装
公开(公告)号：US5625228A
公开(公告)日：1997-04-29
申请号：US395385
申请日：1995-02-27
申请人： Philip E. Rogren
发明人： Philip E. Rogren
IPC分类号： H01L23/055 , H01L23/367 , H01L23/498 , H01L23/34 , H05K7/20
CPC分类号： H01L23/055 , H01L23/3675 , H01L23/49811 , H01L23/49816 , H01L24/49 , H01L2224/32188 , H01L2224/48091 , H01L2224/48465 , H01L2224/49109 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/15153 , H01L2924/1517 , H01L2924/15312 , H01L2924/1532 , H01L2924/30107 , H01L2924/3011
摘要： A package for high performance semiconductor devices is disclosed. The package has area array leads which can be pins, solder balls, or conductive pads. The package provides increased electrical and thermal performance at a cost that is less than that of previous technology. The packages is comprised of a printed wiring board type substrate to provide multilayer electrical connections and a thermally conductive case that encloses the top surface and the edges of the wiring substrate. The semiconductor device can be mounted directly on the thermally conductive case and connected to the substrate by any of the common methods for making first level interconnections. In the preferred embodiment, the case is comprised of copper or a copper alloy that is treated to enhance appearance and to prevent oxidation of the surface of the case. In addition to enhancing the thermal properties of the package, the copper case can also serve as a very low noise ground plane. The forged metal case with integral design features and appropriate surface finishes significantly enhance the appearance and perceived value of the package.
摘要翻译：公开了一种用于高性能半导体器件的封装。该封装具有可以是引脚，焊球或导电焊盘的面阵列引线。该封装以比以前的技术更低的成本提供更高的电气和热性能。封装由印刷线路板型基板构成，以提供多层电连接，以及封装布线基板的顶表面和边缘的导热外壳。半导体器件可以直接安装在导热壳体上，并通过用于制造一级互连的常用方法连接到衬底。在优选实施例中，壳体由铜或铜合金组成，其被处理以增强外观和防止壳体表面的氧化。除了提高封装的热性能外，铜壳还可以作为非常低的噪声接地层。具有整体设计特点和适当表面光洁度的锻造金属外壳显着增强了包装的外观和感知价值。

7. 发明授权

US08749035B2 Lead carrier with multi-material print formed package components 有权
标题翻译：导线架采用多材料打印成型包装件
公开(公告)号：US08749035B2
公开(公告)日：2014-06-10
申请号：US13571687
申请日：2012-08-10
申请人： Philip E. Rogren
发明人： Philip E. Rogren
IPC分类号： H01L23/495
CPC分类号： H01L23/49541 , H01L21/4828 , H01L21/4832 , H01L21/568 , H01L23/3107 , H01L23/49548 , H01L23/49579 , H01L23/49582 , H01L24/97 , H01L2224/05553 , H01L2224/45144 , H01L2224/45147 , H01L2224/48247 , H01L2224/97 , H01L2924/01015 , H01L2924/01029 , H01L2924/01047 , H01L2924/181 , H01L2924/18301 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A lead carrier provides support for a semiconductor device during manufacture. The lead carrier includes a temporary support member with multiple package sites. Each site includes a die attach pad surrounded by terminal pads. The pads are formed of multiple materials including a lower layer and a body portion. An upper layer can also be provided over the body portion. A chip is mounted upon the die pad and wire bonds extend from the chip to the terminal pads. These parts are all encapsulated within a mold compound. The body portion is preferably formed by providing a matrix of metal powder and a suspension medium at locations where the pads are to be located. Heat is applied to disperse the suspension medium and sinter the metal powder to form the body portion. After encapsulation the temporary support member can be peeled away and the package sites isolated from each other.
摘要翻译：引线载体在制造期间为半导体器件提供支持。引线架包括具有多个封装位置的临时支撑构件。每个站点都包括一个由端子焊盘包围的管芯连接焊盘。垫片由包括下层和主体部分的多种材料形成。也可以在身体部分上方设置上层。芯片安装在芯片焊盘上，引线键合从芯片延伸到端子焊盘。这些部件都被封装在模具化合物中。身体部分优选通过在垫位于的位置处提供金属粉末和悬浮介质的基体而形成。施加热量以分散悬浮介质并烧结金属粉末以形成主体部分。在封装之后，临时支撑构件可以被剥离并且包装位置彼此隔离。

8. 发明授权

US08525305B1 Lead carrier with print-formed package components 有权
标题翻译：带有印刷成型包装组件的导线架
公开(公告)号：US08525305B1
公开(公告)日：2013-09-03
申请号：US13135210
申请日：2011-06-28
申请人： Philip E. Rogren
发明人： Philip E. Rogren
IPC分类号： H01L23/495
CPC分类号： H01L24/96 , H01L21/4821 , H01L21/568 , H01L23/49541 , H01L24/97 , H01L2224/05553 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A lead carrier provides support for an integrated circuit chip and associated leads during manufacture as packages containing such chips. The lead carrier includes a temporary support member with multiple package sites. Each package site includes a die attach pad surrounded by a plurality of terminal pads. The pads are formed of a sintered electrically conductive material. A chip is mounted upon the die attach pad and wire bonds extend from the chip to the terminal pads. The pads, chip and wire bonds are all encapsulated within a mold compound. The temporary support member can be peeled away and then the individual package sites can be isolated from each other to provide completed packages including multiple surface mount joints for mounting within an electronics system board. Edges of the pads are contoured to cause the pads to engage with the mold compound to securely hold the pads within the package.
摘要翻译：引线载体在制造期间为集成电路芯片和相关引线提供支持，作为包含这种芯片的封装。引线架包括具有多个封装位置的临时支撑构件。每个包装部位包括由多个端子焊盘包围的管芯附接焊盘。焊盘由烧结的导电材料形成。芯片安装在管芯附着垫上，引线接合从芯片延伸到端子焊盘。焊盘，芯片和引线键都被封装在模具化合物中。临时支撑构件可以被剥离，然后各个包装位置可以彼此隔离以提供完整的包装，包括用于安装在电子系统板内的多个表面安装接头。衬垫的边缘的轮廓是使衬垫与模具化合物接合以将衬垫牢固地保持在包装内。

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