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1. 发明申请

US20130285545A1 THERMAL MANAGEMENT FOR LIGHT-EMITTING DIODES 有权
标题翻译：用于发光二极管的热管理
公开(公告)号：US20130285545A1
公开(公告)日：2013-10-31
申请号：US13977400
申请日：2011-12-21
申请人： Ketan R. Shah , Sean M. Halton
发明人： Ketan R. Shah , Sean M. Halton
IPC分类号： F21V29/00
CPC分类号： F21V29/506 , F21K9/135 , F21K9/232 , F21V3/02 , F21V3/0418 , F21V3/0436 , F21V3/061 , F21V3/062 , F21V29/70 , F21V29/71 , F21V29/74 , F21V29/745 , F21V29/77 , F21V29/773 , F21V29/78 , F21V29/83 , F21V29/85 , F21V29/87 , F21V29/89 , F21Y2101/00 , F21Y2101/02 , F21Y2115/10 , H01L33/642 , H01L2924/00 , H01L2924/0002
摘要： Embodiments of the invention provide lighting systems that employ light-emitting diode (LED) chips as active lighting elements. Heat management components for the LED chips employed in the lighting sources are provided. In embodiments of the invention, LED chips are cooled by one or more heatspreaders and heat sinks attached to a substrate that houses the LED chip and/or the topside of the LED chip.
摘要翻译：本发明的实施例提供采用发光二极管（LED）芯片作为有源照明元件的照明系统。提供了用于照明源的LED芯片的热管理组件。在本发明的实施例中，LED芯片由附接到容纳LED芯片和/或LED芯片的顶侧的基板的一个或多个散热器和散热器来冷却。

2. 发明申请

US20120216029A1 METHOD, APPARATUS, AND SYSTEM FOR ENERGY EFFICIENCY AND ENERGY CONSERVATION INCLUDING CONFIGURABLE MAXIMUM PROCESSOR CURRENT 有权
标题翻译：用于能源效率和能源保护的方法，装置和系统，包括可配置的最大处理器电流
公开(公告)号：US20120216029A1
公开(公告)日：2012-08-23
申请号：US13326105
申请日：2011-12-14
申请人： Ketan R. Shah , Eric Distefano , Stephen H. Gunther , Jeremy J. Shrall
发明人： Ketan R. Shah , Eric Distefano , Stephen H. Gunther , Jeremy J. Shrall
IPC分类号： G06F9/00 , G06F1/26
CPC分类号： G06F1/3243 , G06F1/3206 , G06F1/324 , G06F9/4401 , G06F9/4411 , G06F9/455 , Y02D10/126 , Y02D10/152 , Y02D50/20
摘要： An apparatus, method and system is described herein for providing multiple maximum current configuration options including corresponding turbo frequencies for a processing device. Available options for a processor are determined by initialization code. And based on platform electrical capabilities, an optimal one of the multiple current configuration options is selected. Moreover, during runtime another current configuration is dynamically selected based on current configuration considerations to provide high flexibility and best possible performance per part and computing platform.
摘要翻译：本文描述了一种用于提供多个最大电流配置选项的装置，方法和系统，包括用于处理设备的对应的turbo频率。处理器的可用选项由初始化代码确定。并且基于平台电气功能，选择多个当前配置选项中的最佳一个。此外，在运行期间，基于当前配置注意事项动态地选择当前配置，以提供每个部件和计算平台的高灵活性和最佳性能。

3. 发明授权

US07188418B2 Method of making split fin heat sink 有权
标题翻译：制作散热片散热片的方法
公开(公告)号：US07188418B2
公开(公告)日：2007-03-13
申请号：US10701582
申请日：2003-11-05
申请人： Ketan R. Shah
发明人： Ketan R. Shah
IPC分类号： B21D53/02 , B21D53/06
CPC分类号： H01L23/467 , B21C23/10 , F28F2215/10 , H01L23/3672 , H01L2924/0002 , Y10T29/4935 , Y10T29/49378 , Y10T29/49385 , H01L2924/00
摘要： A heat sink for dissipating heat from an electronic component includes a core and a plurality of fins extending outwardly from the core. The fins may be at least partially curved. Each fin may split into a plurality of tines that extend away from the core.
摘要翻译：用于散发来自电子部件的热量的散热器包括芯部和从芯部向外延伸的多个翅片。翅片可以至少部分弯曲。每个翅片可以分成多个从芯部延伸出来的尖齿。

4. 发明授权

US09052901B2 Method, apparatus, and system for energy efficiency and energy conservation including configurable maximum processor current 有权
标题翻译：能量效率和节能的方法，装置和系统，包括可配置的最大处理器电流
公开(公告)号：US09052901B2
公开(公告)日：2015-06-09
申请号：US13326105
申请日：2011-12-14
申请人： Ketan R. Shah , Eric Distefano , Stephen H. Gunther , Jeremy J. Shrall
发明人： Ketan R. Shah , Eric Distefano , Stephen H. Gunther , Jeremy J. Shrall
IPC分类号： G06F1/32 , G06F9/44 , G06F9/455
CPC分类号： G06F1/3243 , G06F1/3206 , G06F1/324 , G06F9/4401 , G06F9/4411 , G06F9/455 , Y02D10/126 , Y02D10/152 , Y02D50/20
摘要： An apparatus, method and system is described herein for providing multiple maximum current configuration options including corresponding turbo frequencies for a processing device. Available options for a processor are determined by initialization code. And based on platform electrical capabilities, an optimal one of the multiple current configuration options is selected. Moreover, during runtime another current configuration is dynamically selected based on current configuration considerations to provide high flexibility and best possible performance per part and computing platform.
摘要翻译：本文描述了一种用于提供多个最大电流配置选项的装置，方法和系统，包括用于处理设备的对应的turbo频率。处理器的可用选项由初始化代码确定。并且基于平台电气功能，选择多个当前配置选项中的最佳一个。此外，在运行期间，基于当前配置注意事项动态地选择当前配置，以提供每个部件和计算平台的高灵活性和最佳性能。

5. 发明申请

US20130007440A1 METHOD AND APPARATUS FOR CONFIGURABLE THERMAL MANAGEMENT 有权
公开(公告)号：US20130007440A1
公开(公告)日：2013-01-03
申请号：US13175081
申请日：2011-07-01
申请人： Ketan R. Shah , Tawfik M. Rahal-Arabi , Eric Distefano , James G. Hermerding, II
发明人： Ketan R. Shah , Tawfik M. Rahal-Arabi , Eric Distefano , James G. Hermerding, II
IPC分类号： G06F9/06
CPC分类号： G06F1/206 , G06F1/26 , G06F1/3203 , Y02D10/16
摘要： Embodiments of an apparatus, system and method are described for configurable processor thermal management. An apparatus may comprise, for example, a processor arranged to operate in a plurality of thermal modes comprising a thermal limit down mode, a normal thermal limit mode and a thermal limit up mode, and thermal management logic operative to select a thermal mode based on one or more properties of the apparatus. Other embodiments are described and claimed.

6. 发明授权

US07677052B2 Systems for improved passive liquid cooling 有权
标题翻译：改进被动液体冷却系统
公开(公告)号：US07677052B2
公开(公告)日：2010-03-16
申请号：US11091267
申请日：2005-03-28
申请人： Ketan R. Shah , Russell S. Aoki
发明人： Ketan R. Shah , Russell S. Aoki
IPC分类号： F25D23/12
CPC分类号： H01L23/427 , F28D15/02 , F28D15/0266 , F28F3/048 , F28F13/187 , H01L2924/0002 , H01L2924/00
摘要： According to some embodiments, systems for improved passive liquid cooling may be provided. In some embodiments, a system may comprise an evaporator and a condenser. According to some embodiments, the evaporator may comprise a first side to receive heat, a second side, and one or more fins protruding from the second side. In some embodiments, the condenser may comprise an inner surface defining a cavity and one or more grooves, a first end coupled to the evaporator such that the one or more fins of the evaporator are disposed within the cavity, and a second end, wherein the one or more grooves extend at least partially between the first and second ends of the condenser.
摘要翻译：根据一些实施例，可以提供用于改进被动液体冷却的系统。在一些实施例中，系统可以包括蒸发器和冷凝器。根据一些实施例，蒸发器可以包括接收热量的第一侧，第二侧和从第二侧突出的一个或多个翅片。在一些实施例中，冷凝器可以包括限定空腔和一个或多个凹槽的内表面，联接到蒸发器的第一端使得蒸发器的一个或多个翅片设置在空腔内，以及第二端，其中一个或多个凹槽至少部分地在冷凝器的第一和第二端之间延伸。

7. 发明授权

US06714415B1 Split fin heat sink 有权
标题翻译：分散散热片散热片
公开(公告)号：US06714415B1
公开(公告)日：2004-03-30
申请号：US10388153
申请日：2003-03-13
申请人： Ketan R. Shah
发明人： Ketan R. Shah
IPC分类号： H05K720
CPC分类号： H01L23/467 , B21C23/10 , F28F2215/10 , H01L23/3672 , H01L2924/0002 , Y10T29/4935 , Y10T29/49378 , Y10T29/49385 , H01L2924/00
摘要： A heat sink for dissipating heat from an electronic component includes a core and a plurality of fins extending outwardly from the core. The fins may be at least partially curved. Each fin may split into a plurality of tines that extend away from the core.
摘要翻译：用于散发来自电子部件的热量的散热器包括芯部和从芯部向外延伸的多个翅片。翅片可以至少部分弯曲。每个翅片可以分成多个从芯部延伸出来的尖齿。

8. 外观设计

USD455951S1 Clip for attaching heatsinks 失效
标题翻译：夹子用于连接散热器
公开(公告)号：USD455951S1
公开(公告)日：2002-04-23
申请号：US29124093
申请日：2000-05-31
申请人： Kazimierz L. Kozyra , Ketan R. Shah
设计人： Kazimierz L. Kozyra , Ketan R. Shah

9. 发明授权

US09657931B2 Thermal management for light-emitting diodes 有权
公开(公告)号：US09657931B2
公开(公告)日：2017-05-23
申请号：US13977400
申请日：2011-12-21
申请人： Ketan R. Shah , Sean M. Halton
发明人： Ketan R. Shah , Sean M. Halton
IPC分类号： F21V29/00 , B60Q1/06 , F21V29/506 , F21V29/85 , F21V29/74 , H01L33/64 , F21V3/02 , F21V29/71 , F21V29/77 , F21V29/78 , F21K9/232 , F21V3/04 , F21V29/83 , F21V29/87 , F21V29/89 , F21Y101/00
CPC分类号： F21V29/506 , F21K9/135 , F21K9/232 , F21V3/02 , F21V3/0418 , F21V3/0436 , F21V3/061 , F21V3/062 , F21V29/70 , F21V29/71 , F21V29/74 , F21V29/745 , F21V29/77 , F21V29/773 , F21V29/78 , F21V29/83 , F21V29/85 , F21V29/87 , F21V29/89 , F21Y2101/00 , F21Y2101/02 , F21Y2115/10 , H01L33/642 , H01L2924/00 , H01L2924/0002
摘要： Embodiments of the invention provide lighting systems that employ light-emitting diode (LED) chips as active lighting elements. Heat management components for the LED chips employed in the lighting sources are provided. In embodiments of the invention, LED chips are cooled by one or more heatspreaders and heat sinks attached to a substrate that houses the LED chip and/or the topside of the LED chip.

10. 发明授权

US08943336B2 Method and apparatus for configurable thermal management 有权
标题翻译：用于可配置热管理的方法和装置
公开(公告)号：US08943336B2
公开(公告)日：2015-01-27
申请号：US13175081
申请日：2011-07-01
申请人： Ketan R. Shah , Tawfik M. Rahal-Arabi , Eric Distefano , James G. Hermerding, II
发明人： Ketan R. Shah , Tawfik M. Rahal-Arabi , Eric Distefano , James G. Hermerding, II
IPC分类号： G06F1/00 , G06F1/26 , G06F1/20
CPC分类号： G06F1/206 , G06F1/26 , G06F1/3203 , Y02D10/16
摘要： Embodiments of an apparatus, system and method are described for configurable processor thermal management. An apparatus may comprise, for example, a processor arranged to operate in a plurality of thermal modes comprising a thermal limit down mode, a normal thermal limit mode and a thermal limit up mode, and thermal management logic operative to select a thermal mode based on one or more properties of the apparatus. Other embodiments are described and claimed.
摘要翻译：描述了可配置的处理器热管理的装置，系统和方法的实施例。例如，设备可以包括处理器，其被布置成以包括热限制模式，正常热限制模式和热限制模式的多个热模式操作，以及热管理逻辑，其可操作以基于设备的一个或多个属性。描述和要求保护其他实施例。

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